JP2013236047A - 一体化高効率多層式照明装置 - Google Patents

一体化高効率多層式照明装置 Download PDF

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Publication number
JP2013236047A
JP2013236047A JP2012223119A JP2012223119A JP2013236047A JP 2013236047 A JP2013236047 A JP 2013236047A JP 2012223119 A JP2012223119 A JP 2012223119A JP 2012223119 A JP2012223119 A JP 2012223119A JP 2013236047 A JP2013236047 A JP 2013236047A
Authority
JP
Japan
Prior art keywords
integrated high
lighting device
chamber
groove
efficiency multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012223119A
Other languages
English (en)
Japanese (ja)
Inventor
Jon-Fwu Hwu
仲孚 胡
Yong-Fu Wu
永富 呉
Kui-Chiang Liu
奎江 劉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gem Weltronics TWN Corp
Original Assignee
Gem Weltronics TWN Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gem Weltronics TWN Corp filed Critical Gem Weltronics TWN Corp
Publication of JP2013236047A publication Critical patent/JP2013236047A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2012223119A 2012-05-10 2012-10-05 一体化高効率多層式照明装置 Pending JP2013236047A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101116665A TW201347244A (zh) 2012-05-10 2012-05-10 一體化高效率多層式照明裝置
TW101116665 2012-05-10

Publications (1)

Publication Number Publication Date
JP2013236047A true JP2013236047A (ja) 2013-11-21

Family

ID=48084865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012223119A Pending JP2013236047A (ja) 2012-05-10 2012-10-05 一体化高効率多層式照明装置

Country Status (5)

Country Link
JP (1) JP2013236047A (https=)
KR (1) KR101401919B1 (https=)
DE (2) DE102013100611A1 (https=)
MY (1) MY164690A (https=)
TW (1) TW201347244A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103899955A (zh) * 2014-03-14 2014-07-02 魏百远 一种高效散热的led模组结构
JP2015103447A (ja) * 2013-11-26 2015-06-04 東芝ライテック株式会社 移動体用照明装置
CN115604982A (zh) * 2022-09-09 2023-01-13 英业达科技有限公司（Cn） 液冷板装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6467206B2 (ja) * 2014-01-28 2019-02-06 株式会社小糸製作所 光源ユニット

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311471A (ja) * 2007-06-15 2008-12-25 Toyoda Gosei Co Ltd 発光装置
JP2009528695A (ja) * 2006-03-03 2009-08-06 エルジー イノテック カンパニー リミテッド 発光ダイオードパッケージ及びその製造方法
JP3162599U (ja) * 2010-06-25 2010-09-09 李家茂 リング状パッケージ構造

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100705011B1 (ko) 2005-08-31 2007-04-13 바이오닉스(주) 발광 장치
TW200725940A (en) * 2005-12-29 2007-07-01 Anteya Technology Corp LED package structure
KR100714749B1 (ko) 2006-03-21 2007-05-04 삼성전자주식회사 발광 소자 패키지 모듈 및 이의 제조 방법
KR101048440B1 (ko) 2010-04-29 2011-07-11 금호전기주식회사 Ｌｅｄ모듈 가변 장착형 방열판 및 이를 이용한 조명 장치
KR101054305B1 (ko) 2010-12-30 2011-08-08 금강전기 (주) Ｌｅｄ 조명장치 및 그 제조방법
TWM409367U (en) * 2011-01-28 2011-08-11 Fin Core Corp Heat-dissipation module and LED lamp having heat-dissipation module
TWM424620U (en) * 2011-08-03 2012-03-11 Gem Weltronics Twn Corp Multi-layer array type LED light engine structure improvement
TWM422041U (en) * 2011-09-16 2012-02-01 Zi-Hua Chen High-power lightweight LED bulb

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009528695A (ja) * 2006-03-03 2009-08-06 エルジー イノテック カンパニー リミテッド 発光ダイオードパッケージ及びその製造方法
JP2008311471A (ja) * 2007-06-15 2008-12-25 Toyoda Gosei Co Ltd 発光装置
JP3162599U (ja) * 2010-06-25 2010-09-09 李家茂 リング状パッケージ構造

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015103447A (ja) * 2013-11-26 2015-06-04 東芝ライテック株式会社 移動体用照明装置
CN103899955A (zh) * 2014-03-14 2014-07-02 魏百远 一种高效散热的led模组结构
CN115604982A (zh) * 2022-09-09 2023-01-13 英业达科技有限公司（Cn） 液冷板装置

Also Published As

Publication number Publication date
KR20130126434A (ko) 2013-11-20
KR101401919B1 (ko) 2014-06-27
DE202013100293U1 (de) 2013-03-11
MY164690A (en) 2018-01-30
TW201347244A (zh) 2013-11-16
DE102013100611A1 (de) 2013-11-14
TWI470841B (https=) 2015-01-21

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