KR101311315B1 - 압력 센서 및 그 제조 방법 - Google Patents

압력 센서 및 그 제조 방법 Download PDF

Info

Publication number
KR101311315B1
KR101311315B1 KR1020060009663A KR20060009663A KR101311315B1 KR 101311315 B1 KR101311315 B1 KR 101311315B1 KR 1020060009663 A KR1020060009663 A KR 1020060009663A KR 20060009663 A KR20060009663 A KR 20060009663A KR 101311315 B1 KR101311315 B1 KR 101311315B1
Authority
KR
South Korea
Prior art keywords
housing
pressure
insulating member
joint
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020060009663A
Other languages
English (en)
Korean (ko)
Other versions
KR20060090578A (ko
Inventor
가즈시 스즈키
가즈야 사카이
이사무 간도리
Original Assignee
가부시키가이샤 제이텍트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 제이텍트 filed Critical 가부시키가이샤 제이텍트
Publication of KR20060090578A publication Critical patent/KR20060090578A/ko
Application granted granted Critical
Publication of KR101311315B1 publication Critical patent/KR101311315B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627Protection against aggressive medium in general
    • G01L19/0645Protection against aggressive medium in general using isolation membranes, specially adapted for protection
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04GSCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G17/00Connecting or other auxiliary members for forms, falsework structures, or shutterings
    • E04G17/04Connecting or fastening means for metallic forming or stiffening elements, e.g. for connecting metallic elements to non-metallic elements
    • E04G17/042Connecting or fastening means for metallic forming or stiffening elements, e.g. for connecting metallic elements to non-metallic elements being tensioned by threaded elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14Housings
    • G01L19/145Housings with stress relieving means
    • G01L19/146Housings with stress relieving means using flexible element between the transducer and the support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
KR1020060009663A 2005-02-08 2006-02-01 압력 센서 및 그 제조 방법 Expired - Fee Related KR101311315B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005031570A JP4768281B2 (ja) 2005-02-08 2005-02-08 圧力センサ及びその製造方法
JPJP-P-2005-00031570 2005-02-08

Publications (2)

Publication Number Publication Date
KR20060090578A KR20060090578A (ko) 2006-08-14
KR101311315B1 true KR101311315B1 (ko) 2013-09-25

Family

ID=36127529

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060009663A Expired - Fee Related KR101311315B1 (ko) 2005-02-08 2006-02-01 압력 센서 및 그 제조 방법

Country Status (5)

Country Link
US (1) US7343810B2 (https=)
EP (1) EP1691182B1 (https=)
JP (1) JP4768281B2 (https=)
KR (1) KR101311315B1 (https=)
CN (1) CN100565152C (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007225360A (ja) * 2006-02-22 2007-09-06 Jtekt Corp 圧力センサ
US7703328B2 (en) * 2006-05-18 2010-04-27 Baker Hughes Incorporated Pressure sensor utilizing a low thermal expansion material
JP2008241489A (ja) * 2007-03-28 2008-10-09 Nidec Copal Electronics Corp 隔膜式圧力センサ
JP5092684B2 (ja) * 2007-10-23 2012-12-05 株式会社デンソー 圧力センサ
DE102008021091A1 (de) * 2008-04-28 2009-10-29 Epcos Ag Drucksensor
DE102008042982A1 (de) 2008-10-21 2010-04-22 Robert Bosch Gmbh Verfahren zur Herstellung von Hochdrucksensoren
JP5651670B2 (ja) * 2012-10-25 2015-01-14 株式会社鷺宮製作所 圧力検知ユニット
JP6352414B2 (ja) * 2014-06-17 2018-07-04 株式会社鷺宮製作所 センサユニット、および、それを備える圧力検出装置
DE102015117736A1 (de) * 2015-10-19 2017-04-20 Endress+Hauser Gmbh+Co. Kg Druckmesseinrichtung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459668A (ja) * 1990-06-26 1992-02-26 Nippon Steel Corp セラミックスと金属の接合体
JPH06163211A (ja) * 1992-11-19 1994-06-10 Matsushita Electric Ind Co Ltd 電子部品
JP2002270742A (ja) 2001-03-12 2002-09-20 Unisia Jecs Corp 半導体装置
JP2004037318A (ja) 2002-07-04 2004-02-05 Toyoda Mach Works Ltd 圧力センサ

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5522815A (en) * 1978-08-04 1980-02-18 Hitachi Ltd Semiconductor pressure transducer
US4375044A (en) * 1981-03-23 1983-02-22 The United States Of America As Represented By The Secretary Of The Army Low thermal stress electrode
JPH0234912B2 (ja) * 1984-11-08 1990-08-07 Sumitomo Semento Kk Seramitsukusutokinzokutaitonosetsugohoho
JPS63310779A (ja) 1987-06-15 1988-12-19 Seiko Instr & Electronics Ltd 接合構造
JPH01182729A (ja) * 1988-01-16 1989-07-20 Ngk Insulators Ltd 圧力センサ
US4930353A (en) 1988-08-07 1990-06-05 Nippondenso Co., Ltd. Semiconductor pressure sensor
JPH0388782A (ja) 1989-08-31 1991-04-15 Eagle Ind Co Ltd Cr↓3C↓2セラミックス―金属の接合体及びその接合法
US5277942A (en) * 1990-10-12 1994-01-11 Sumitomo Electric Industries, Ltd. Insulating member and electric parts using the same
JP2595829B2 (ja) * 1991-04-22 1997-04-02 株式会社日立製作所 差圧センサ、及び複合機能形差圧センサ
JP3117273B2 (ja) * 1992-03-25 2000-12-11 株式会社東芝 圧力流体用測定器
JPH06116052A (ja) 1992-10-05 1994-04-26 Onoda Cement Co Ltd セラミックスと金属との接合方法
EP0661748A1 (en) * 1993-12-28 1995-07-05 Hitachi, Ltd. Semiconductor device
BR9608062A (pt) 1995-04-28 1999-11-30 Rosemount Inc Conjunto de montagem para um sensor de pressão em um transmissor de pressão, e, processo para ligar um suporte de um transmissor de pressão.
US6453747B1 (en) * 2000-01-12 2002-09-24 Peter A. Weise Hermetic pressure transducer
JP2001330529A (ja) * 2000-05-19 2001-11-30 Yokogawa Electric Corp 圧力センサ
JP2004198147A (ja) * 2002-12-16 2004-07-15 Toyoda Mach Works Ltd 圧力センサ
JP2006078417A (ja) 2004-09-13 2006-03-23 Toyoda Mach Works Ltd 圧力センサ
JP4548066B2 (ja) * 2004-09-24 2010-09-22 株式会社デンソー 圧力センサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459668A (ja) * 1990-06-26 1992-02-26 Nippon Steel Corp セラミックスと金属の接合体
JPH06163211A (ja) * 1992-11-19 1994-06-10 Matsushita Electric Ind Co Ltd 電子部品
JP2002270742A (ja) 2001-03-12 2002-09-20 Unisia Jecs Corp 半導体装置
JP2004037318A (ja) 2002-07-04 2004-02-05 Toyoda Mach Works Ltd 圧力センサ

Also Published As

Publication number Publication date
CN1825079A (zh) 2006-08-30
EP1691182A3 (en) 2007-12-26
JP4768281B2 (ja) 2011-09-07
US20060179954A1 (en) 2006-08-17
EP1691182B1 (en) 2010-06-23
JP2006220430A (ja) 2006-08-24
US7343810B2 (en) 2008-03-18
CN100565152C (zh) 2009-12-02
EP1691182A2 (en) 2006-08-16
KR20060090578A (ko) 2006-08-14

Similar Documents

Publication Publication Date Title
US6550337B1 (en) Isolation technique for pressure sensing structure
CN108106777B (zh) 压力传感器和用于制造压力传感器的方法
EP3719469B1 (en) Pressure sensor with shield structure
KR101311315B1 (ko) 압력 센서 및 그 제조 방법
CN1726385B (zh) 压力传感器
US9144155B2 (en) Sensor comprising a multi-layered ceramic substrate and method for its production
EP2927949B1 (en) Container for housing an electronic component
US9422152B2 (en) Hybridly integrated module having a sealing structure
US10215654B2 (en) Pressure detection unit and pressure sensor using the same
JP2014098685A (ja) 圧力センサーおよび圧力センサーの製造方法
JP2003337075A (ja) 絶対圧型圧力センサ
JP6703850B2 (ja) 圧力検出ユニット及びこれを用いた圧力センサ
US10260979B2 (en) Pressure detection unit, pressure sensor using the same, and method of manufacturing pressure detection unit
JP6166101B2 (ja) 光半導体素子収納用パッケージおよびこれを備えた実装構造体
CN111289149A (zh) 具有外部竖直电互连系统的压力传感器
US12050144B2 (en) Sensor arrangement for measuring the pressure and temperature of refrigerant a fluid
CN109425459B (zh) 传感器
JP5193522B2 (ja) 半導体素子収納用セラミックパッケージとその製造方法
JP4789766B2 (ja) 気密端子およびこれを用いた電気装置
JP2007225360A (ja) 圧力センサ
JP2020008396A (ja) 圧力センサ
JP2020060384A (ja) 圧力検出ユニット及びこれを備えた圧力センサ
JP2010245475A (ja) ウェハパッケージおよびその製造方法
JP2007311434A (ja) 電子装置用ステムとその製造方法
JP2008311659A (ja) 特に電子パッケージに適したヘッダー

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

N231 Notification of change of applicant
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

AMND Amendment
J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20160917

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20160917

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000