KR101271814B1 - 도전 입자 - Google Patents

도전 입자 Download PDF

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Publication number
KR101271814B1
KR101271814B1 KR1020127001656A KR20127001656A KR101271814B1 KR 101271814 B1 KR101271814 B1 KR 101271814B1 KR 1020127001656 A KR1020127001656 A KR 1020127001656A KR 20127001656 A KR20127001656 A KR 20127001656A KR 101271814 B1 KR101271814 B1 KR 101271814B1
Authority
KR
South Korea
Prior art keywords
particle
conductive
plastic
particles
polymer electrolyte
Prior art date
Application number
KR1020127001656A
Other languages
English (en)
Korean (ko)
Other versions
KR20120039656A (ko
Inventor
겐지 다카이
구니히코 아카이
유우코 나가하라
미츠하루 마츠자와
Original Assignee
히타치가세이가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히타치가세이가부시끼가이샤 filed Critical 히타치가세이가부시끼가이샤
Publication of KR20120039656A publication Critical patent/KR20120039656A/ko
Application granted granted Critical
Publication of KR101271814B1 publication Critical patent/KR101271814B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
KR1020127001656A 2009-07-02 2010-07-02 도전 입자 KR101271814B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2009-158180 2009-07-02
JPJP-P-2009-158182 2009-07-02
JP2009158180 2009-07-02
JP2009158182 2009-07-02
PCT/JP2010/061333 WO2011002084A1 (fr) 2009-07-02 2010-07-02 Particule conductrice

Publications (2)

Publication Number Publication Date
KR20120039656A KR20120039656A (ko) 2012-04-25
KR101271814B1 true KR101271814B1 (ko) 2013-06-07

Family

ID=43411152

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127001656A KR101271814B1 (ko) 2009-07-02 2010-07-02 도전 입자

Country Status (3)

Country Link
KR (1) KR101271814B1 (fr)
CN (1) CN102474024B (fr)
WO (1) WO2011002084A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013108740A1 (fr) * 2012-01-19 2013-07-25 積水化学工業株式会社 Particules conductrices, matériau conducteur et structure de connexion
JP2016089153A (ja) * 2014-10-29 2016-05-23 デクセリアルズ株式会社 導電材料
KR102545861B1 (ko) * 2014-10-29 2023-06-21 데쿠세리아루즈 가부시키가이샤 도전 재료
JP6482384B2 (ja) * 2015-05-28 2019-03-13 旭化成株式会社 複合粒子及びこれを含有する水性分散液
JP7016611B2 (ja) * 2015-09-24 2022-02-07 積水化学工業株式会社 導電性粒子、導電材料、および接続構造体
CN105513673B (zh) * 2016-02-03 2017-07-07 郑州职业技术学院 一种导电粒子及其制备方法
WO2017138482A1 (fr) * 2016-02-10 2017-08-17 日立化成株式会社 Particules conductrices, particules conductrices revêtues isolées, adhésif conducteur anisotrope, structure connectée et procédé de préparation de particules conductrices
WO2017138485A1 (fr) * 2016-02-10 2017-08-17 日立化成株式会社 Particule conductrice, particule conductrice à revêtement isolant, adhésif conducteur anisotrope, structure de liaison et procédé de fabrication d'une particule conductrice
JP7028641B2 (ja) * 2016-05-19 2022-03-02 積水化学工業株式会社 導電材料及び接続構造体
CN112740483B (zh) * 2018-10-03 2023-07-14 迪睿合株式会社 各向异性导电薄膜、连接结构体、连接结构体的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007058159A1 (fr) 2005-11-18 2007-05-24 Hitachi Chemical Company, Ltd. Composition d'adhésif, matériau de connexion de circuits, structure de connexion et procédé de connexion d'éléments de circuits
WO2009063827A1 (fr) 2007-11-12 2009-05-22 Hitachi Chemical Company, Ltd. Matériau de connexion de circuit et structure pour connecter un élément de circuit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3379456B2 (ja) * 1998-12-25 2003-02-24 ソニーケミカル株式会社 異方導電性接着フィルム
EP1310992A1 (fr) * 2000-06-14 2003-05-14 Sekisui Chemical Co., Ltd. Film muni de microparticules, film pour connexions electriques, et procede de depot de microparticules
JP2004164874A (ja) * 2002-11-08 2004-06-10 Osugi Kk 異方性導電接着剤用導電微粒子
JP2005108870A (ja) * 2003-09-26 2005-04-21 Sekisui Chem Co Ltd Ｉｃチップ、ｉｃチップの製造方法、半導体パッケージ及び液晶表示装置
JP4563110B2 (ja) * 2004-08-20 2010-10-13 積水化学工業株式会社 導電性微粒子の製造方法
JP2006331714A (ja) * 2005-05-24 2006-12-07 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2007035574A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007058159A1 (fr) 2005-11-18 2007-05-24 Hitachi Chemical Company, Ltd. Composition d'adhésif, matériau de connexion de circuits, structure de connexion et procédé de connexion d'éléments de circuits
WO2009063827A1 (fr) 2007-11-12 2009-05-22 Hitachi Chemical Company, Ltd. Matériau de connexion de circuit et structure pour connecter un élément de circuit

Also Published As

Publication number Publication date
CN102474024B (zh) 2014-09-17
KR20120039656A (ko) 2012-04-25
CN102474024A (zh) 2012-05-23
WO2011002084A1 (fr) 2011-01-06

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