KR101260752B1 - 레이저 가공 방법 - Google Patents

레이저 가공 방법 Download PDF

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Publication number
KR101260752B1
KR101260752B1 KR1020097012900A KR20097012900A KR101260752B1 KR 101260752 B1 KR101260752 B1 KR 101260752B1 KR 1020097012900 A KR1020097012900 A KR 1020097012900A KR 20097012900 A KR20097012900 A KR 20097012900A KR 101260752 B1 KR101260752 B1 KR 101260752B1
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KR
South Korea
Prior art keywords
laser
pulses
substrate
pulse
processing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020097012900A
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English (en)
Korean (ko)
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KR20090104003A (ko
Inventor
케일 듄
폴론 칠리안 오'브라이언
Original Assignee
일렉트로 사이언티픽 인더스트리즈, 아이엔씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 일렉트로 사이언티픽 인더스트리즈, 아이엔씨 filed Critical 일렉트로 사이언티픽 인더스트리즈, 아이엔씨
Publication of KR20090104003A publication Critical patent/KR20090104003A/ko
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Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
KR1020097012900A 2006-11-27 2007-11-27 레이저 가공 방법 Expired - Fee Related KR101260752B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0623642A GB2444037A (en) 2006-11-27 2006-11-27 Laser Machining
GB0623642.6 2006-11-27
PCT/EP2007/010291 WO2008064863A1 (en) 2006-11-27 2007-11-27 Laser machining

Publications (2)

Publication Number Publication Date
KR20090104003A KR20090104003A (ko) 2009-10-05
KR101260752B1 true KR101260752B1 (ko) 2013-05-06

Family

ID=37636595

Family Applications (1)

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KR1020097012900A Expired - Fee Related KR101260752B1 (ko) 2006-11-27 2007-11-27 레이저 가공 방법

Country Status (8)

Country Link
US (1) US7947575B2 (enExample)
EP (1) EP2097209B1 (enExample)
JP (1) JP2010510885A (enExample)
KR (1) KR101260752B1 (enExample)
CN (1) CN101657292B (enExample)
GB (1) GB2444037A (enExample)
TW (1) TWI448345B (enExample)
WO (1) WO2008064863A1 (enExample)

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US8319146B2 (en) * 2009-05-05 2012-11-27 General Electric Company Method and apparatus for laser cutting a trench
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
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JP5620669B2 (ja) * 2009-10-26 2014-11-05 東芝機械株式会社 レーザダイシング方法およびレーザダイシング装置
JP4961468B2 (ja) * 2009-10-29 2012-06-27 三星ダイヤモンド工業株式会社 レーザー加工方法、被加工物の分割方法およびレーザー加工装置
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US9435035B2 (en) 2010-01-15 2016-09-06 Byd Company Limited Metalized plastic articles and methods thereof
JP5452247B2 (ja) * 2010-01-21 2014-03-26 東芝機械株式会社 レーザダイシング装置
CN102071424B (zh) 2010-02-26 2012-05-09 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
US7977213B1 (en) * 2010-03-31 2011-07-12 Electro Scientific Industries, Inc. Use of laser energy transparent stop layer to achieve minimal debris generation in laser scribing a multilayer patterned workpiece
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
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US8804102B2 (en) * 2010-05-19 2014-08-12 Materials Solutions Laser scan speed calibration
JP2012000640A (ja) * 2010-06-17 2012-01-05 Omron Corp レーザ加工装置およびレーザ加工方法
JP5981094B2 (ja) 2010-06-24 2016-08-31 東芝機械株式会社 ダイシング方法
CN102071411B (zh) 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
KR102383125B1 (ko) * 2010-10-22 2022-04-08 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법
CN102637639A (zh) * 2011-02-12 2012-08-15 安徽三安光电有限公司 一种劈裂半导体芯片或其封装基板的方法
JP5140198B1 (ja) 2011-07-27 2013-02-06 東芝機械株式会社 レーザダイシング方法
CN102489884A (zh) * 2011-12-02 2012-06-13 深圳光韵达光电科技股份有限公司 一种激光切割圆孔或椭圆孔的方法
CN103212859A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 一种激光切割厚材料的方法
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
JP2014011358A (ja) 2012-06-29 2014-01-20 Toshiba Mach Co Ltd レーザダイシング方法
KR101213958B1 (ko) * 2012-10-12 2012-12-20 주식회사 엘티에스 레이저를 이용한 내장형 안테나 제조방법
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KR20150097475A (ko) * 2012-12-20 2015-08-26 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 미세기계가공에 의한 이미지 형성 방법
US20140268134A1 (en) * 2013-03-15 2014-09-18 Electro Scientific Industries, Inc. Laser sampling methods for reducing thermal effects
KR101999336B1 (ko) * 2013-04-09 2019-07-11 엘지디스플레이 주식회사 액정표시장치 및 그 제조 방법
US10851884B2 (en) 2014-03-14 2020-12-01 ZPE Licensing Inc. Super charger components
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DE102014210611A1 (de) * 2014-06-04 2015-12-17 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Markieren eines DataMatrix-Codes auf einem Werkstück mittels eines Laserstrahls
US10328529B2 (en) 2015-08-26 2019-06-25 Electro Scientific Industries, Inc Laser scan sequencing and direction with respect to gas flow
US10794663B2 (en) * 2017-05-11 2020-10-06 ZPE Licensing Inc. Laser induced friction surface on firearm
US10640837B2 (en) * 2017-09-27 2020-05-05 Faurecia Interior Systems, Inc. Vehicle interior panel with laser-formed tear seam
CN109048047B (zh) * 2018-07-09 2020-09-25 江苏峰钛激光科技有限公司 一种硬脆材料的激光打标方法
DE102018120763A1 (de) * 2018-08-24 2020-02-27 Jenoptik Automatisierungstechnik Gmbh Verfahren zur Herstellung wenigstens eines Schlitzes in ein flächenhaftes Werkstück mittels Laserstrahl
CN109262147A (zh) * 2018-09-29 2019-01-25 北京工业大学 一种陶瓷增强金属基复合材料脉冲激光刻蚀加工方法
CN109530928B (zh) * 2018-12-27 2021-03-05 北京中科镭特电子有限公司 一种激光加工芯片的方法及装置
CN109530929B (zh) * 2018-12-27 2021-03-19 北京中科镭特电子有限公司 一种激光加工芯片的方法
CN110681988A (zh) * 2019-09-17 2020-01-14 北京兆维电子(集团)有限责任公司 一种激光加工方法及系统
CN111992545B (zh) * 2020-08-28 2023-09-08 格力电器（武汉）有限公司 一种热水器内胆下环缝氧化皮清洗装置及清洗方法
KR102311246B1 (ko) * 2021-01-28 2021-10-14 이노덴 주식회사 유동형 어버트먼트 및 이를 구비한 임플란트
US12368053B2 (en) * 2022-01-06 2025-07-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for laser drilling process for an integrated circuit package
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US12384009B2 (en) 2022-11-15 2025-08-12 ZPE Licensing Inc. Socket with laser induced friction surfaces
CN117718611A (zh) * 2024-01-22 2024-03-19 华中科技大学 一种间隔脉冲与扫描轨迹的协同激光制孔方法及系统
CN118559190B (zh) * 2024-07-31 2025-03-07 北京镭科光电科技有限公司 一种提升分布密度的焦点平移方法及相应的激光加工装置
CN119347171A (zh) * 2024-10-28 2025-01-24 河北工程大学 一种脉冲激光打孔方法

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Also Published As

Publication number Publication date
WO2008064863A1 (en) 2008-06-05
EP2097209B1 (en) 2014-04-09
TWI448345B (zh) 2014-08-11
US20100099239A1 (en) 2010-04-22
GB2444037A (en) 2008-05-28
CN101657292A (zh) 2010-02-24
CN101657292B (zh) 2016-03-16
EP2097209A1 (en) 2009-09-09
TW200922727A (en) 2009-06-01
GB0623642D0 (en) 2007-01-03
KR20090104003A (ko) 2009-10-05
US7947575B2 (en) 2011-05-24
JP2010510885A (ja) 2010-04-08

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