JP5358732B1 - 導電回路形成用導電性樹脂組成物及び導電回路 - Google Patents

導電回路形成用導電性樹脂組成物及び導電回路 Download PDF

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Publication number
JP5358732B1
JP5358732B1 JP2012252617A JP2012252617A JP5358732B1 JP 5358732 B1 JP5358732 B1 JP 5358732B1 JP 2012252617 A JP2012252617 A JP 2012252617A JP 2012252617 A JP2012252617 A JP 2012252617A JP 5358732 B1 JP5358732 B1 JP 5358732B1
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Japan
Prior art keywords
conductive
group
resin composition
conductive circuit
acid
Prior art date
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Active
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JP2012252617A
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English (en)
Japanese (ja)
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JP2014101412A (ja
Inventor
貴大 吉田
良朋 青山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Ink Manufacturing Co Ltd
Original Assignee
Taiyo Ink Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Manufacturing Co Ltd filed Critical Taiyo Ink Manufacturing Co Ltd
Priority to JP2012252617A priority Critical patent/JP5358732B1/ja
Priority to KR1020130137416A priority patent/KR101395465B1/ko
Priority to TW102141384A priority patent/TWI441881B/zh
Priority to CN201510078808.6A priority patent/CN104678703A/zh
Priority to CN201310573718.5A priority patent/CN103823333B/zh
Application granted granted Critical
Publication of JP5358732B1 publication Critical patent/JP5358732B1/ja
Publication of JP2014101412A publication Critical patent/JP2014101412A/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2012252617A 2012-11-16 2012-11-16 導電回路形成用導電性樹脂組成物及び導電回路 Active JP5358732B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012252617A JP5358732B1 (ja) 2012-11-16 2012-11-16 導電回路形成用導電性樹脂組成物及び導電回路
KR1020130137416A KR101395465B1 (ko) 2012-11-16 2013-11-13 도전 회로 형성용 도전성 수지 조성물 및 도전 회로
TW102141384A TWI441881B (zh) 2012-11-16 2013-11-14 A conductive resin composition for conductive circuit formation, and a conductive circuit
CN201510078808.6A CN104678703A (zh) 2012-11-16 2013-11-15 导电电路形成用导电性树脂组合物及导电电路
CN201310573718.5A CN103823333B (zh) 2012-11-16 2013-11-15 导电电路形成用导电性树脂组合物及导电电路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012252617A JP5358732B1 (ja) 2012-11-16 2012-11-16 導電回路形成用導電性樹脂組成物及び導電回路

Publications (2)

Publication Number Publication Date
JP5358732B1 true JP5358732B1 (ja) 2013-12-04
JP2014101412A JP2014101412A (ja) 2014-06-05

Family

ID=49850275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012252617A Active JP5358732B1 (ja) 2012-11-16 2012-11-16 導電回路形成用導電性樹脂組成物及び導電回路

Country Status (4)

Country Link
JP (1) JP5358732B1 (zh)
KR (1) KR101395465B1 (zh)
CN (2) CN103823333B (zh)
TW (1) TWI441881B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013136727A (ja) * 2011-11-29 2013-07-11 Taiyo Ink Mfg Ltd 導電性樹脂組成物及び導電回路
WO2015040908A1 (ja) * 2013-09-20 2015-03-26 東洋紡株式会社 感光性導電ペースト、導電性薄膜、電気回路、及びタッチパネル
WO2015152208A1 (ja) * 2014-04-02 2015-10-08 東洋紡株式会社 感光性導電ペースト、導電性薄膜、電気回路、及びタッチパネル

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103969951A (zh) * 2013-01-30 2014-08-06 太阳油墨制造株式会社 导电性树脂组合物及导电电路
JP6116285B2 (ja) * 2013-02-21 2017-04-19 太陽インキ製造株式会社 導電性樹脂組成物及び導電回路
JP2016194563A (ja) 2015-03-31 2016-11-17 太陽インキ製造株式会社 導電性樹脂組成物及び導電回路
JP6795942B2 (ja) 2016-09-30 2020-12-02 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR102656350B1 (ko) * 2018-04-19 2024-04-11 도레이 카부시키가이샤 감광성 도전 페이스트 및 그것을 사용한 패턴 형성 그린 시트의 제조 방법
CN112552866B (zh) * 2020-12-29 2022-05-20 烟台信友新材料有限公司 一种uv-led和湿气双重固化的环保三防胶黏剂及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1088319C (zh) * 1996-06-27 2002-07-24 旭化成株式会社 厚膜导体电路及其制造方法
AU2002361104A1 (en) * 2002-12-26 2004-07-29 Bridgestone Corporation Conductive resin composition, base for photosensitive drum using the composition, and photosensitive drum
JP5061938B2 (ja) 2008-02-14 2012-10-31 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント及び永久マスクレジスト
JP5364787B2 (ja) 2009-03-31 2013-12-11 太陽ホールディングス株式会社 感光性導電ペースト及び電極パターン
JP5492967B2 (ja) * 2011-11-29 2014-05-14 太陽インキ製造株式会社 導電回路形成用導電性樹脂組成物及び導電回路

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013136727A (ja) * 2011-11-29 2013-07-11 Taiyo Ink Mfg Ltd 導電性樹脂組成物及び導電回路
WO2015040908A1 (ja) * 2013-09-20 2015-03-26 東洋紡株式会社 感光性導電ペースト、導電性薄膜、電気回路、及びタッチパネル
WO2015152208A1 (ja) * 2014-04-02 2015-10-08 東洋紡株式会社 感光性導電ペースト、導電性薄膜、電気回路、及びタッチパネル

Also Published As

Publication number Publication date
KR101395465B1 (ko) 2014-05-14
TW201410812A (zh) 2014-03-16
CN104678703A (zh) 2015-06-03
CN103823333A (zh) 2014-05-28
JP2014101412A (ja) 2014-06-05
TWI441881B (zh) 2014-06-21
CN103823333B (zh) 2016-01-20

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