MY144454A - Plating solution for electroless deposition of copper - Google Patents

Plating solution for electroless deposition of copper

Info

Publication number
MY144454A
MY144454A MYPI20084533A MYPI20084533A MY144454A MY 144454 A MY144454 A MY 144454A MY PI20084533 A MYPI20084533 A MY PI20084533A MY PI20084533 A MYPI20084533 A MY PI20084533A MY 144454 A MY144454 A MY 144454A
Authority
MY
Malaysia
Prior art keywords
copper
plating solution
electroless deposition
electroless
solution
Prior art date
Application number
MYPI20084533A
Other languages
English (en)
Inventor
Vaskelis Algirdas
Norkus Eugenijus
Jaciauskiene Jane
Jagminiene Aldona
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of MY144454A publication Critical patent/MY144454A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1687—Process conditions with ionic liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
MYPI20084533A 2006-05-11 2007-05-10 Plating solution for electroless deposition of copper MY144454A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/382,906 US7306662B2 (en) 2006-05-11 2006-05-11 Plating solution for electroless deposition of copper

Publications (1)

Publication Number Publication Date
MY144454A true MY144454A (en) 2011-09-30

Family

ID=38683921

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20084533A MY144454A (en) 2006-05-11 2007-05-10 Plating solution for electroless deposition of copper

Country Status (8)

Country Link
US (1) US7306662B2 (https=)
EP (1) EP2016207B1 (https=)
JP (1) JP4975099B2 (https=)
KR (1) KR101392120B1 (https=)
CN (1) CN101490308B (https=)
MY (1) MY144454A (https=)
TW (1) TWI390079B (https=)
WO (1) WO2007134182A1 (https=)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7686875B2 (en) * 2006-05-11 2010-03-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
US7752996B2 (en) * 2006-05-11 2010-07-13 Lam Research Corporation Apparatus for applying a plating solution for electroless deposition
US8298325B2 (en) * 2006-05-11 2012-10-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
JP4755573B2 (ja) * 2006-11-30 2011-08-24 東京応化工業株式会社 処理装置および処理方法、ならびに表面処理治具
US7749893B2 (en) * 2006-12-18 2010-07-06 Lam Research Corporation Methods and systems for low interfacial oxide contact between barrier and copper metallization
US20080152823A1 (en) * 2006-12-20 2008-06-26 Lam Research Corporation Self-limiting plating method
US7794530B2 (en) * 2006-12-22 2010-09-14 Lam Research Corporation Electroless deposition of cobalt alloys
US7521358B2 (en) * 2006-12-26 2009-04-21 Lam Research Corporation Process integration scheme to lower overall dielectric constant in BEoL interconnect structures
US8058164B2 (en) * 2007-06-04 2011-11-15 Lam Research Corporation Methods of fabricating electronic devices using direct copper plating
US8323460B2 (en) * 2007-06-20 2012-12-04 Lam Research Corporation Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal
US8673769B2 (en) 2007-06-20 2014-03-18 Lam Research Corporation Methods and apparatuses for three dimensional integrated circuits
JP4971078B2 (ja) * 2007-08-30 2012-07-11 東京応化工業株式会社 表面処理装置
US20090162681A1 (en) * 2007-12-21 2009-06-25 Artur Kolics Activation solution for electroless plating on dielectric layers
WO2014076431A2 (fr) 2012-11-15 2014-05-22 Alchimer Dispositif semi-conducteur et son procede de fabrication
US9095518B2 (en) 2013-08-01 2015-08-04 Liqwd, Inc. Methods for fixing hair and skin
US12233289B2 (en) 2013-08-01 2025-02-25 Olaplex, Inc. Methods for fixing hair and skin
MX389718B (es) 2014-05-16 2025-03-20 Olaplex Inc Formulaciones y metodos de tratamiento con queratina.
US9287183B1 (en) * 2015-03-31 2016-03-15 Lam Research Corporation Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch
US9597273B2 (en) 2015-04-24 2017-03-21 Liqwd, Inc. Methods for treating relaxed hair
JP2018514570A (ja) 2015-05-01 2018-06-07 ロレアル 化学処理における活性剤の使用
CN105470169A (zh) * 2015-11-20 2016-04-06 中国科学院微电子研究所 面向GaN器件的介质生长系统及其操作方法
CN108495686A (zh) 2015-11-24 2018-09-04 欧莱雅 用于处理毛发的组合物
JP6873994B2 (ja) 2015-11-24 2021-05-19 ロレアル 毛髪を処置するための組成物
EP3380062B1 (en) 2015-11-24 2021-07-07 L'oreal Compositions for treating the hair
CN106048569A (zh) * 2016-06-12 2016-10-26 含山县朝霞铸造有限公司 一种铝合金压铸件表面处理方法及其产品
US9872821B1 (en) 2016-07-12 2018-01-23 Liqwd, Inc. Methods and formulations for curling hair
US9713583B1 (en) 2016-07-12 2017-07-25 Liqwd, Inc. Methods and formulations for curling hair
KR101734840B1 (ko) * 2016-11-11 2017-05-15 일진머티리얼즈 주식회사 내굴곡성이 우수한 이차전지용 전해동박 및 그의 제조방법
US11135150B2 (en) 2016-11-21 2021-10-05 L'oreal Compositions and methods for improving the quality of chemically treated hair
US11433011B2 (en) 2017-05-24 2022-09-06 L'oreal Methods for treating chemically relaxed hair
EP4011355A1 (en) 2017-12-29 2022-06-15 L'oreal Compositions for altering the color of hair
US11090249B2 (en) 2018-10-31 2021-08-17 L'oreal Hair treatment compositions, methods, and kits for treating hair
EP3919501A4 (en) * 2019-02-01 2022-11-23 Osaka University 5'-MODIFIED NUCLEOSIDE AND NUCLEOTIDE THEREOF
US11419809B2 (en) 2019-06-27 2022-08-23 L'oreal Hair treatment compositions and methods for treating hair

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3935013A (en) * 1973-11-12 1976-01-27 Eastman Kodak Company Electroless deposition of a copper-nickel alloy on an imagewise pattern of physically developable metal nuclei
JPS5220339A (en) * 1975-08-08 1977-02-16 Hitachi Ltd Chemical copper plating solution
US4143186A (en) * 1976-09-20 1979-03-06 Amp Incorporated Process for electroless copper deposition from an acidic bath
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4265943A (en) * 1978-11-27 1981-05-05 Macdermid Incorporated Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
DE3152361A1 (de) * 1980-09-15 1983-01-13 Shipley Co Electroless alloy plating
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
JPS6070183A (ja) * 1983-09-28 1985-04-20 C Uyemura & Co Ltd 化学銅めっき方法
JP2595319B2 (ja) * 1988-07-20 1997-04-02 日本電装株式会社 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
JP3455709B2 (ja) * 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体
JP2001164375A (ja) * 1999-12-03 2001-06-19 Sony Corp 無電解メッキ浴および導電膜の形成方法
JP2002093747A (ja) * 2000-09-19 2002-03-29 Sony Corp 導体構造の形成方法及び導体構造、並びに半導体装置の製造方法及び半導体装置
JP3707394B2 (ja) * 2001-04-06 2005-10-19 ソニー株式会社 無電解メッキ方法
US20040253450A1 (en) * 2001-05-24 2004-12-16 Shipley Company, L.L.C. Formaldehyde-free electroless copper plating process and solution for use in the process
CN1329972C (zh) * 2001-08-13 2007-08-01 株式会社荏原制作所 半导体器件及其制造方法
JP2003142427A (ja) * 2001-11-06 2003-05-16 Ebara Corp めっき液、半導体装置及びその製造方法
US6911068B2 (en) * 2001-10-02 2005-06-28 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US20070048447A1 (en) * 2005-08-31 2007-03-01 Alan Lee System and method for forming patterned copper lines through electroless copper plating
JPWO2005038088A1 (ja) * 2003-10-20 2006-12-28 関西ティー・エル・オー株式会社 無電解銅めっき液及びそれを用いた配線基板の製造方法

Also Published As

Publication number Publication date
US20070261594A1 (en) 2007-11-15
JP4975099B2 (ja) 2012-07-11
EP2016207A1 (en) 2009-01-21
EP2016207A4 (en) 2015-05-27
US7306662B2 (en) 2007-12-11
EP2016207B1 (en) 2018-01-10
TWI390079B (zh) 2013-03-21
KR20090017582A (ko) 2009-02-18
CN101490308B (zh) 2012-07-18
CN101490308A (zh) 2009-07-22
TW200811312A (en) 2008-03-01
JP2009536987A (ja) 2009-10-22
WO2007134182A1 (en) 2007-11-22
KR101392120B1 (ko) 2014-05-07

Similar Documents

Publication Publication Date Title
MY144454A (en) Plating solution for electroless deposition of copper
MY147845A (en) Plating solutions for electroless deposition of copper
SG150463A1 (en) Electroless palladium plating solution
EP2149622A4 (en) PRE-TREATMENT METHOD FOR ELECTRICALLY PLATING A RESIN FORM BODY, METHOD FOR PLATING A RESIN MOLD BODY AND PRE-TREATMENT AGENT
WO2013050332A3 (en) Formaldehyde-free electroless copper plating solution
WO2010065851A3 (en) Electroless palladium plating solution and method of use
TW201129714A (en) Method for improving plating on non-conductive substrates
MX2013001838A (es) Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos
MX339242B (es) Proceso para deposicion por via quimica de metales utilizando baño de chapado altamente alcalino.
MY174977A (en) Method for the production of hydrogen from ammonia borane
TWI367959B (en) Apparatus and method for electroless plating
JP2009536987A5 (https=)
EP2141261A3 (en) Electrolytic Tin Plating Solution and Electrolytic Tin Plating Method
WO2008085256A3 (en) Electroless deposition of cobalt alloys
EP1892321A3 (en) A Hard Gold Alloy Plating Bath
EP2017373A3 (en) High speed method for plating palladium and palladium alloys
MY166049A (en) Electroless nickel alloy plating bath and process for depositing thereof
EP2007743A4 (en) METHODS OF SYNTHESIZING BORNA AMMONIA
MY182304A (en) Plating bath composition and method for electroless plating of palladium
EP2242871A4 (en) PROCESS FOR ELECTROLYTIC DISSOLUTION OF NICKEL IN AUTOCATALYTIC NICKEL SOLUTIONS
WO2008081637A1 (ja) 還元型無電解スズめっき液及びそれを用いて得られたスズ皮膜
WO2010056612A3 (en) Plating solutions for electroless deposition of ruthenium
MX339326B (es) Un jabon en barra que comprende fuentes de piritiona.
EP2471977A3 (en) Method for removing impurities from plating solution
EP2347413A4 (en) METALIZATION ADDITION AND MANUFACTURING PROCESS FOR METALIZATION SUBSTRATES AND PRODUCTS THEREOF