JP2010510885A - レーザ加工 - Google Patents

レーザ加工 Download PDF

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Publication number
JP2010510885A
JP2010510885A JP2009537562A JP2009537562A JP2010510885A JP 2010510885 A JP2010510885 A JP 2010510885A JP 2009537562 A JP2009537562 A JP 2009537562A JP 2009537562 A JP2009537562 A JP 2009537562A JP 2010510885 A JP2010510885 A JP 2010510885A
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JP
Japan
Prior art keywords
laser
substrate
pulses
processing
pulse
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009537562A
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English (en)
Japanese (ja)
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JP2010510885A5 (enExample
Inventor
ダン、カリ
ファロン、キリアン オブライアン
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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Application filed by エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド filed Critical エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Publication of JP2010510885A publication Critical patent/JP2010510885A/ja
Publication of JP2010510885A5 publication Critical patent/JP2010510885A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
JP2009537562A 2006-11-27 2007-11-27 レーザ加工 Pending JP2010510885A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0623642A GB2444037A (en) 2006-11-27 2006-11-27 Laser Machining
PCT/EP2007/010291 WO2008064863A1 (en) 2006-11-27 2007-11-27 Laser machining

Publications (2)

Publication Number Publication Date
JP2010510885A true JP2010510885A (ja) 2010-04-08
JP2010510885A5 JP2010510885A5 (enExample) 2011-01-13

Family

ID=37636595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009537562A Pending JP2010510885A (ja) 2006-11-27 2007-11-27 レーザ加工

Country Status (8)

Country Link
US (1) US7947575B2 (enExample)
EP (1) EP2097209B1 (enExample)
JP (1) JP2010510885A (enExample)
KR (1) KR101260752B1 (enExample)
CN (1) CN101657292B (enExample)
GB (1) GB2444037A (enExample)
TW (1) TWI448345B (enExample)
WO (1) WO2008064863A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014500147A (ja) * 2010-10-22 2014-01-09 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法
JP2016505390A (ja) * 2012-12-20 2016-02-25 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ微細加工によりイメージを形成する方法
US10391585B2 (en) 2009-05-28 2019-08-27 Electro Scientific Industries, Inc Acousto-optic deflector applications in laser processing of dielectric or other materials

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US8536054B2 (en) * 2008-01-18 2013-09-17 Miasole Laser polishing of a solar cell substrate
US8546172B2 (en) 2008-01-18 2013-10-01 Miasole Laser polishing of a back contact of a solar cell
US8586398B2 (en) * 2008-01-18 2013-11-19 Miasole Sodium-incorporation in solar cell substrates and contacts
US20100252959A1 (en) * 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
US8319146B2 (en) * 2009-05-05 2012-11-27 General Electric Company Method and apparatus for laser cutting a trench
DE102009044316B4 (de) 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
JP5620669B2 (ja) * 2009-10-26 2014-11-05 東芝機械株式会社 レーザダイシング方法およびレーザダイシング装置
JP4961468B2 (ja) * 2009-10-29 2012-06-27 三星ダイヤモンド工業株式会社 レーザー加工方法、被加工物の分割方法およびレーザー加工装置
EP2584064B1 (en) * 2009-12-17 2015-07-29 BYD Company Limited Surface metallizing method, method for preparing plastic article and plastic article made therefrom
US9435035B2 (en) 2010-01-15 2016-09-06 Byd Company Limited Metalized plastic articles and methods thereof
JP5452247B2 (ja) * 2010-01-21 2014-03-26 東芝機械株式会社 レーザダイシング装置
CN102071424B (zh) 2010-02-26 2012-05-09 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
US7977213B1 (en) * 2010-03-31 2011-07-12 Electro Scientific Industries, Inc. Use of laser energy transparent stop layer to achieve minimal debris generation in laser scribing a multilayer patterned workpiece
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
TW201134596A (en) * 2010-04-15 2011-10-16 Epileds Technologies Inc Laser processing method
US8804102B2 (en) * 2010-05-19 2014-08-12 Materials Solutions Laser scan speed calibration
JP2012000640A (ja) * 2010-06-17 2012-01-05 Omron Corp レーザ加工装置およびレーザ加工方法
JP5981094B2 (ja) 2010-06-24 2016-08-31 東芝機械株式会社 ダイシング方法
CN102071411B (zh) 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
CN102637639A (zh) * 2011-02-12 2012-08-15 安徽三安光电有限公司 一种劈裂半导体芯片或其封装基板的方法
JP5140198B1 (ja) 2011-07-27 2013-02-06 東芝機械株式会社 レーザダイシング方法
CN102489884A (zh) * 2011-12-02 2012-06-13 深圳光韵达光电科技股份有限公司 一种激光切割圆孔或椭圆孔的方法
CN103212859A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 一种激光切割厚材料的方法
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
JP2014011358A (ja) 2012-06-29 2014-01-20 Toshiba Mach Co Ltd レーザダイシング方法
KR101213958B1 (ko) * 2012-10-12 2012-12-20 주식회사 엘티에스 레이저를 이용한 내장형 안테나 제조방법
EP3336195B1 (en) 2012-12-20 2020-02-26 3M Innovative Properties Company Method of differentiating microbial colonies in an image
US20140268134A1 (en) * 2013-03-15 2014-09-18 Electro Scientific Industries, Inc. Laser sampling methods for reducing thermal effects
KR101999336B1 (ko) * 2013-04-09 2019-07-11 엘지디스플레이 주식회사 액정표시장치 및 그 제조 방법
US10851884B2 (en) 2014-03-14 2020-12-01 ZPE Licensing Inc. Super charger components
US11041558B2 (en) 2014-03-14 2021-06-22 ZPE Licensing Inc. Super charger components
DE102014210611A1 (de) * 2014-06-04 2015-12-17 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Markieren eines DataMatrix-Codes auf einem Werkstück mittels eines Laserstrahls
US10328529B2 (en) 2015-08-26 2019-06-25 Electro Scientific Industries, Inc Laser scan sequencing and direction with respect to gas flow
US10794663B2 (en) * 2017-05-11 2020-10-06 ZPE Licensing Inc. Laser induced friction surface on firearm
US10640837B2 (en) * 2017-09-27 2020-05-05 Faurecia Interior Systems, Inc. Vehicle interior panel with laser-formed tear seam
CN109048047B (zh) * 2018-07-09 2020-09-25 江苏峰钛激光科技有限公司 一种硬脆材料的激光打标方法
DE102018120763A1 (de) * 2018-08-24 2020-02-27 Jenoptik Automatisierungstechnik Gmbh Verfahren zur Herstellung wenigstens eines Schlitzes in ein flächenhaftes Werkstück mittels Laserstrahl
CN109262147A (zh) * 2018-09-29 2019-01-25 北京工业大学 一种陶瓷增强金属基复合材料脉冲激光刻蚀加工方法
CN109530928B (zh) * 2018-12-27 2021-03-05 北京中科镭特电子有限公司 一种激光加工芯片的方法及装置
CN109530929B (zh) * 2018-12-27 2021-03-19 北京中科镭特电子有限公司 一种激光加工芯片的方法
CN110681988A (zh) * 2019-09-17 2020-01-14 北京兆维电子(集团)有限责任公司 一种激光加工方法及系统
CN111992545B (zh) * 2020-08-28 2023-09-08 格力电器（武汉）有限公司 一种热水器内胆下环缝氧化皮清洗装置及清洗方法
KR102311246B1 (ko) * 2021-01-28 2021-10-14 이노덴 주식회사 유동형 어버트먼트 및 이를 구비한 임플란트
US12368053B2 (en) * 2022-01-06 2025-07-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for laser drilling process for an integrated circuit package
US12209619B2 (en) 2022-04-20 2025-01-28 ZPE Licensing Inc. Electromagnetic clutch
US12384009B2 (en) 2022-11-15 2025-08-12 ZPE Licensing Inc. Socket with laser induced friction surfaces
CN117718611A (zh) * 2024-01-22 2024-03-19 华中科技大学 一种间隔脉冲与扫描轨迹的协同激光制孔方法及系统
CN118559190B (zh) * 2024-07-31 2025-03-07 北京镭科光电科技有限公司 一种提升分布密度的焦点平移方法及相应的激光加工装置
CN119347171A (zh) * 2024-10-28 2025-01-24 河北工程大学 一种脉冲激光打孔方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10391585B2 (en) 2009-05-28 2019-08-27 Electro Scientific Industries, Inc Acousto-optic deflector applications in laser processing of dielectric or other materials
US11738405B2 (en) 2009-05-28 2023-08-29 Electro Scientific Industries, Inc. Acousto-optic deflector applications in laser processing of dielectric or other materials
JP2014500147A (ja) * 2010-10-22 2014-01-09 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法
JP2016505390A (ja) * 2012-12-20 2016-02-25 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ微細加工によりイメージを形成する方法

Also Published As

Publication number Publication date
WO2008064863A1 (en) 2008-06-05
EP2097209B1 (en) 2014-04-09
TWI448345B (zh) 2014-08-11
US20100099239A1 (en) 2010-04-22
GB2444037A (en) 2008-05-28
KR101260752B1 (ko) 2013-05-06
CN101657292A (zh) 2010-02-24
CN101657292B (zh) 2016-03-16
EP2097209A1 (en) 2009-09-09
TW200922727A (en) 2009-06-01
GB0623642D0 (en) 2007-01-03
KR20090104003A (ko) 2009-10-05
US7947575B2 (en) 2011-05-24

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