KR101392120B1 - 구리의 무전해 증착을 위한 도금액 - Google Patents

구리의 무전해 증착을 위한 도금액 Download PDF

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Publication number
KR101392120B1
KR101392120B1 KR1020087030088A KR20087030088A KR101392120B1 KR 101392120 B1 KR101392120 B1 KR 101392120B1 KR 1020087030088 A KR1020087030088 A KR 1020087030088A KR 20087030088 A KR20087030088 A KR 20087030088A KR 101392120 B1 KR101392120 B1 KR 101392120B1
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KR
South Korea
Prior art keywords
copper
cobalt
plating solution
aqueous
salt component
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English (en)
Korean (ko)
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KR20090017582A (ko
Inventor
알기르다스 바스켈리스
에우게니주스 노르쿠스
자네 자키아우스키엔네
알도나 자그미니엔네
Original Assignee
램 리써치 코포레이션
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1687—Process conditions with ionic liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020087030088A 2006-05-11 2008-12-10 구리의 무전해 증착을 위한 도금액 Active KR101392120B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/382,906 2006-05-11
US11/382,906 US7306662B2 (en) 2006-05-11 2006-05-11 Plating solution for electroless deposition of copper
PCT/US2007/068691 WO2007134182A1 (en) 2006-05-11 2007-05-10 Plating solution for electroless deposition of copper

Publications (2)

Publication Number Publication Date
KR20090017582A KR20090017582A (ko) 2009-02-18
KR101392120B1 true KR101392120B1 (ko) 2014-05-07

Family

ID=38683921

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087030088A Active KR101392120B1 (ko) 2006-05-11 2008-12-10 구리의 무전해 증착을 위한 도금액

Country Status (8)

Country Link
US (1) US7306662B2 (https=)
EP (1) EP2016207B1 (https=)
JP (1) JP4975099B2 (https=)
KR (1) KR101392120B1 (https=)
CN (1) CN101490308B (https=)
MY (1) MY144454A (https=)
TW (1) TWI390079B (https=)
WO (1) WO2007134182A1 (https=)

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US8298325B2 (en) * 2006-05-11 2012-10-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
US7752996B2 (en) * 2006-05-11 2010-07-13 Lam Research Corporation Apparatus for applying a plating solution for electroless deposition
JP4755573B2 (ja) * 2006-11-30 2011-08-24 東京応化工業株式会社 処理装置および処理方法、ならびに表面処理治具
US7749893B2 (en) * 2006-12-18 2010-07-06 Lam Research Corporation Methods and systems for low interfacial oxide contact between barrier and copper metallization
US20080152823A1 (en) * 2006-12-20 2008-06-26 Lam Research Corporation Self-limiting plating method
US7794530B2 (en) * 2006-12-22 2010-09-14 Lam Research Corporation Electroless deposition of cobalt alloys
US7521358B2 (en) * 2006-12-26 2009-04-21 Lam Research Corporation Process integration scheme to lower overall dielectric constant in BEoL interconnect structures
US8058164B2 (en) * 2007-06-04 2011-11-15 Lam Research Corporation Methods of fabricating electronic devices using direct copper plating
US8323460B2 (en) * 2007-06-20 2012-12-04 Lam Research Corporation Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal
US8673769B2 (en) 2007-06-20 2014-03-18 Lam Research Corporation Methods and apparatuses for three dimensional integrated circuits
JP4971078B2 (ja) * 2007-08-30 2012-07-11 東京応化工業株式会社 表面処理装置
US20090162681A1 (en) * 2007-12-21 2009-06-25 Artur Kolics Activation solution for electroless plating on dielectric layers
TW201428923A (zh) 2012-11-15 2014-07-16 阿奇默公司 半導體裝置及其製造方法
US9095518B2 (en) 2013-08-01 2015-08-04 Liqwd, Inc. Methods for fixing hair and skin
US12233289B2 (en) 2013-08-01 2025-02-25 Olaplex, Inc. Methods for fixing hair and skin
EP3142637B1 (en) 2014-05-16 2020-07-29 Olaplex, Inc. Keratin treatment formulations and methods
US9287183B1 (en) * 2015-03-31 2016-03-15 Lam Research Corporation Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch
US9597273B2 (en) 2015-04-24 2017-03-21 Liqwd, Inc. Methods for treating relaxed hair
KR20210082277A (ko) 2015-05-01 2021-07-02 로레알 화학적 처리 중 활성제의 용도
CN105470169A (zh) * 2015-11-20 2016-04-06 中国科学院微电子研究所 面向GaN器件的介质生长系统及其操作方法
BR112018010341B1 (pt) 2015-11-24 2021-08-10 L'oreal Método para alteração da cor de cabelo
CN108495613B (zh) 2015-11-24 2021-12-10 欧莱雅 用于处理头发的组合物
BR112018010381B1 (pt) 2015-11-24 2021-08-17 L'oreal Composição para tratamento de cabelo, sistema para tratamento de cabelo, métodos para tratamento de cabelo e para alteração da cor do cabelo, e, kit de multicompartimentos para alteração da cor ou do formato do cabelo
CN106048569A (zh) * 2016-06-12 2016-10-26 含山县朝霞铸造有限公司 一种铝合金压铸件表面处理方法及其产品
US9713583B1 (en) 2016-07-12 2017-07-25 Liqwd, Inc. Methods and formulations for curling hair
US9872821B1 (en) 2016-07-12 2018-01-23 Liqwd, Inc. Methods and formulations for curling hair
KR101734840B1 (ko) * 2016-11-11 2017-05-15 일진머티리얼즈 주식회사 내굴곡성이 우수한 이차전지용 전해동박 및 그의 제조방법
US11135150B2 (en) 2016-11-21 2021-10-05 L'oreal Compositions and methods for improving the quality of chemically treated hair
US11433011B2 (en) 2017-05-24 2022-09-06 L'oreal Methods for treating chemically relaxed hair
WO2019133785A1 (en) 2017-12-29 2019-07-04 L'oreal Compositions for altering the color of hair
US11090249B2 (en) 2018-10-31 2021-08-17 L'oreal Hair treatment compositions, methods, and kits for treating hair
WO2020158910A1 (ja) * 2019-02-01 2020-08-06 国立大学法人大阪大学 ５'位修飾ヌクレオシドおよびそれを用いたヌクレオチド
US11419809B2 (en) 2019-06-27 2022-08-23 L'oreal Hair treatment compositions and methods for treating hair

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US20060040487A1 (en) 2001-08-13 2006-02-23 Hiroaki Inoue Semiconductor device, method for manufacturing the same, and plating solution

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Also Published As

Publication number Publication date
US7306662B2 (en) 2007-12-11
JP4975099B2 (ja) 2012-07-11
EP2016207A1 (en) 2009-01-21
TWI390079B (zh) 2013-03-21
MY144454A (en) 2011-09-30
JP2009536987A (ja) 2009-10-22
CN101490308A (zh) 2009-07-22
CN101490308B (zh) 2012-07-18
EP2016207B1 (en) 2018-01-10
EP2016207A4 (en) 2015-05-27
KR20090017582A (ko) 2009-02-18
WO2007134182A1 (en) 2007-11-22
TW200811312A (en) 2008-03-01
US20070261594A1 (en) 2007-11-15

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