M422041 五、新型說明： 【新型所屬之技術領域】 本新型是涉及一種高功率輕量化發光二極體燈泡。 【先前技術】 百年來地球暖化所造成的氣候變化，已對全球自然生態和 社會經濟帶來顯著的不利影響，未來的氣候變化更會對全球造 成深遠與巨大的傷害。M422041 V. New description: [New technical field] The present invention relates to a high-power lightweight light-emitting diode bulb. [Prior Art] The climate change caused by global warming in the past 100 years has had a significant adverse impact on the global natural ecology and social economy. Future climate change will cause far-reaching and enormous damage to the world.
因此，人類必須即刻採取各項改善氣候變化的措施，降低 對地球的不利影響。 為解決日益嚴重的地球暖化問題，限制二氧化碳等溫室氣 體，放’疋當知國際社會共同努力的目標，聯合國在1992年通 過f候變化綱要公約，討論如何解決這個問題，並於MW年通 過厅、都議定書，訂出對各國二氧化碳的減量要求辨程，身為 的成員，在共同但有差異性責任下，各國有必要規劃 办貫，各種防止地球暖化的因應措施，加強氣候變化的相關研 ί展二g界勵行節約能源’促進經濟發展，為全球的永續 發光ίί生trr泡是藉_部的朗，在導電後發熱 用上的壽命較^ 缺點為耗電並且燈絲容易燒壞，造成使 易產ίί碑傳、純日光燈則因其燈管内含有汞金屬，在廢杳時客 備著實有很大的改間Therefore, human beings must immediately take measures to improve climate change and reduce the adverse impact on the earth. In order to solve the increasingly serious problem of global warming, limit greenhouse gases such as carbon dioxide, and let us know the goal of the joint efforts of the international community, the United Nations adopted the Outline Convention on Change in 1992 to discuss how to solve this problem and pass it in MW. The Protocol of the Department of the People's Republic of China and the Protocol of the People's Republic of China, setting out the requirements for the reduction of carbon dioxide emissions in various countries, as members of the community, under common but differentiated responsibilities, it is necessary for countries to plan for the implementation of various measures to prevent global warming and to strengthen climate change. Related research and development, two g circles, encourage energy conservation, promote economic development, and achieve global sustainable light. ίί生trr bubble is borrowed from the _ part of the lang, the life of the heat after conduction is better than the shortcoming is power consumption and filament is easy Burnt out, resulting in easy production of ίί monument, pure fluorescent lamp because of the mercury metal contained in the lamp, in the demolition of the customer is really a big change
0 '' S 3 然而，近年來發展逐漸成熟的發光二極體(Light_；Emitting Diode，LED)，其特色為耗電量小、使用壽命較長，且1 上較不易汙染環境。 ~ 除此之外，體積也較習知燈具小，所以能有效解決傳統照 明設備的問題’因此以發光二極體照明取代傳統燈泡的方式也 就因應而生，並逐漸成為照明裝置的主流。 但疋’傳統發光二極體燈所發出的亮度’ 一般都較傳統照 明設備來的低’而目前改善的方法為，改用高功率發光二極體 燈。 而一般高功率發光二極體燈缺點為：在長時間的使用卞， 發光一極體本身的溫度會大幅提升，而過高的溫度，將會導致 發光二極體燈的發光亮度大打折扣，因此為了達到最佳的使用 效率，便需要將發光二極體過高的熱量，逸散出去。 而為了將發光二極體所產生的熱量，逸散至外界，市面上 諸多採用銅、鋁、銅鋁合金、或是陶瓷為主要基材之鰭片式散 熱模組，但是此種散熱模組的效率一般偏低、散熱效果相當有 限，又因有散熱慢問題，因此容易造成燈具内的溫度過高之問 題，因為該等散熱片過度的集中，導致熱交換速度的低下，在 散熱上的表現並不如預期，所以還是容易使發光二極體的特性 變壞，使得發光二極體的亮度衰減，也就是「光衰」，此項問 題一直是傳統高功率發光二極體燈的推廣上不利的因素。 而另一個影響傳統高功率發光二極體燈推廣的因素，就是 散熱模組的設置成本，因為散熱需求，金屬材質的大量應用， 導致傳統向功率發光二極體燈的價格居高不下，進而影響到消 費者購置的意願。 有鑑於此，如何提供一能在避免發光二極體過熱的前提 I，將金屬部件減少，保持低成本，讓消費者願意應用的發光 二極體燈泡，便成為本新型欲改進的目的。 【新型内容】 一、本新型的技術手段： 本新型目的在於提供一種低成本、金屬部件少、並能避免 發光二極體過熱的高功率輕量化發光二極體燈泡。 為解決前述問題及達到本新型的目的，本新型的技術手 段’為一種高功率輕量化發光二極體燈泡，其特徵在於： 該發光二極體燈泡(100)，其是由一頂端設有一上燈座部 (1)、底端設有一下燈座部(2)、能通風的塑製燈座(1〇广 一設於該上燈座部(1)頂端的燈罩(3); 一設於該下燈座部(2)底端處外的燈頭(4); 一設於該上燈座部(1)與下燈座部(2)之間的分隔板(5); 一設於該分隔板⑶底端處、位於該塑製燈座(10)内，至少 包括一電路迴路(61)，並與該燈頭(4)電性連接的驅動電路板 ⑹；以及 一0又於該上燈座部⑴與燈罩⑶之間，且中央具有一孔洞 (71) ’並透過該孔洞(71)與該驅動電路板⑹做電性連 基板(7)所組成； 所述上燈座部(1)的壁面處、環狀開設有數個能供通風用 ，上通風孔(11) ’而下燈座部(2)的壁面處、亦環狀開設有數個 能供通風用的下通風孔(21); 而所述發光基板(7)，其頂側表面處建構有一能鱼 電路板⑹電性連接的電路(72)，並且焊接有至少：與^ (72) 電性連接的發光二極體(73); 一以 Μ發光基板(7)_表面處’凸設有—散熱鰭片 該散_片組(74)由中心至外侧處、為呈由低至高狀而設 根據上述的高功率輕量化發光二極體燈泡，所 ⑺’其是由一以非金屬材質所製成、能供該電路(72)和發^二 極體(73)設置用的散熱基板部po);及 一设於該散熱基板部(20)之底側端面處，以非金屬材質所 製成、能供該散熱鰭片組(74)設置用的散熱部(3〇)所組成。 根據上述的高功率輕量化發光二極體燈泡，所述發光基板 (7)，其是由一非金屬材質所製成、能供該電路(72)和發光二極 體(73)設置用的散熱基板部(2〇); 一設於該散熱基板部(2〇)之底側端面處，以金屬材質所製 成、能供該散熱鰭片組(74)設置用的散熱部(3〇);及 一設於該散熱基板部(20)和散熱部(3〇)之間，頂端與該散 熱基板部(20)固接、底端與該散熱部(30)相接，以金屬材質所 製成的均熱導板(40)所組成。 根據上述的高功率輕量化發光二極體燈泡，所述散熱鰭片 組(74)，其是由數片下列之一或其組合所組成：柱狀散熱鰭片 (741)、散熱鰭片（742)。 根據上述的高功率輕量化發光二極體燈泡，所述分隔板 (5) ’其中央處’還設有一支一端能穿過該孔洞(71)、能供發光 基板(7)定位用、呈中空狀的支柱(51); 而前述支柱(51)的自由端處、設有一中空凸塊(52)，該中 空凸塊(52)的兩侧、還分別設有一開槽(521)。 根據上述的高功率輕量化發光二極體燈泡，所述分隔板 (5)的表面’還開設有數個能供通風用的孔洞(53)。 根據上述的高功率輕量化發光二極體燈泡，所述下通風孔 (21) ’其為呈垂直狀設置； 而前述下通風孔(21)與該上通風孔(11)之間，更能增加環 設數中間通風孔; 而所述燈頭(4)，其是為下列之一：螺口式燈頭(41):直 插式燈頭(42)、卡口式燈頭(43)。 根據上述的高功率輕量化發光二極體燈泡，所述上燈座部 (1)與燈罩(3)、發光基板(7)的連接處，還依序往下、呈階梯狀 設置有一能供定位燈罩(3)的第一環槽(12)、及一能供定位發光 基板(7)的第二環槽(13); 而所述燈罩(3)與上燈座部(1)的連接處、還設有一呈階梯 狀設置的定位凸榫(31)，且該定位凸榫(31)的寬度、大於前述 第一環槽(12)的底面寬度。 根據上述的高功率輕量化發光二極體燈泡，所述塑製燈座 (10)内、對應於該驅動電路板⑹處，還設有至少一個以上能供 定位驅動電路板⑹用的卡扣塊(14);及 至少一個以上能供抵頂驅動電路板(6)用的頂塊(15)。 根據上述的高功率輕量化發光二極體燈泡，所述電路(72) 電性連接於該發光二極體(73)處，分別對應設有一工形定位區 (721)； 而所述發光一極體(73)處’其底面對應於前述工形定位區 (72i)處，還設有一工形散熱區(731)。 二、對照先前技術之功效： 1. 本新型中，藉由此種發光基板(7)與散熱鰭片組(74)的配 合應用’讓頂側表面處的發光二極體(73)，其接面溫度[juncti〇n Temperature]能快速的降低，讓發光二極體(73)能在長時間運作 之後，依舊可以保持原有的亮度。 2. 本新型中，藉由散熱鰭片組(74)由中心至外側處，為呈 由低至高狀的設置形式，讓發光基板(7)的散熱效果最佳化， 能由内往外擴散’讓熱量能快速導出’遠離發光二極體(73)的 所在位置。 3. 本新型中’發光基板(7)的部分’藉由散熱基板部(2〇)和 散熱部(30)的配合，或是散熱基板部(20)、散熱部(3〇)及均熱導 板(40)的配合’直接且快速的將熱導出，讓發光基板⑺能有別 於傳統發光二極體燈泡’以燈座進行散熱的方式，所以能配合 塑製燈座(100)來應用，讓本新型在更輕量化、成本更低的同 時，仍舊能配合高功率的發光二極體(73)來應用。 4. 本新型中，當以支柱(51)的應用，能達到隱藏驅動電路 板(6)與發光基板(7)做電性連接時，所裸露出來的電線之效 果’讓本新型發光二極體燈泡(100)更美觀。 5. 本新型中，透過不同種類之發光基板(7)的應用，讓本新 型發光一極體燈泡(100)能配合不同的發光二極體(73)來應 用’藉此擴展本新型的應用範圍。 6. 本新型中，藉由不同種類之燈頭(4)的應用，讓本新型發 光二極體燈泡(100)的應用範圍，可以越來越廣。 7·本新型中’藉由第一每槽(12)和第二環槽(13)的配合，讓 燈罩(3)及發光基板(7)能定位更穩固，同時達成輕量化的目 標，並且讓本新型發光二極體燈泡(100)模起來不會燙手，能 安心使用。 【實施方式】 以下依據圖面所示的實施例詳細說明如後： 如圖1所示為本新型配合第一種發光基板時的立體示意 圖，如圖2所示為本新型配合第一種發光基板時的立體分解乔 意圖，如圖10、圖11所示為本新型配合第一種發光基板和另種 燈頭應用時的立體示意圖。 圖式中揭示出，為一種高功率輕量化發光二極體燈泡，其 特徵在於： 該發光二極體燈泡(100)，其是由一頂端設有一上燈座部 (1)、底端設有一下燈座部(2)、能通風的塑製燈座(10); 一設於該上燈座部(1)頂端的燈罩(3); 一設於該下燈座部(2)底端處外的燈頭(4); 一設於該上燈座部(1)與下燈座部(2)之間的分隔板(5); 一設於該分隔板(5)底端處、位於該塑製燈座(1〇)内，至少 包括一電路迴路(61)，並與該燈頭(4)電性連接的驅動電路板 ⑹；以及 一設於該上燈座部⑴與燈罩⑶之間，且中央具有一孔洞 (71) ’並透過該孔洞(71)與該驅動電路板⑹做電性連接的發光 基板(7)所組成； 所述上燈座部(1)的壁面處、環狀開設有數個能供通風用 的上通風孔(11)，而下燈座部(2)的壁面處 '亦環狀開設有數個 能供通風用的下通風孔(21); 而所述發光基板(7)，其頂侧表面處建構有一能與該驅動 電路板(6)電性連接的電路(72)，並且焊接有至少一與該電路 (72) 電性連接的發光二極體(73); 、則述發光基板(7)底側表面處，凸設有一散熱,鰭片組(74)， 並該散熱鰭片組(74)由中心至外側處、為呈由低至高狀而設 置。 其中’透過塑製燈座(10)、燈罩⑶、燈頭⑷、分隔板(5)、 驅動電路板(6)以及發光基板(7)的配合組成一發光二極體燈泡 (1〇〇)，能方便消費者拿取使用，不會有因為燈座燙手，而無 法拿取的狀況產生，並透過塑製燈座(10)與發光基板(7)的應 用，同時達到輕量化的效果，有別於傳統發光二極體燈泡。 其次，利用分隔板(5)，將驅動電路板(6)與發光基板(7)分 開，因為驅動電路板(6)於運作時，也會產生熱量，但是驅動 電路板(6)的耐熱溫度較高，而發光二極體(73)的耐熱溫度較 低，如果不分開，驅動電路板(6)所產生的熱量，就會集中在 内部，讓熱量影響到發光二極體(73)，產生光衰的問題，因此 透過分隔板(5)的應用’避免兩者所產生的熱量，混雜在一起， 過於集中，讓整個發光二極體燈泡(1〇〇)的溫度無法下降，造 成故障率高的問題。 再者，透過上燈座部(1)的上通風孔(11)，與下燈座部 M422041 處的下通風孔(21)之配合應用，讓空氣能自然對流，能讓風由 上通風孔(11)處，進入上燈座部(1)内，以將發光基板⑺所產生 的熱量帶走’有效的降低發光基板(7)的溫度，再透過下燈座 部(2)處的下通風孔(21) ’流至外界，同時將驅動電路板⑹於運 作時產生的熱量帶走，有效的降低驅動電路板(6)的溫度。 再其次，位於發光基板(7)底侧面的散熱鰭片組(μ)，能將 熱量快速導出’讓頂側表面處的發光二極體(73)，其接面溫度 [JunctionTemperature]能快速的降低，讓發光二極體(73)能在長 時間運作之後’依舊可以保持原有的亮度。 還有，散熱鰭片組(74)的設置，能讓發光二極體(73)處的 熱量，不斷以幅射的方式，傳導至發光基板(7)的周緣，有效 的散熱，並且由低至高狀而設置的散熱鰭片組(74)，其外側的 吸熱效率，高於内侧的吸熱效率，透過熱力學第二定律「熱會 由咼溫處往低溫處移動」的應用，能更有助於熱量的外移。 再其次，發光基板(7)的應用，不但能讓本新型發光二極 體燈泡(100)，獲得更好的散熱效果，並且在同等散熱效果的 前提下，相較於的發光二極體燈泡，重量更低、更輕量化、成 本低之外’能更加的安全、财用。 上述中，所述下通風孔(21)，其為呈垂直狀設置； 而前述下通風孔(21)與該上通風孔(11)之間，更能增加 設數中間通風孔(21); 而所述燈頭(4)，其是為下列之一：螺口式燈頭(41)、直 插式燈頭(42)、卡口式燈頭(43)。 其中，當前述流向驅動電路板(6)方向的空氣，流過驅動 電路板(2後’便能透過下通風孔(21)，導出至外界。 其次，因為一般發光二極體燈泡(1〇〇)的安裝方式，大多 是以燈罩⑶朝下、燈頭(仙上的方式安裝，所_直設置的 下通風孔(21) ’能形成如同煙自—般的效果，讓熱空氣上昇排 10 出，藉以帶動冷空氣自錢人，達成有鱗低與控制發光二極 體燈泡(100)溫度的效果。 再者，透過中間通風孔(21)的配合應用，能提高驅動電路 板(6)的散熱速度，以有效的降低驅動電路板(6)的溫度，讓驅 動電路板(6)能穩定的長時間運作。 另一方面’螺口式燈頭(41)[如圖丨所示]，如E27、E26、 El卜E14等規格燈頭； 直插式燈頭(42)[如圖1〇所示]，如GX5.3等規格燈頭； 卡口式燈頭(43)[如圖11所示]，如gui〇、B22等規格燈頭； 透過應用不同種類的燈頭(4)，讓本新型發光二極體燈泡 (1〇〇)的應用範圍可以是：吸頂燈、天井燈、檯燈、路燈、探 照燈、投射燈、手持式燈具、球燈泡、或崁燈等發光載具其中 之一，有效擴展本新型的應用範圍。 上述中’所述上燈座部⑴與燈罩(3)、發光基板⑺的連接 處，還依序往下 '呈階梯狀設置有一能供定位燈罩(3)的第一 環槽(12)、及一能供定位發光基板(7)的第二環槽(13); 而所述燈罩(3)與上燈座部(1)的連接處、還設有一呈階梯 狀設置的定位凸榫(31)，且該定位凸榫的寬度、大於前述 第一環槽(12)的底面寬度。 其中’透過第一環槽(12)與定位凸榫(31)的配合，能有效 的定位該燈罩(3) ’而定位凸榫(31)凸出於第一環槽(12)的部 分’必定會壓到位於第二環槽(13)内、發光基板(7)的邊緣部 分’因此發光基板⑺不用使用螺絲，就能透過燈罩⑶的應用， 達穩固定位發光基板(7)的效果，除了能降低成本之外，更能 降低整體的重量，真正的輕量化。 其次’透過此種第一環槽(12)與第二環槽(13)的配合，當 配合燈罩(3)安裝後’還能於塑製燈座(1〇)和燈罩(3)的外側相接 邊緣處，施以填膠黏合的動作，讓熱量能分散傳遞，使本新型 11 發光二極體燈泡(_摸起來不會烫手，能安心使用，並且讓 燈罩(3)能在不影響外觀的前提下，定位更穩固。 上述中’所述塑製燈座(10)内、對應於該驅動電路板(6) 處’還設有至彡、_伽上能做位购桃板剛的卡扣 (H);及 至夕個以上此供抵頂驅動電路板(6)用的頂塊(15)。 其中，透過卡扣塊(14)的使用，能免除螺絲的使用，讓驅 動電路板(6)能方便安裝，同時能快速穩定的定位。 其次，配合上頂塊(15)之後，能讓驅動電路板(6)與塑製燈 座(1〇)的内表面，產生一空隙，當空氣流經分隔板(5)後，便能 透過該空隙，流至下通風孔(21)處，以導出至外界。 如圖6所示為本新型配合第一種發光基板和另種分隔板以 應用時的立體示意圖，如圖7所示為本新型配合第一種發光基 板和另種分隔板以應用時的立體分解示意圖，如圖8所示為圖7 的部分立體放大示意圖。 上述中，所述發光基板(7)，其是由一以非金屬材質所製 成、能供該電路(72)和發光二極體(73)設置用的散熱基板部 (20);及 一設於該敢熱基板部(20)之底側端面處，以非金屬材質所 製成、能供該散熱鰭片組(74)設置用的散熱部(30)所組成。 其中，透過此種非金屬材質的散熱基板部(20)與散熱部 (30)之應用，雖然其熱傳導係數[heat transfer coefficient]較差， 但成本較低，能有利於本新型發光二極體燈泡(100)的推廣， 更能有效的降低整體的重量，更加的輕量化。 其次，此發光基板⑺的應用，其電路(72)能透過金屬液襞 來建構於發光基板(7)頂側表面，以避免因為發光基板(7)長期 處於高溫環境下，電路(72)故障的問題，讓本新型發光二極體 燈泡(100)能長時間正常使用，組成結構較為簡單，材料成本 12 M422041 ^二體(73)運作時，即可透過電路(72)對發 ()直接散,，，'，以保持發光二極體(73)照度的穩 發揮省電效率’以及延長魏二極體(73)之使用壽命。‘。 上述中，所述分隔板(5)，其中央處，還設有一支 =·該孔洞㈤、能供發光基板⑺定位用、纟中空狀的支^ 而刚述支柱(51)的自由端處、設有一中空凸塊(52)，該 空凸塊(52)的兩側、還分別設有—開槽(Mi”0 '' S 3 However, in recent years, the light-emitting diode (Light_; Emitting Diode, LED) has been gradually developed, which is characterized by low power consumption, long service life, and less likely to pollute the environment. ~ In addition, the volume is smaller than the conventional lamps, so it can effectively solve the problem of traditional lighting equipment. Therefore, the way to replace traditional light bulbs with LED lighting has also been born, and has gradually become the mainstream of lighting devices. However, the brightness of conventional light-emitting diode lamps is generally lower than that of conventional lighting devices. The current improvement is to switch to high-power LEDs. The disadvantage of the general high-power LED lamp is that the temperature of the light-emitting body itself will be greatly increased after a long period of use, and the excessive temperature will cause the brightness of the light-emitting diode lamp to be greatly reduced. Therefore, in order to achieve the best use efficiency, it is necessary to dissipate the excessive heat of the light-emitting diode. In order to dissipate the heat generated by the light-emitting diode to the outside world, many fin-type heat-dissipating modules using copper, aluminum, copper-aluminum alloy or ceramic as the main substrate are available on the market, but such a heat-dissipating module The efficiency is generally low, the heat dissipation effect is quite limited, and the heat dissipation is slow, so it is easy to cause the problem of excessive temperature in the lamp. Because the heat sink is excessively concentrated, the heat exchange speed is low, and the heat dissipation is low. The performance is not as expected, so it is easy to deteriorate the characteristics of the light-emitting diode, so that the brightness of the light-emitting diode is attenuated, that is, "light decay". This problem has always been the promotion of the traditional high-power light-emitting diode lamp. Unfavorable factors. Another factor affecting the promotion of traditional high-power LEDs is the installation cost of the thermal module. Because of the heat dissipation requirements, the large application of metal materials leads to the high price of the traditional power-emitting diode lamps. Affect the willingness of consumers to purchase. In view of this, how to provide a light-emitting diode bulb that can reduce the overheating of the LED, and reduce the metal parts to keep the cost low, so that the consumer is willing to apply, has become the object of the present invention. [New content] 1. The new technical means: The purpose of the present invention is to provide a high-power lightweight light-emitting diode bulb which is low-cost, has few metal parts, and can avoid overheating of the LED. In order to solve the foregoing problems and achieve the object of the present invention, the technical means of the present invention is a high-power lightweight light-emitting diode bulb, characterized in that: the light-emitting diode bulb (100) is provided with a top end The upper lamp holder portion (1) and the bottom end are provided with a lower lamp holder portion (2) and a ventilated plastic lamp holder (1) a lampshade (3) disposed at the top end of the upper lamp holder portion (1); a lamp cap (4) disposed outside the bottom end of the lower socket portion (2); a partition plate (5) disposed between the upper socket portion (1) and the lower socket portion (2); a driving circuit board (6) disposed at the bottom end of the partitioning plate (3) and located in the plastic lamp holder (10), comprising at least a circuit circuit (61) and electrically connected to the lamp cap (4); Further, between the upper socket portion (1) and the lamp cover (3), and having a hole (71)' in the center thereof and electrically connected to the driving circuit board (6) through the hole (71); At the wall surface of the lamp holder portion (1), a plurality of air venting holes are provided in the ring shape, and the upper venting holes (11)' and the wall portion of the lower lamp socket portion (2) are also annularly opened for ventilation. a lower venting hole (21); and the illuminating substrate ( 7), a circuit (72) electrically connected to the fish circuit board (6) is constructed at the top side surface thereof, and at least: a light emitting diode (73) electrically connected to the ^ (72) is soldered; The substrate (7)_ is convexly disposed on the surface - the heat dissipating fins. The dispersing film group (74) is provided from the center to the outer side, and is provided in a low-to-high shape according to the above-mentioned high-power lightweight light-emitting diode bulb. (7)' is a heat-dissipating substrate portion (po) made of a non-metal material and capable of being provided for the circuit (72) and the diode (73); and a heat-dissipating substrate portion (20) The bottom side end surface is made of a non-metallic material and can be provided with a heat dissipating portion (3〇) for disposing the heat dissipating fin group (74). According to the high-power lightweight light-emitting diode bulb described above, the light-emitting substrate (7) is made of a non-metal material and can be used for the circuit (72) and the light-emitting diode (73). a heat dissipating substrate portion (2〇); a heat dissipating portion (3〇) provided on the bottom end surface of the heat dissipating substrate portion (2〇) and made of a metal material for providing the heat dissipating fin group (74) And being disposed between the heat dissipation substrate portion (20) and the heat dissipation portion (3〇), the top end is fixed to the heat dissipation substrate portion (20), and the bottom end is connected to the heat dissipation portion (30), and is made of metal. The formed soaking heat guide plate (40) is composed. According to the high-power lightweight light-emitting diode bulb described above, the heat-dissipating fin set (74) is composed of one of the following or a combination thereof: a columnar fin (741), a heat sink fin ( 742). According to the high-power lightweight light-emitting diode bulb described above, the partition plate (5) has a one end that can pass through the hole (71) and can be used for positioning the light-emitting substrate (7). a hollow pillar (51); and a free projection (52) at a free end of the pillar (51), and a slot (521) is further disposed on each side of the hollow bump (52). According to the above-described high-power lightweight light-emitting diode bulb, the surface of the partitioning plate (5) is also provided with a plurality of holes (53) for ventilation. According to the high-power lightweight light-emitting diode bulb described above, the lower venting hole (21) is disposed in a vertical direction; and the lower venting hole (21) and the upper venting opening (11) are more capable. The ring-shaped intermediate venting hole is added; and the lamp cap (4) is one of the following: a screw-type cap (41): a straight-in lamp cap (42) and a bayonet cap (43). According to the above-mentioned high-power lightweight light-emitting diode bulb, the connection between the upper socket portion (1) and the lamp cover (3) and the light-emitting substrate (7) is also provided in a stepped manner in order. Positioning the first ring groove (12) of the lamp cover (3), and a second ring groove (13) capable of positioning the light-emitting substrate (7); and connecting the lamp cover (3) to the upper lamp holder portion (1) Further, a positioning protrusion (31) is arranged in a stepped manner, and the width of the positioning protrusion (31) is larger than the width of the bottom surface of the first ring groove (12). According to the above-mentioned high-power lightweight light-emitting diode bulb, at least one or more buckles for positioning the driving circuit board (6) are provided in the plastic lamp holder (10) corresponding to the driving circuit board (6). Block (14); and at least one top block (15) for abutting the drive circuit board (6). According to the high-power lightweight LED bulb described above, the circuit (72) is electrically connected to the LED (73), and respectively corresponding to a working positioning area (721); At the pole body (73), the bottom surface corresponds to the aforementioned shape positioning area (72i), and a heat dissipation area (731) is further provided. 2. Comparison with the effects of the prior art: 1. In the present invention, by using the combination of the light-emitting substrate (7) and the heat-dissipating fin set (74), the light-emitting diode (73) at the top side surface is applied. The junction temperature [juncti〇n Temperature] can be quickly reduced, so that the LED (73) can maintain its original brightness after a long period of operation. 2. In the present invention, the heat-dissipating fin group (74) is arranged from the center to the outer side in a low-to-high configuration, so that the heat-dissipating effect of the light-emitting substrate (7) is optimized and can be diffused from the inside to the outside. Allows heat to quickly exit 'away from the location of the LED (73). 3. In the present invention, the 'portion of the light-emitting substrate (7)' is matched by the heat-dissipating substrate portion (2) and the heat-dissipating portion (30), or the heat-dissipating substrate portion (20), the heat-dissipating portion (3〇), and the heat-dissipating portion. The cooperation of the guide plate (40) directs the heat directly and quickly, so that the light-emitting substrate (7) can be different from the conventional light-emitting diode bulb in the manner of heat dissipation by the lamp holder, so that it can be matched with the plastic lamp holder (100). The application allows the new model to be used with high-power LEDs (73) while being lighter and less expensive. 4. In the present invention, when the application of the pillar (51) can achieve the electrical connection between the hidden driving circuit board (6) and the light-emitting substrate (7), the effect of the exposed wire is 'allowed the new light-emitting diode The body bulb (100) is more beautiful. 5. In the present invention, the novel light-emitting diode bulb (100) can be applied with different light-emitting diodes (73) through the application of different types of light-emitting substrates (7), thereby expanding the application of the novel. range. 6. In the present invention, the application range of the novel light-emitting diode bulb (100) can be made wider and wider by the application of different types of lamp caps (4). 7. In the present invention, by the cooperation of the first groove (12) and the second ring groove (13), the lampshade (3) and the light-emitting substrate (7) can be positioned more stably, and at the same time, a lightweight target is achieved, and The new light-emitting diode bulb (100) is not hot to the mold and can be used with peace of mind. [Embodiment] The following is a detailed description of the following embodiments according to the drawings: Figure 1 is a perspective view of the first type of light-emitting substrate, as shown in Figure 2, the first type of light is matched with the first type. The stereoscopic decomposition of the substrate is intended to be a three-dimensional schematic view of the present invention in combination with the first type of light-emitting substrate and another type of lamp cap as shown in FIGS. 10 and 11 . The figure discloses a high-power lightweight light-emitting diode bulb, characterized in that: the light-emitting diode bulb (100) is provided with a lamp holder portion (1) and a bottom end portion from a top end. There is a lamp holder portion (2), a ventilated plastic lamp holder (10), a lamp cover (3) disposed at a top end of the upper lamp holder portion (1), and a bottom portion (2) disposed at the bottom of the lower lamp holder portion (2) a lamp cap (4) at the outer end; a partition plate (5) disposed between the upper lamp seat portion (1) and the lower lamp seat portion (2); one disposed at the bottom end of the partition plate (5) , in the plastic lamp holder (1〇), comprising at least one circuit circuit (61), and a driving circuit board (6) electrically connected to the lamp cap (4); and a lamp base portion (1) disposed at the upper portion a light-emitting substrate (7) having a hole (71)' between the lampshade (3) and electrically connected to the driving circuit board (6) through the hole (71); the upper lamp holder portion (1) At the wall surface, a plurality of upper venting holes (11) for ventilation are provided in the ring shape, and a plurality of lower venting holes (21) for ventilation are also opened in the wall surface of the lower lamp seat portion (2); Wherein the light-emitting substrate (7) has a structure at the top side surface thereof a circuit board (6) electrically connected to the circuit (72), and soldering at least one light emitting diode (73) electrically connected to the circuit (72); at the bottom side surface of the light emitting substrate (7), A heat dissipation fin group (74) is protruded, and the heat dissipation fin group (74) is disposed from the center to the outer side in a low to high shape. The light-emitting diode bulb (1〇〇) is formed by the cooperation of the plastic lamp holder (10), the lamp cover (3), the lamp holder (4), the partition plate (5), the driving circuit board (6) and the light-emitting substrate (7). It can be easily taken by consumers, and it can not be produced because the lamp holder is hot, and the application of the molded lamp holder (10) and the light-emitting substrate (7) can achieve the effect of weight reduction. Different from traditional light-emitting diode bulbs. Secondly, the driving circuit board (6) is separated from the light-emitting substrate (7) by the partition plate (5), because the driving circuit board (6) also generates heat during operation, but the heat resistance of the driving circuit board (6) The temperature is higher, and the heat-resistant temperature of the light-emitting diode (73) is lower. If not separated, the heat generated by the driving circuit board (6) is concentrated inside, so that the heat affects the light-emitting diode (73). , the problem of light decay, so through the application of the partition plate (5) 'to avoid the heat generated by the two, mixed together, too concentrated, so that the temperature of the entire light-emitting diode bulb (1 〇〇) can not be reduced, Causes a high failure rate. Furthermore, the upper venting hole (11) of the upper lamp holder portion (1) is matched with the lower venting hole (21) at the lower lamp housing portion M422041, so that the air can naturally convect, and the wind can be ventilated by the upper ventilating hole. (11), enter the upper lamp holder (1) to take away the heat generated by the light-emitting substrate (7) to effectively reduce the temperature of the light-emitting substrate (7) and then pass through the lower base portion (2) The venting hole (21) 'flows to the outside, while taking away the heat generated by the driving circuit board (6) during operation, effectively reducing the temperature of the driving circuit board (6). Secondly, the heat sink fin group (μ) located on the bottom side of the light-emitting substrate (7) can quickly derive the heat from the light-emitting diode (73) at the top side surface, and the junction temperature [JunctionTemperature] can be fast. Lowering, allowing the light-emitting diode (73) to maintain its original brightness after a long period of operation. Moreover, the heat dissipating fin set (74) is arranged such that the heat at the light emitting diode (73) is continuously radiated to the periphery of the light emitting substrate (7), effectively dissipating heat, and is low. The heat dissipation fin set (74), which is placed at a high level, has a higher endothermic efficiency than the inner endothermic efficiency, and is more helpful through the application of the second law of thermodynamics, "The heat will move from the temperature to the low temperature." The heat is removed. Secondly, the application of the light-emitting substrate (7) not only enables the novel light-emitting diode bulb (100) to obtain a better heat-dissipating effect, but also has the same heat-dissipating effect as compared with the light-emitting diode bulb. The weight is lower, the weight is lighter, and the cost is lower, which can be more safe and financial. In the above, the lower venting hole (21) is arranged vertically; and between the lower venting hole (21) and the upper venting hole (11), the number of intermediate venting holes (21) can be increased; The lamp cap (4) is one of the following: a screw-type cap (41), a straight-in cap (42), and a bayonet cap (43). Wherein, when the air flowing in the direction of the driving circuit board (6) flows through the driving circuit board (2' can be transmitted to the outside through the lower venting hole (21). Secondly, because of the general light-emitting diode bulb (1〇) 〇) The installation method is mostly that the lampshade (3) is facing down and the lamp cap is installed (the ventilating hole (21) that can be formed directly to form a smoke-like effect), so that the hot air rises upwards. Out, to drive the cold air from the money, to achieve the effect of low scale and control the temperature of the light-emitting diode bulb (100). Furthermore, through the application of the intermediate vent (21), the drive circuit board can be improved (6) The heat dissipation speed is effective to reduce the temperature of the driving circuit board (6), so that the driving circuit board (6) can operate stably for a long time. On the other hand, the screw-type lamp head (41) [shown in FIG. Such as E27, E26, El Bu E14 and other specifications of the lamp head; in-line lamp holder (42) [as shown in Figure 1], such as GX5.3 and other specifications of the lamp holder; bayonet type lamp holder (43) [shown in Figure 11] , such as gui〇, B22 and other specifications of the lamp holder; through the application of different types of lamp holders (4), let the new light-emitting diode bulb (1〇〇) The application range can be: one of the ceiling lamps, the patio lamp, the table lamp, the street lamp, the searchlight, the projection lamp, the hand-held lamp, the bulb, or the xenon lamp, which effectively expands the application range of the novel. Referring to the connection between the lamp holder portion (1) and the lamp cover (3) and the light-emitting substrate (7), a first ring groove (12) capable of positioning the lamp cover (3) and a supply can be provided in a stepped manner. Positioning the second ring groove (13) of the light-emitting substrate (7); and the connection between the lamp cover (3) and the upper lamp holder portion (1) is further provided with a positioning protrusion (31) arranged in a stepped manner, and The width of the positioning ridge is greater than the width of the bottom surface of the first ring groove (12). The 'through the first ring groove (12) and the positioning ridge (31) can effectively position the lamp cover (3)' The portion of the positioning collar (31) protruding from the first ring groove (12) must be pressed into the edge portion of the light-emitting substrate (7) located in the second ring groove (13). Therefore, the light-emitting substrate (7) does not need to be used. Through the application of the lampshade (3), the effect of the fixed-position light-emitting substrate (7) can be stabilized, and in addition to reducing the cost, the overall quality can be reduced. The weight is truly lightweight. Secondly, through the cooperation of the first ring groove (12) and the second ring groove (13), when the lamp cover (3) is installed, it can also be used to mold the lamp holder (1〇 ) and the edge of the outer side of the lampshade (3), the action of filling and bonding, so that the heat can be dispersed and transmitted, so that the new 11-light diode bulb (_ does not feel hot, can be used with peace of mind, and let The lampshade (3) can be positioned more stably without affecting the appearance. In the above-mentioned plastic lamp holder (10), corresponding to the driving circuit board (6), there is also a 彡, _ gamma It can be used to purchase the buckle (H) of the peach plate; and the top block (15) for the top drive circuit board (6). Among them, through the use of the snap block (14), the use of the screw can be eliminated, the drive circuit board (6) can be easily installed, and the positioning can be quickly and stably. Secondly, after the top block (15) is matched, a gap can be created between the driving circuit board (6) and the inner surface of the plastic lamp holder (1), and when the air flows through the partition plate (5), Through the gap, it flows to the lower vent (21) for export to the outside. FIG. 6 is a perspective view showing the application of the first type of light-emitting substrate and another type of partition plate. FIG. 7 shows a new type of light-emitting substrate and another type of partition plate. FIG. 8 is a partially enlarged perspective view of FIG. 7 . In the above, the light-emitting substrate (7) is a heat-dissipating substrate portion (20) made of a non-metal material and capable of providing the circuit (72) and the light-emitting diode (73); and The bottom surface of the heat-receiving substrate portion (20) is made of a non-metallic material and can be provided with a heat dissipating portion (30) for providing the heat dissipating fin group (74). Among them, the application of the non-metallic heat-dissipating substrate portion (20) and the heat-dissipating portion (30), although the heat transfer coefficient is poor, but the cost is low, and the light-emitting diode bulb can be favored. The promotion of (100) is more effective in reducing the overall weight and making it lighter. Secondly, in the application of the light-emitting substrate (7), the circuit (72) can be constructed on the top side surface of the light-emitting substrate (7) through the metal liquid helium to avoid malfunction of the circuit (72) because the light-emitting substrate (7) is in a high temperature environment for a long time. The problem is that the new LED bulb (100) can be used normally for a long time, and the composition is relatively simple. When the material cost is 12 M422041 ^ when the two bodies (73) are operated, the circuit (72) can be directly transmitted through the circuit (72). Disperse,,, ', in order to maintain the luminous efficiency of the illuminating diode (73), and to extend the service life of the Wei diode (73). ‘. In the above, the partition plate (5) is further provided with a hole (=5), a hole for positioning the light-emitting substrate (7), and a hollow-shaped branch, and the free end of the pillar (51). There is a hollow protrusion (52), and two sides of the empty protrusion (52) are respectively provided with a slot (Mi)
其中’透過支柱(51)的應用’能達到隱藏驅動電路板 與發光基板(7)做電性連接時，所裸露出來的電線之效果，讓 本新型發光二極體燈泡(100)更美觀。 其-人，透過中空凸塊(52)與開槽(521)的配合，能將驅動電 ，板(6)與發光基板(7)做電性連接時，所用的電線區分開來， 間化生產流程，並達到一定程度的防呆效果。 上述中，所述分隔板(5)的表面，還開設有數個能供通風 用的孔洞(53)。The application of the pillar (51) can achieve the effect of the exposed wire when the hidden drive circuit board and the light-emitting substrate (7) are electrically connected, so that the novel light-emitting diode bulb (100) is more beautiful. The human-type, through the cooperation of the hollow bump (52) and the slot (521), can electrically connect the driving electric board and the light-emitting board (7), and the electric wires used are separated. Production process and achieve a certain degree of foolproof effect. In the above, the surface of the partitioning plate (5) is also provided with a plurality of holes (53) for ventilation.
其中，透過此種孔洞(53)的設置，能在不影響分隔板(5) 的隔熱效果之前提下，讓空氣至發光基板(7)的底端，經由該 孔洞(53)，流向驅動電路板(6)的方向，達到降低驅動電路板(6) 之溫度的效果。 上述中’所述電路(72)電性連接於該發光二極體(73)處， 分別對應設有一工形定位區(721); 而所述發光二極體(73)處，其底面對應於前述工形定位區 (721)處，還設有一工形散熱區(731)。 其中，透過工形定位區(721)與工形散熱區(731)的配合應 用，能有別於傳統發光二極體與傳統鰭片式散熱模組的配合， 達到更快速導出熱量之效果，為本新型的最優選應用： 如圖12所為本新型配合另種第一種發光基板和另種分 13 隔板以應用時的立體分解示意圖’如圖13所示為本新型另種第 一種發光基板的分解示意圖。 上述中，所述發光基板(7)，其是由一非金屬材質所製成、 能供該電路(72)和發光二極體(73)設置用的散熱基板部(2〇); 一設於該散熱基板部(20)之底側端面處，以金屬材質所製 成、能供該散熱鰭片組(74)設置用的散熱部(3〇);及 一設於該散熱基板部(20)和散熱部(30)之間，頂端與該散 熱基板部(20)固接、底端與該散熱部(3〇)相接，以金屬材質所 製成的均熱導板(40)所組成。 其中’透過此種非金屬材質之散熱基板部(2〇)與金屬材質 之均熱導板(40)、散熱部(30)的配合，能大幅度提昇發光基板 (7)的散熱效率’讓本新型能配合使用更高功率的發光二極體 (73)，讓消費者能有更多的選擇。 其次，當本新型能配合高功率之發光二極體(73)，且能正 常使用時，以另一方面來說，當應用目前應用量最多，較低功 率的發光二極體(73)時，其發光基板⑺的散熱效果 ，絕對足以 保證發光二極體(73)的正常使用，解決發光二極體(73)容易過 熱而光衰的問題。 再者，當應用此種發光基板(7)時，能先生產均熱導板(4〇) 及散熱部(30)的部分’再將散熱基板部p〇)固接於均熱導板(4〇) 上，之後再印刷上電路(72)，並將發光二極體(73)焊於定位， 生產上簡單’能有效的控制成本。 如圖16、圖19、圖22、圖25、圖28、圖3卜圖34、圖37、 ，4〇、圖43所示為本新型第二至十一種發光基板的立體示意 圖’如圖17、圖20、圖23、圖26、圖29、圖32、圖35、圖38、 f41、圖44所示為本新型第二至十一種發光基板的仰視示意 圖’如圖18、圖21、圖24、圖27、圖30、圖33、圖36、圖39、 圖42、圖45所示為本新型第二至十一種發光基板的剖面示意 M422041 圖。 上述中，所述散熱則組⑽，妓由數片下列之 組合所組成：柱狀散熱鰭片（741)、散熱鰭片（742)。 ’、 其中，透過應用不同的散熱鰭片組⑽，讓本新型能配合 不同的發光二極體(73)及廠商需求，使本新型的成本與效能最 佳化。 其次，柱狀散熱鰭片（741)的種類繁多，族繁不及備 故於此僅以簡單圓雜、方雜、侧雜糊，但水滴形 機翼形柱等亦可應用，特在此說明。 再者’當散熱韓片組(74)為應用柱狀散熱鰭片(叫時，各 柱狀散熱鰭片（741)、與相鄰柱狀散熱鰭片（741)之間為呈一 定比例的交錯排列[Staggered]狀設置的方式，以優於同軸排列 [In-line]狀設置的方式，使流體在柱狀散熱鰭片（741)中可以 流經柱狀散熱鰭片（741)間，讓流場更加混亂，讓邊界層變薄， 增加熱對流係數’提高散熱效率。 另一方面，散熱鰭片（742)的種類繁多，同樣族繁不及備 載，故於此僅以幾種簡單的輻射狀立體造型散熱鰭片 在此說明。 另外，為了提高散熱鰭片（742)的散熱效率，同樣能透過 配合應用增加不同城的方式，增加熱雌係數，來強化散熱 效率。 … 土如圖3所示為本新型配合第一種發光基板時的剖面實施示 意圖·’如圖4所示為圖2發光基板的A_A剖面實施示意圖如圖 5所不為本新型第一種發光基板的仰視實施示意圖，如圖$所示 為本新，配合第一種發光基板和另種分隔板以應用時的剖面 實施示意圖，如圖14所示為圖12發光基板的B_B剖面實施示意 圖’如圖15所示為本新型配合另種第一種發光基板和另種分= 板以應用時的剖面實施示意圖。 15 M422041 圖式中揭示出’透過散熱縛片組(74)的應用，讓熱量往發 光基板(7)邊緣的方向移動時，能受到散熱鰭片組(74)的影響， 還能同時往垂直方向移轉，遠離發光基板(7)邊緣，能避免消 費者在拿取本新型發光二極體燈泡(1〇〇)時，會覺得燙手，讓 消費者能安心的拿取。 還有，隨著晶片技術的日益成熟，單一的發光二極體晶片 * 輸入功率可達到5W ’甚至更高，所以防止發光二極體(73)工作 · 溫度過高也越來越顯得重要，若不能有效的將晶片熱量散出， ‘ 接鍾而來的熱效應也會變得越來越明顯，使得晶片接面溫度升 ’ 高，進而直接減少晶片射出的光子能量，降低出光效率，因為 鲁 當發光二極體(73)的接面溫度為25。(：[典型工作溫度]時亮度為 100 ’溫度升高至75°C時亮度就減至80，到125°C則剩60，到175 C時只剩40 ’很明顯地，接面溫度與發光亮度是呈反比的線性 關係’透過高低變化的散熱鰭片組(74)之應用，能引導熱量外 移，以加速散熱，使發光基板的中心溫度降低，避免熱能 過度集中，來降低接面溫度的，避免發光二極體(73)的接面溫 度超過80°C。 '另外，溫度的升高也會使得發光二極體(73)的晶片發射出 的光谱，產生紅移，色溫品質下降，所以透過散熱鰭片組(74)鲁1 的使用，亦能確保發光二極體(73)的色溫品質保持穩定。Through the arrangement of the holes (53), the air can be lifted to the bottom end of the light-emitting substrate (7) through the hole (53) without affecting the heat insulating effect of the partition plate (5). Driving the direction of the board (6) to reduce the temperature of the driver board (6). The above-mentioned circuit (72) is electrically connected to the light-emitting diode (73), and correspondingly has a work-shaped positioning area (721); and the light-emitting diode (73) has a bottom surface corresponding thereto. At the shape positioning area (721), a heat dissipation zone (731) is further provided. Among them, through the cooperation between the shape positioning area (721) and the shape heat dissipation area (731), it can be different from the traditional light-emitting diode and the traditional fin-type heat dissipation module, so as to achieve a faster heat export effect. The most preferred application of the present invention: Figure 12 is a schematic exploded perspective view of the present invention in combination with another first type of light-emitting substrate and another type of 13-separator, as shown in Figure 13 Schematic diagram of the decomposition of the light-emitting substrate. In the above, the light-emitting substrate (7) is a heat-dissipating substrate portion (2) made of a non-metal material and capable of providing the circuit (72) and the light-emitting diode (73); a heat dissipating portion (3〇) made of a metal material and capable of providing the heat dissipating fin group (74) at a bottom end surface of the heat dissipating substrate portion (20); and a heat dissipating portion (3) disposed on the heat dissipating substrate portion 20) and the heat dissipating portion (30), the top end is fixed to the heat dissipating substrate portion (20), the bottom end is connected to the heat dissipating portion (3), and the heat guiding plate (40) made of metal material is used. Composed of. The combination of the non-metallic heat-dissipating substrate portion (2〇) and the metal-based uniform heat guide plate (40) and the heat-dissipating portion (30) can greatly improve the heat-dissipating efficiency of the light-emitting substrate (7). The new model can be used with higher power LEDs (73), allowing consumers to have more choices. Secondly, when the present invention can be combined with a high-power light-emitting diode (73) and can be used normally, on the other hand, when the application is currently the most used, the lower power of the light-emitting diode (73) The heat dissipation effect of the light-emitting substrate (7) is absolutely sufficient to ensure the normal use of the light-emitting diode (73), and solve the problem that the light-emitting diode (73) is easily overheated and light is degraded. Furthermore, when such a light-emitting substrate (7) is applied, the portion of the heat-conducting guide (4 turns) and the heat-dissipating portion (30) can be first fixed and then the heat-dissipating substrate portion p〇 can be fixed to the heat-conductive guide plate ( 4〇) On and after printing the circuit (72), and soldering the LED (73) to the positioning, the production is simple 'effectively control the cost. 16, FIG. 19, FIG. 22, FIG. 25, FIG. 28, FIG. 3, FIG. 34, FIG. 37, FIG. 4, FIG. 43 are schematic perspective views of the second to eleven kinds of light-emitting substrates of the present invention. 17, FIG. 20, FIG. 23, FIG. 26, FIG. 29, FIG. 32, FIG. 35, FIG. 38, f41, and FIG. 44 are schematic views of the second to eleven kinds of light-emitting substrates of the present invention, as shown in FIG. 18 and FIG. 24, FIG. 27, FIG. 30, FIG. 33, FIG. 36, FIG. 39, FIG. 42 and FIG. 45 are schematic cross-sectional views of M422041 of the second to eleventh light-emitting substrates of the present invention. In the above, the heat dissipation group (10) is composed of a plurality of combinations of the following: columnar fins (741) and fins (742). </ br /> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; Secondly, there are many types of columnar fins (741), and the family is too complicated. Therefore, only simple round, square, and side pastes are used, but a drop-shaped wing-shaped column can also be applied. . Furthermore, when the heat sink Korean group (74) is applied with columnar fins (the columnar fins (741) and the adjacent column fins (741) are proportional to each other) The staggered arrangement is arranged in a manner that is better than the coaxial arrangement [In-line], so that the fluid can flow between the columnar fins (741) in the columnar fins (741). Make the flow field more chaotic, make the boundary layer thinner, increase the heat convection coefficient to improve the heat dissipation efficiency. On the other hand, there are many types of heat sink fins (742), and the same family is not ready for loading, so it is only a few simple The radiation-shaped three-dimensional shape heat-dissipating fins are described here. In addition, in order to improve the heat-dissipating efficiency of the heat-dissipating fins (742), it is also possible to increase the heat-male coefficient by means of adding different cities to enhance the heat-dissipating efficiency. FIG. 3 is a schematic cross-sectional view showing the structure of the first type of light-emitting substrate. FIG. 4 is a schematic view showing the A_A cross-section of the light-emitting substrate of FIG. 2. FIG. 5 is not a bottom view of the first type of light-emitting substrate. Implementation diagram, as shown in Figure $ FIG. 14 is a schematic cross-sectional view showing a B_B cross-section of the light-emitting substrate of FIG. 12, as shown in FIG. Schematic diagram of the cross-section of the illuminating substrate and the other sub-plates in application. 15 M422041 The figure reveals the application of the heat-dissipating splicing group (74) to move heat toward the edge of the illuminating substrate (7). It can be affected by the heat sink fin group (74), and can also be moved in the vertical direction away from the edge of the light-emitting substrate (7), so as to prevent the consumer from taking the light-emitting diode bulb (1〇〇). Will feel hot, so that consumers can take it with peace of mind. Also, with the maturity of wafer technology, a single LED chip* input power can reach 5W 'or even higher, so to prevent the LED (73) Work · Temperature is also becoming more and more important. If the heat of the wafer cannot be effectively dissipated, the thermal effect of the clock will become more and more obvious, so that the junction temperature of the wafer rises to 'high'. Reduce wafer ejection The photon energy reduces the light extraction efficiency because the junction temperature of the Ludang LED (73) is 25. (: [typical temperature] the brightness is 100' and the brightness is reduced to 80 when the temperature is raised to 75 °C. 60 to 60 ° C, only 40 ' to 175 C, it is obvious that the junction temperature and the brightness of the light are inversely proportional to the linear relationship. Move out to accelerate heat dissipation, reduce the center temperature of the light-emitting substrate, avoid excessive concentration of heat energy, and reduce the junction temperature to avoid the junction temperature of the light-emitting diode (73) exceeding 80 ° C. 'In addition, the temperature rises High also causes the spectrum emitted by the wafer of the light-emitting diode (73) to be red-shifted and the color temperature quality is lowered. Therefore, the use of the heat-dissipating fin group (74) Lu 1 can also ensure the light-emitting diode (73). The color temperature quality remains stable.
，另=方面’發光二極體使用壽命的定義為，當發光二極體 發光效率储紐光辭之7()%時，可縣發光二極體壽命終 結三而發光二極體發光效率會隨著使用時間及次數而降低，而 過两的接Φ溫細會加速發光二鋪發光效率韻，故透過散 熱鰭片組(74)的應用，相對能延長本新型發光 的使用壽命。 V ’利^分隔板(5)，將驅動電路板⑹與發光基板⑺分 主要疋能避免兩者的熱量混在一起，過於集中，讓熱 其次 開設置， 16 M422041 量逆流，讓發光二極體(73)的晶片溫度飆高，造成光衰問題， 而且這樣的设计讓都會產生高熱量的驅動電路板(6)與發光基 板(7)這兩組裝置’可以配合上通風孔(11)與下通風孔(21)的應 用，依序散熱，來達到更好的散熱效能。 再其次，雖然驅動電路板(6)散熱時，流經該處的溫度偏 高，但是一般驅動電路板(6)中的電子元件，本身的耐熱效果， ^來就，較好’有職㈣二減(73)，所峨算流經空氣的 溫度較高，也不會影響驅動電路板的正常運作。, the other side of the 'light-emitting diode life is defined as, when the luminous efficiency of the light-emitting diode is 7 ()%, the life of the LED light-emitting diode ends three and the luminous efficiency of the light-emitting diode As the use time and number of times decrease, and the temperature of the two Φs will accelerate the luminous efficiency of the illuminating two-station, the application of the heat-dissipating fin group (74) can prolong the service life of the novel illuminating. V 'Lee ^ partition plate (5), the main circuit of the drive circuit board (6) and the light-emitting substrate (7) can be avoided to avoid the heat of the two, too concentrated, let the heat set second, 16 M422041 countercurrent, let the light dipole The wafer temperature of the body (73) is high, causing a problem of light decay, and such a design allows the two sets of devices, which can generate high heat, the driving circuit board (6) and the light-emitting substrate (7), can be matched with the ventilation holes (11). With the application of the lower vent (21), heat is dissipated in order to achieve better heat dissipation. Secondly, although the temperature of the driving circuit board (6) is high when it is radiated, the electronic components in the driving circuit board (6) generally have a heat-resisting effect, and it is better to have a job (four) two. Subtraction (73), the temperature of the calculated air flowing through the air is high, and will not affect the normal operation of the driving circuit board.
述’本新型藉由發光二極體燈泡(刚)中的由 成的發光基板⑺’配合其上散熱鰭片組(74)， 太免f ί—極體(73)過熱的前提下，將金屬部件減少 '降 7_者能安心 以上如ϋ、有 實魏性與產業利用性。 徵及的實施例詳細說明瞭本新型的構造、特 做作収果，由於符合新穎及進步 型專利申請；惟以Α 士遂菱依法提出新 不以圖祕-ΐ 為本之較佳實施例，但本新型 不以圖面所不限定實施觀 =The present invention is based on the fact that the formed light-emitting substrate (7)' in the light-emitting diode bulb (just) is matched with the heat-dissipating fin group (74), and the heat-removing fin (73) is overheated. The reduction of metal parts 'lower 7_ can be safer than the above, with real Wei and industrial utilization. The enlisted embodiment details the structure and special effects of the present invention, and is in line with the novel and progressive patent application; however, it is proposed by the company that the new embodiment is not based on the law. However, this new model does not limit the implementation concept by the figure =
3要在均等範圍内都應涵屬於本新型專利範 飾性變化，、·一 u 、冬新型思旨相符的修 圍内 17 【圖式簡單說明】 圖1 :本新型配合第一種發光基板時的立體示意圖。 圖2 :本新型配合第一種發光基板時的立體分解示意圖。 圖3 :本新型配合第一種發光基板時的剖面實施示意圖。 圖4 :為圖2發光基板的A-A剖面實施示意圖。 圖5 :本新型第一種發光基板的仰視實施示意圖。 圖6 ·本新型配合第一種發光基板和另種分隔板以應用時 的立體示意圖。 圖7 .本新型配合第一種發光基板和另種分隔板以應用時 的立體分解示意圖。 圖8 :為圖7的部分立體放大示意圖。 圖9 :本新型配合第一種發光基板和另種分隔板以應用時 的剖面實施示意圖。 圖10、圖11 :本新型配合第一種發光基板和另種燈頭應用 時的立體示意圖。 圖12:本新型配合另種第一種發光基板和另種分隔板以應 用時的立體分解示意圖。 圖13 :本新型另種第一種發光基板的分解示意圖。 圖14 :為圖12發光基板的b-B剖面實施示意圖。 圖15 :本新型配合另種第一種發光基板和另種分隔板以應 用時的剖面實施示意圖。 圖16 :本新型第二種發光基板的立體示意圖。 圖17 :本新型第二種發光基板的仰視示意圖。 圖18 :本新型第二種發光基板的剖面示意圖。 圖19 :本新型第三種發光基板的立體示意圖。 圖20 :本新型第三種發光基板的仰視示意圖。 圖21 :本新型第三種發光基板的剖面示意圖。 圖22 :本新型第四種發光基板的立體示意圖。 圖23 :本新型第四種發光基板的仰視示意圖。 18 圖24 :本新型第四種發光基板的剖面示意圖。 圖25 :本新型第五種發光基板的立體示意圖。 圖26 :本新型第五種發光基板的仰視示意圖。 圖27 :本新型第五種發光基板的剖面示意圖。 圖28 :本新型第六種發光基板的立體示意圖。 圖29 :本新型第六種發光基板的仰視示意圖。 圖30 :本新型第六種發光基板的剖面示意圖。 圖31 :本新型第七種發光基板的立體示意圖。 圖32 :本新型第七種發光基板的仰視示意圖。 圖33 :本新型第七種發光基板的剖面示意圖。 圖34 :本新型第八種發光基板的立體示意圖。 圖35 :本新型第八種發光基板的仰視示意圖。 圖36 :本新型第八種發光基板的剖面示意圖。 圖37 :本新型第九種發光基板的立體示意圖。 圖38 :本新型第九種發光基板的仰視示意圖。 圖39 :本新型第九種發光基板的剖面示意圖。 圖40 :本新型第十種發光基板的立體示意圖。 圖41 :本新型第十種發光基板的仰視示意圖。 圖42 :本新型第十種發光基板的剖面示意圖。 圖43 :本新型第十一種發光基板的立體示意圖。 圖44 :本新型第十一種發光基板的仰視示意圖。 圖45 :本新型第十一種發光基板的剖面示意圖。 【主要元件符號說明】 1 上燈座部 11 上通風孔 12 第一環槽 13 第二環槽 14 頂塊 15 卡扣塊 2 下燈座部 19 M422041 21 下通風孔 22 中間通風孔 3 燈罩 31 定位凸榫 4 燈頭 41 螺口式燈頭 42 直插式燈頭 43 卡口式燈頭 5 分隔板 51 支柱 52 中空凸塊 521 開槽 53 孔洞 6 驅動電路板 61 電路迴路 7 發光基板 71 孔洞 72 電路 721 工形定位區 73 發光二極體 731 工形散熱區 74 散熱鰭片組 741 柱狀散熱鰭片 742 散熱鰭片 10 塑製燈座 20 散熱基板部 30 散熱部 40 均熱導板 100 發光二極體燈泡 203 In the equal range, it should be included in the variation of the new patent, and the decoration of the new type is the same as that of the new type of winter. 17 [Simple description of the figure] Figure 1: The new type of light-emitting substrate A three-dimensional diagram of the time. FIG. 2 is a perspective exploded view of the present invention in combination with the first type of light-emitting substrate. Fig. 3 is a schematic view showing the cross-section of the present invention in combination with the first type of light-emitting substrate. 4 is a schematic view showing the A-A cross-section of the light-emitting substrate of FIG. 2. Fig. 5 is a bottom plan view showing the first type of light-emitting substrate of the present invention. Fig. 6 is a perspective view showing the application of the first type of light-emitting substrate and another type of partition plate in application. Fig. 7. Schematic exploded perspective view of the present invention in combination with the first type of light-emitting substrate and another type of partition plate. Figure 8 is a partially enlarged perspective view of Figure 7. Fig. 9 is a schematic cross-sectional view showing the application of the first type of light-emitting substrate and another type of partition plate in application. Fig. 10 and Fig. 11 are perspective views of the present invention in combination with the first type of light-emitting substrate and another type of lamp cap. Fig. 12 is a perspective exploded view of the present invention in combination with another first type of light-emitting substrate and another type of partition plate. Fig. 13 is an exploded perspective view showing the first alternative light-emitting substrate of the present invention. Figure 14 is a schematic view showing the b-B cross-section of the light-emitting substrate of Figure 12. Fig. 15 is a cross-sectional view showing the construction of the present invention in combination with another first type of light-emitting substrate and another type of partition plate. Figure 16 is a perspective view of a second type of light-emitting substrate of the present invention. Figure 17 is a bottom plan view of a second type of luminescent substrate of the present invention. Figure 18 is a cross-sectional view showing the second light-emitting substrate of the present invention. Figure 19 is a perspective view of a third type of light-emitting substrate of the present invention. Figure 20 is a bottom plan view of a third type of luminescent substrate of the present invention. Figure 21 is a cross-sectional view showing a third illuminating substrate of the present invention. Fig. 22 is a perspective view showing the fourth light-emitting substrate of the present invention. Figure 23 is a bottom plan view of a fourth type of luminescent substrate of the present invention. 18 Figure 24 is a schematic cross-sectional view of a fourth illuminating substrate of the present invention. Fig. 25 is a perspective view showing the fifth light-emitting substrate of the present invention. Figure 26 is a bottom plan view of a fifth light-emitting substrate of the present invention. Figure 27 is a cross-sectional view showing a fifth light-emitting substrate of the present invention. Fig. 28 is a perspective view showing the sixth light-emitting substrate of the present invention. Figure 29 is a bottom plan view of a sixth luminescent substrate of the present invention. Figure 30 is a cross-sectional view showing a sixth light-emitting substrate of the present invention. Figure 31 is a perspective view showing the seventh light-emitting substrate of the present invention. Figure 32 is a bottom plan view of the seventh light-emitting substrate of the present invention. Figure 33 is a cross-sectional view showing the seventh light-emitting substrate of the present invention. Figure 34 is a perspective view of the eighth illumination substrate of the present invention. Figure 35 is a bottom plan view of the eighth illumination substrate of the present invention. Figure 36 is a cross-sectional view showing the eighth light-emitting substrate of the present invention. Fig. 37 is a perspective view showing the ninth light-emitting substrate of the present invention. Figure 38 is a bottom plan view of the ninth light-emitting substrate of the present invention. Figure 39 is a cross-sectional view showing the ninth light-emitting substrate of the present invention. Figure 40 is a perspective view of a tenth light-emitting substrate of the present invention. Figure 41 is a bottom plan view of a tenth light-emitting substrate of the present invention. Figure 42 is a cross-sectional view showing the tenth light-emitting substrate of the present invention. Figure 43 is a perspective view showing the eleventh type of light-emitting substrate of the present invention. Figure 44 is a bottom plan view of the eleventh light-emitting substrate of the present invention. Figure 45 is a cross-sectional view showing the eleventh type of light-emitting substrate of the present invention. [Main component symbol description] 1 Upper lamp holder 11 Upper vent hole 12 First ring groove 13 Second ring groove 14 Top block 15 Snap block 2 Lower lamp holder 19 M422041 21 Lower vent hole 22 Intermediate vent hole 3 Lamp cover 31 Positioning cam 4 Lamp cap 41 Screw cap 42 In-line lamp cap 43 Bayonet cap 5 Separator 51 Pillar 52 Hollow bump 521 Slot 53 Hole 6 Drive circuit board 61 Circuit circuit 7 Light-emitting substrate 71 Hole 72 Circuit 721 Shape positioning area 73 Light-emitting diode 731 Work heat dissipation area 74 Heat sink fin set 741 Column heat sink fin 742 Heat sink fin 10 Plastic lamp holder 20 Heat sink base 30 Heat sink 40 Heat guide plate 100 Light-emitting diode Bulb 20