KR101395465B1 - 도전 회로 형성용 도전성 수지 조성물 및 도전 회로 - Google Patents

도전 회로 형성용 도전성 수지 조성물 및 도전 회로 Download PDF

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Publication number
KR101395465B1
KR101395465B1 KR1020130137416A KR20130137416A KR101395465B1 KR 101395465 B1 KR101395465 B1 KR 101395465B1 KR 1020130137416 A KR1020130137416 A KR 1020130137416A KR 20130137416 A KR20130137416 A KR 20130137416A KR 101395465 B1 KR101395465 B1 KR 101395465B1
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KR
South Korea
Prior art keywords
conductive
group
resin composition
manufactured
meth
Prior art date
Application number
KR1020130137416A
Other languages
English (en)
Korean (ko)
Inventor
다카히로 요시다
요시토모 아오야마
Original Assignee
다이요 잉키 세이조 가부시키가이샤
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Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Application granted granted Critical
Publication of KR101395465B1 publication Critical patent/KR101395465B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Landscapes

  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020130137416A 2012-11-16 2013-11-13 도전 회로 형성용 도전성 수지 조성물 및 도전 회로 KR101395465B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012252617A JP5358732B1 (ja) 2012-11-16 2012-11-16 導電回路形成用導電性樹脂組成物及び導電回路
JPJP-P-2012-252617 2012-11-16

Publications (1)

Publication Number Publication Date
KR101395465B1 true KR101395465B1 (ko) 2014-05-14

Family

ID=49850275

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130137416A KR101395465B1 (ko) 2012-11-16 2013-11-13 도전 회로 형성용 도전성 수지 조성물 및 도전 회로

Country Status (4)

Country Link
JP (1) JP5358732B1 (zh)
KR (1) KR101395465B1 (zh)
CN (2) CN103823333B (zh)
TW (1) TWI441881B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5492967B2 (ja) * 2011-11-29 2014-05-14 太陽インキ製造株式会社 導電回路形成用導電性樹脂組成物及び導電回路
CN103969951A (zh) * 2013-01-30 2014-08-06 太阳油墨制造株式会社 导电性树脂组合物及导电电路
JP6116285B2 (ja) * 2013-02-21 2017-04-19 太陽インキ製造株式会社 導電性樹脂組成物及び導電回路
WO2015040908A1 (ja) * 2013-09-20 2015-03-26 東洋紡株式会社 感光性導電ペースト、導電性薄膜、電気回路、及びタッチパネル
TW201539483A (zh) * 2014-04-02 2015-10-16 Toyo Boseki 感光性導電糊劑、導電性薄膜、電路及觸控面板
JP2016194563A (ja) 2015-03-31 2016-11-17 太陽インキ製造株式会社 導電性樹脂組成物及び導電回路
JP6795942B2 (ja) 2016-09-30 2020-12-02 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6662491B1 (ja) * 2018-04-19 2020-03-11 東レ株式会社 感光性導電ペーストおよびそれを用いたパターン形成グリーンシートの製造方法
CN112552866B (zh) * 2020-12-29 2022-05-20 烟台信友新材料有限公司 一种uv-led和湿气双重固化的环保三防胶黏剂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009192827A (ja) 2008-02-14 2009-08-27 Hitachi Chem Co Ltd 感光性樹脂組成物、並びにこれを用いた感光性エレメント及び永久マスクレジスト
WO2010113287A1 (ja) 2009-03-31 2010-10-07 太陽インキ製造株式会社 感光性導電ペースト及び電極パターン

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1088319C (zh) * 1996-06-27 2002-07-24 旭化成株式会社 厚膜导体电路及其制造方法
CN1720292A (zh) * 2002-12-26 2006-01-11 株式会社普利司通 导电性树脂组合物、使用该组合物的感光鼓用基体及感光鼓
JP5492967B2 (ja) * 2011-11-29 2014-05-14 太陽インキ製造株式会社 導電回路形成用導電性樹脂組成物及び導電回路

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009192827A (ja) 2008-02-14 2009-08-27 Hitachi Chem Co Ltd 感光性樹脂組成物、並びにこれを用いた感光性エレメント及び永久マスクレジスト
WO2010113287A1 (ja) 2009-03-31 2010-10-07 太陽インキ製造株式会社 感光性導電ペースト及び電極パターン

Also Published As

Publication number Publication date
CN103823333A (zh) 2014-05-28
CN104678703A (zh) 2015-06-03
TWI441881B (zh) 2014-06-21
CN103823333B (zh) 2016-01-20
JP2014101412A (ja) 2014-06-05
JP5358732B1 (ja) 2013-12-04
TW201410812A (zh) 2014-03-16

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