KR101326147B1 - 증기 증착용 2차원 구멍 배열체 - Google Patents

증기 증착용 2차원 구멍 배열체 Download PDF

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Publication number
KR101326147B1
KR101326147B1 KR1020087017307A KR20087017307A KR101326147B1 KR 101326147 B1 KR101326147 B1 KR 101326147B1 KR 1020087017307 A KR1020087017307 A KR 1020087017307A KR 20087017307 A KR20087017307 A KR 20087017307A KR 101326147 B1 KR101326147 B1 KR 101326147B1
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holes
substrate
hole
forming
layer
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KR20080093991A (ko
Inventor
제레미 매튜 그레이스
마이클 롱
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글로벌 오엘이디 테크놀러지 엘엘씨
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020087017307A 2006-01-17 2007-01-05 증기 증착용 2차원 구멍 배열체 Active KR101326147B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/333,111 US7645483B2 (en) 2006-01-17 2006-01-17 Two-dimensional aperture array for vapor deposition
US11/333,111 2006-01-17
PCT/US2007/000425 WO2007084275A1 (en) 2006-01-17 2007-01-05 Two-dimensional aperture array for vapor deposition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020137015088A Division KR20130079647A (ko) 2006-01-07 2007-01-05 증기 증착용 2차원 구멍 배열체

Publications (2)

Publication Number Publication Date
KR20080093991A KR20080093991A (ko) 2008-10-22
KR101326147B1 true KR101326147B1 (ko) 2013-11-06

Family

ID=37913591

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020137015088A Withdrawn KR20130079647A (ko) 2006-01-07 2007-01-05 증기 증착용 2차원 구멍 배열체
KR1020087017307A Active KR101326147B1 (ko) 2006-01-17 2007-01-05 증기 증착용 2차원 구멍 배열체

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020137015088A Withdrawn KR20130079647A (ko) 2006-01-07 2007-01-05 증기 증착용 2차원 구멍 배열체

Country Status (6)

Country Link
US (1) US7645483B2 (enExample)
EP (1) EP1977025B1 (enExample)
JP (1) JP5260312B2 (enExample)
KR (2) KR20130079647A (enExample)
TW (1) TWI388691B (enExample)
WO (1) WO2007084275A1 (enExample)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070221128A1 (en) * 2006-03-23 2007-09-27 Soo Young Choi Method and apparatus for improving uniformity of large-area substrates
KR101441737B1 (ko) * 2009-05-01 2014-09-17 카티바, 인크. 유기 증기 인쇄용 장치 및 방법
JP5620146B2 (ja) 2009-05-22 2014-11-05 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置
JP5623786B2 (ja) * 2009-05-22 2014-11-12 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置
KR20130048677A (ko) * 2009-05-26 2013-05-10 엥떼르위니베르시테르 미크로엘렉트로니카 쌍트륌 베제드두블르베 기판에 유기 재료 층을 형성시키는 방법
US8882920B2 (en) 2009-06-05 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882921B2 (en) * 2009-06-08 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101074792B1 (ko) * 2009-06-12 2011-10-19 삼성모바일디스플레이주식회사 박막 증착 장치
KR101117719B1 (ko) * 2009-06-24 2012-03-08 삼성모바일디스플레이주식회사 박막 증착 장치
KR101127575B1 (ko) * 2009-08-10 2012-03-23 삼성모바일디스플레이주식회사 증착 가림막을 가지는 박막 증착 장치
JP5328726B2 (ja) * 2009-08-25 2013-10-30 三星ディスプレイ株式會社 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法
JP5677785B2 (ja) 2009-08-27 2015-02-25 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
US8696815B2 (en) 2009-09-01 2014-04-15 Samsung Display Co., Ltd. Thin film deposition apparatus
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
JP4974036B2 (ja) 2009-11-19 2012-07-11 株式会社ジャパンディスプレイセントラル 有機ｅｌ装置の製造方法
KR101084184B1 (ko) 2010-01-11 2011-11-17 삼성모바일디스플레이주식회사 박막 증착 장치
KR101174875B1 (ko) 2010-01-14 2012-08-17 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101193186B1 (ko) * 2010-02-01 2012-10-19 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101156441B1 (ko) 2010-03-11 2012-06-18 삼성모바일디스플레이주식회사 박막 증착 장치
KR101202348B1 (ko) 2010-04-06 2012-11-16 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
KR101223723B1 (ko) 2010-07-07 2013-01-18 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101673017B1 (ko) 2010-07-30 2016-11-07 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조 방법
US9129913B2 (en) * 2010-10-21 2015-09-08 Veeco Ald Inc. Formation of barrier layer on device using atomic layer deposition
KR101738531B1 (ko) 2010-10-22 2017-05-23 삼성디스플레이 주식회사 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101723506B1 (ko) 2010-10-22 2017-04-19 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR20120045865A (ko) 2010-11-01 2012-05-09 삼성모바일디스플레이주식회사 유기층 증착 장치
KR20120065789A (ko) 2010-12-13 2012-06-21 삼성모바일디스플레이주식회사 유기층 증착 장치
KR101760897B1 (ko) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 증착원 및 이를 구비하는 유기막 증착 장치
KR101852517B1 (ko) 2011-05-25 2018-04-27 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101840654B1 (ko) 2011-05-25 2018-03-22 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101857249B1 (ko) 2011-05-27 2018-05-14 삼성디스플레이 주식회사 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치
KR101826068B1 (ko) 2011-07-04 2018-02-07 삼성디스플레이 주식회사 유기층 증착 장치
KR20140118551A (ko) 2013-03-29 2014-10-08 삼성디스플레이 주식회사 증착 장치, 유기 발광 표시 장치 제조 방법 및 유기 발광 표시 장치
KR102037376B1 (ko) 2013-04-18 2019-10-29 삼성디스플레이 주식회사 패터닝 슬릿 시트, 이를 구비하는 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조방법 및 유기발광 디스플레이 장치
KR20160105431A (ko) 2013-12-27 2016-09-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 3차원 배열의 균일한 형상을 갖는 물체의 균일한 화학 증착 코팅
CN109190199B (zh) * 2018-08-15 2023-05-05 中国人民解放军92942部队 确定排气孔二维排布方式的方法、装置，打孔方法，排气装置
WO2025191947A1 (ja) * 2024-03-11 2025-09-18 株式会社ニューフレアテクノロジー 整流板、成膜装置、及びその評価方法

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Also Published As

Publication number Publication date
WO2007084275A1 (en) 2007-07-26
JP2009523915A (ja) 2009-06-25
EP1977025B1 (en) 2013-04-10
JP5260312B2 (ja) 2013-08-14
KR20080093991A (ko) 2008-10-22
US7645483B2 (en) 2010-01-12
TWI388691B (zh) 2013-03-11
EP1977025A1 (en) 2008-10-08
TW200732506A (en) 2007-09-01
KR20130079647A (ko) 2013-07-10
US20070163497A1 (en) 2007-07-19

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