KR101259218B9 - 반도체 처리 툴의 용량성 거리 감지 장치 및 방법 - Google Patents

반도체 처리 툴의 용량성 거리 감지 장치 및 방법

Info

Publication number
KR101259218B9
KR101259218B9 KR20087020558A KR20087020558A KR101259218B9 KR 101259218 B9 KR101259218 B9 KR 101259218B9 KR 20087020558 A KR20087020558 A KR 20087020558A KR 20087020558 A KR20087020558 A KR 20087020558A KR 101259218 B9 KR101259218 B9 KR 101259218B9
Authority
KR
South Korea
Prior art keywords
semiconductor processing
processing tools
distance sensing
capacitive distance
capacitive
Prior art date
Application number
KR20087020558A
Other languages
English (en)
Other versions
KR20080110732A (ko
KR101259218B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed filed Critical
Publication of KR20080110732A publication Critical patent/KR20080110732A/ko
Application granted granted Critical
Publication of KR101259218B1 publication Critical patent/KR101259218B1/ko
Publication of KR101259218B9 publication Critical patent/KR101259218B9/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/023—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G01D5/241—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
    • G01D5/2417—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying separation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
KR1020087020558A 2006-02-21 2007-02-20 반도체 처리 툴의 용량성 거리 감지 장치 및 방법 KR101259218B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US77539406P 2006-02-21 2006-02-21
US77530806P 2006-02-21 2006-02-21
US60/775,308 2006-02-21
US60/775,394 2006-02-21
PCT/US2007/004350 WO2007098149A2 (en) 2006-02-21 2007-02-20 Capacitive distance sensing in semiconductor processing tools

Publications (3)

Publication Number Publication Date
KR20080110732A KR20080110732A (ko) 2008-12-19
KR101259218B1 KR101259218B1 (ko) 2013-04-29
KR101259218B9 true KR101259218B9 (ko) 2021-10-15

Family

ID=38328481

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087020558A KR101259218B1 (ko) 2006-02-21 2007-02-20 반도체 처리 툴의 용량성 거리 감지 장치 및 방법

Country Status (7)

Country Link
US (1) US7804306B2 (ko)
JP (1) JP2009527764A (ko)
KR (1) KR101259218B1 (ko)
CN (1) CN101410690B (ko)
DE (1) DE112007000433T5 (ko)
GB (1) GB2450261A (ko)
WO (1) WO2007098149A2 (ko)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7893697B2 (en) * 2006-02-21 2011-02-22 Cyberoptics Semiconductor, Inc. Capacitive distance sensing in semiconductor processing tools
DE112007002309T5 (de) 2006-09-29 2009-07-30 Cyberoptics Semiconductor, Inc., Beaverton Substratähnlicher Teilchensensor
US20080246493A1 (en) * 2007-04-05 2008-10-09 Gardner Delrae H Semiconductor Processing System With Integrated Showerhead Distance Measuring Device
US20090015268A1 (en) * 2007-07-13 2009-01-15 Gardner Delrae H Device and method for compensating a capacitive sensor measurement for variations caused by environmental conditions in a semiconductor processing environment
JP4968121B2 (ja) * 2008-03-10 2012-07-04 富士通セミコンダクター株式会社 容量センサー
US20110261344A1 (en) * 2009-12-31 2011-10-27 Mapper Lithography Ip B.V. Exposure method
KR101273921B1 (ko) 2013-01-16 2013-06-12 (주)코셈 정전용량 센서 어레이 패널을 이용한 콜렛의 수평도 및 압력 측정 시스템
WO2014144533A1 (en) * 2013-03-15 2014-09-18 Applied Materials, Inc. Position and temperature monitoring of ald platen susceptor
US20140292354A1 (en) * 2013-03-27 2014-10-02 Texas Instruments Incorporated Capacitive sensor
US9443657B1 (en) * 2013-12-10 2016-09-13 Tdk Corporation Piezo controlled variable capacitor
US9474150B2 (en) 2013-12-10 2016-10-18 Tdk Corporation Transmission line filter with tunable capacitor
US9424994B2 (en) 2013-12-10 2016-08-23 Tdk Corporation Tunable interdigitated capacitor
DE102014225057A1 (de) 2014-12-05 2016-06-09 Robert Bosch Gmbh Verfahren und Vorrichtung zum Bestimmen eines Abstands
WO2017195001A1 (en) 2016-05-13 2017-11-16 Arcelormittal Method for obtaining a height of a material stacked in a coke oven
CN108801128A (zh) * 2017-04-28 2018-11-13 中兴通讯股份有限公司 一种空间距离的检测方法及装置
KR102098693B1 (ko) * 2018-01-12 2020-04-08 주식회사 지티에스엠 웨이퍼의 챔버에 대한 갭핑을 감지하는 웨이퍼형 갭핑 감지 센서
CN108413856B (zh) * 2018-05-30 2020-07-10 华中科技大学 一种基于双变压器远距离隔离传输的电容位移传感装置
CN108562216B (zh) * 2018-05-30 2020-07-10 华中科技大学 一种基于变压器初级远距离传输的电容位移传感装置
US11521872B2 (en) 2018-09-04 2022-12-06 Applied Materials, Inc. Method and apparatus for measuring erosion and calibrating position for a moving process kit
US11404296B2 (en) 2018-09-04 2022-08-02 Applied Materials, Inc. Method and apparatus for measuring placement of a substrate on a heater pedestal
US10847393B2 (en) * 2018-09-04 2020-11-24 Applied Materials, Inc. Method and apparatus for measuring process kit centering
US11342210B2 (en) 2018-09-04 2022-05-24 Applied Materials, Inc. Method and apparatus for measuring wafer movement and placement using vibration data
US10794681B2 (en) 2018-09-04 2020-10-06 Applied Materials, Inc. Long range capacitive gap measurement in a wafer form sensor system
US10837803B2 (en) * 2019-04-12 2020-11-17 Kla Corporation Inspection system with grounded capacitive sample proximity sensor
US11048361B1 (en) * 2020-04-09 2021-06-29 Alps Alpine Co., Ltd. Systems and methods to create offset signal using sinewave generator with programmable amplitude and phase

Family Cites Families (156)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE358801B (ko) * 1971-10-13 1973-08-06 Ericsson Telefon Ab L M
DE2158320B2 (de) * 1971-11-24 1980-04-10 Ferdy Dr. Grenoble Mayer (Frankreich) Vorrichtung zur berührungsfreien relativen Abstandsmessung
FR2206544B1 (ko) * 1972-11-10 1976-12-31 Trt Telecom Radio Electr
JPS5125153A (ja) * 1974-08-27 1976-03-01 Kenji Ikeda Henikenshutsusochi
US4074114A (en) * 1976-03-12 1978-02-14 Monarch Marking Systems, Inc. Bar code and method and apparatus for interpreting the same
US4119381A (en) * 1976-12-17 1978-10-10 Eastman Kodak Company Incubator and radiometric scanner
US4180199A (en) 1978-02-27 1979-12-25 Hollis Engineering, Inc. Mass soldering control system
JPS6316993Y2 (ko) * 1981-05-25 1988-05-13
US5506682A (en) * 1982-02-16 1996-04-09 Sensor Adaptive Machines Inc. Robot vision using targets
US4528451A (en) * 1982-10-19 1985-07-09 Varian Associates, Inc. Gap control system for localized vacuum processing
US4753569A (en) * 1982-12-28 1988-06-28 Diffracto, Ltd. Robot calibration
US4633578A (en) * 1983-12-01 1987-01-06 Aine Harry E Miniature thermal fluid flow sensors and batch methods of making same
CA1239785A (en) 1984-03-14 1988-08-02 John R. Shambroom Capacitance height gage applied in reticle position detection system for electron beam lithography apparatus
US5267143A (en) 1984-10-12 1993-11-30 Sensor Adaptive Machines, Incorporated Vision assisted fixture construction
US5374830A (en) 1984-10-12 1994-12-20 Sensor Adaptive Machines, Inc. Target based determination of robot and sensor alignment
US4701096A (en) * 1986-03-05 1987-10-20 Btu Engineering Corporation Wafer handling station
US4918627A (en) * 1986-08-04 1990-04-17 Fmc Corporation Computer integrated gaging system
US4791482A (en) 1987-02-06 1988-12-13 Westinghouse Electric Corp. Object locating system
US5232331A (en) * 1987-08-07 1993-08-03 Canon Kabushiki Kaisha Automatic article feeding system
JP2518301B2 (ja) * 1987-09-11 1996-07-24 株式会社ニコン 間隔測定装置
US5435682A (en) * 1987-10-15 1995-07-25 Advanced Semiconductor Materials America, Inc. Chemical vapor desposition system
DE3838032A1 (de) * 1987-11-09 1989-05-24 Hitachi Ltd Verfahren und einrichtung zur strukturpruefung
US4843287A (en) * 1987-12-31 1989-06-27 Westinghouse Electric Corp. Path contriving system for look-ahead sensor in a robotic control system
JP2768961B2 (ja) * 1988-12-26 1998-06-25 東陶機器株式会社 位置検出機能を有する圧電アクチュエータ
US5248553A (en) * 1989-03-16 1993-09-28 Toyo Ink Manufacturing Co., Ltd. Coated molded article
US5055637A (en) * 1989-05-02 1991-10-08 Hagner George R Circuit boards with recessed traces
US4985601A (en) * 1989-05-02 1991-01-15 Hagner George R Circuit boards with recessed traces
DE4042336A1 (de) * 1990-02-12 1991-08-14 Fraunhofer Ges Forschung Drucksensoranordnung mit einem drucksensor und einem referenzelement
JPH04348031A (ja) * 1990-12-28 1992-12-03 Mitsubishi Electric Corp 化学気相成長装置
US5298368A (en) * 1991-04-23 1994-03-29 Eastman Kodak Company Photographic coupler compositions and methods for reducing continued coupling
US5076794A (en) 1991-04-29 1991-12-31 Compaq Computer Corporation Space-saving mounting interconnection between electrical components and a printed circuit board
US5298363A (en) 1991-06-17 1994-03-29 Eastman Kodak Company Photolithographically patterned fluorescent coating
US5175601A (en) 1991-10-15 1992-12-29 Electro-Optical Information Systems High-speed 3-D surface measurement surface inspection and reverse-CAD system
JP3029916B2 (ja) 1992-03-07 2000-04-10 キヤノン株式会社 情報処理装置
EP0566156B1 (en) * 1992-04-17 1997-08-27 Terumo Kabushiki Kaisha Infrared sensor and method for production thereof
FR2692047B1 (fr) 1992-06-04 1995-08-04 Gaz De France Capteur de detection selective de gaz et dispositif pour sa mise en óoeuvre.
US5265957A (en) * 1992-08-11 1993-11-30 Texas Instruments Incorporated Wireless temperature calibration device and method
US5742702A (en) 1992-10-01 1998-04-21 Sony Corporation Neural network for character recognition and verification
DE69326213T2 (de) * 1992-11-17 1999-12-30 Seiko Epson Corp Optischer Abtastkopf
US5393706A (en) * 1993-01-07 1995-02-28 Texas Instruments Incorporated Integrated partial sawing process
US5382911A (en) * 1993-03-29 1995-01-17 International Business Machines Corporation Reaction chamber interelectrode gap monitoring by capacitance measurement
FR2706345B1 (fr) 1993-06-11 1995-09-22 Bertin & Cie Procédé et dispositif de repérage dans l'espace d'un objet mobile tel qu'un capteur ou un outil porté par un robot.
US5444637A (en) * 1993-09-28 1995-08-22 Advanced Micro Devices, Inc. Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed
FI93580C (fi) * 1993-10-08 1995-04-25 Vaisala Oy Menetelmä ja laitteisto epäsymmetrisen paine-eroanturin takaisinkytkemiseksi
JPH07152019A (ja) * 1993-11-30 1995-06-16 Matsushita Electric Ind Co Ltd 液晶表示装置
IT1267375B1 (it) * 1994-01-31 1997-02-05 Olivetti & Co Spa Elaboratore elettronico
KR0133481B1 (ko) * 1994-03-10 1998-04-23 구자홍 평면마이크로 가공기술을 이용한 적외선어레이센서 제조방법
JPH07295736A (ja) * 1994-04-25 1995-11-10 Sony Corp ３次元位置検出装置
US6129278A (en) * 1994-05-19 2000-10-10 Metanetics Corporation Detecting image cell position with subpixel accuracy
JP3402750B2 (ja) * 1994-05-25 2003-05-06 キヤノン株式会社 位置合わせ方法及びそれを用いた素子の製造方法
US5442297A (en) * 1994-06-30 1995-08-15 International Business Machines Corporation Contactless sheet resistance measurement method and apparatus
JP3214783B2 (ja) 1994-07-25 2001-10-02 本田技研工業株式会社 燃料タンクの支持構造
KR0122284Y1 (ko) * 1995-04-13 1998-08-17 정문술 반도체 소자테스트용 금속트레이 유니트
US5619027A (en) * 1995-05-04 1997-04-08 Intermec Corporation Single width bar code symbology with full character set utilizing robust start/stop characters and error detection scheme
NO301999B1 (no) 1995-10-12 1998-01-05 Metronor As Kombinasjon av laser tracker og kamerabasert koordinatmåling
US6010009A (en) * 1995-10-13 2000-01-04 Empak, Inc. Shipping and transport cassette with kinematic coupling
US5719937A (en) * 1995-12-06 1998-02-17 Solana Technology Develpment Corporation Multi-media copy management system
US5798556A (en) 1996-03-25 1998-08-25 Motorola, Inc. Sensor and method of fabrication
JPH09257618A (ja) * 1996-03-26 1997-10-03 Toyota Central Res & Dev Lab Inc 静電容量型圧力センサおよびその製造方法
US6011294A (en) * 1996-04-08 2000-01-04 Eastman Kodak Company Low cost CCD packaging
US5642293A (en) 1996-06-03 1997-06-24 Camsys, Inc. Method and apparatus for determining surface profile and/or surface strain
NO303595B1 (no) * 1996-07-22 1998-08-03 Metronor Asa System og fremgangsmÕte for bestemmelse av romlige koordinater
US5962909A (en) 1996-09-12 1999-10-05 Institut National D'optique Microstructure suspended by a microsupport
JP4086936B2 (ja) * 1996-10-03 2008-05-14 株式会社ブリヂストン ダミーウェハ
JPH10172890A (ja) 1996-12-12 1998-06-26 Nikon Corp 投影露光方法
FR2760277B1 (fr) * 1997-02-28 1999-03-26 Commissariat Energie Atomique Procede et dispositif de localisation d'un objet dans l'espace
US6106457A (en) * 1997-04-04 2000-08-22 Welch Allyn, Inc. Compact imaging instrument system
US5805289A (en) 1997-07-07 1998-09-08 General Electric Company Portable measurement system using image and point measurement devices
US5969639A (en) * 1997-07-28 1999-10-19 Lockheed Martin Energy Research Corporation Temperature measuring device
US6561428B2 (en) * 1997-10-17 2003-05-13 Hand Held Products, Inc. Imaging device having indicia-controlled image parsing mode
US6985169B1 (en) * 1998-02-09 2006-01-10 Lenovo (Singapore) Pte. Ltd. Image capture system for mobile communications
US6244121B1 (en) 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US6232615B1 (en) 1998-03-31 2001-05-15 Asm Lithography B.V. Lithographic projection apparatus with improved substrate holder
US6476825B1 (en) 1998-05-13 2002-11-05 Clemens Croy Hand-held video viewer and remote control device
JPH11340009A (ja) * 1998-05-25 1999-12-10 Toshiba Corp 非直線抵抗体
US6075909A (en) * 1998-06-26 2000-06-13 Lucent Technologies, Inc. Optical monitoring system for III-V wafer processing
US6175124B1 (en) * 1998-06-30 2001-01-16 Lsi Logic Corporation Method and apparatus for a wafer level system
US6325536B1 (en) 1998-07-10 2001-12-04 Sensarray Corporation Integrated wafer temperature sensors
US6535650B1 (en) * 1998-07-21 2003-03-18 Intel Corporation Creating high resolution images
US6352466B1 (en) 1998-08-31 2002-03-05 Micron Technology, Inc. Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
JP2000082244A (ja) * 1998-09-04 2000-03-21 Canon Inc ２平面を平行制御する情報処理装置、および情報処理方法
US6628803B1 (en) 1998-11-25 2003-09-30 Pentax Corporation Device for calculating positional data of standard points of photogrammetric target
JP2000227326A (ja) * 1998-12-02 2000-08-15 Nikon Corp 平坦度測定装置
TW364054B (en) * 1998-12-31 1999-07-11 United Microelectronics Corp Measurement tool for distance between shower head and heater platform
JP4794708B2 (ja) * 1999-02-04 2011-10-19 オリンパス株式会社 ３次元位置姿勢センシング装置
JP2000241102A (ja) * 1999-02-24 2000-09-08 Tohoku Electric Power Co Inc 充電部距離測定方法および充電部近接警報装置
US6480537B1 (en) 1999-02-25 2002-11-12 Telcordia Technologies, Inc. Active techniques for video transmission and playback
US6526668B1 (en) * 1999-03-11 2003-03-04 Microtool, Inc. Electronic level
US6275742B1 (en) * 1999-04-16 2001-08-14 Berkeley Process Control, Inc. Wafer aligner system
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
FR2793990B1 (fr) * 1999-05-19 2001-07-27 Sagem Boitier electronique sur plaque et procede de fabrication d'un tel boitier
GB9915882D0 (en) 1999-07-08 1999-09-08 British Aerospace Method and apparatus for calibrating positions of a plurality of first light sources on a first part
US6206441B1 (en) * 1999-08-03 2001-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for transferring wafers by robot
US6625305B1 (en) * 1999-08-16 2003-09-23 Hewlett-Packard Development Company, L.P. Image demosaicing method
US6373271B1 (en) * 1999-12-29 2002-04-16 Motorola, Inc. Semiconductor wafer front side pressure testing system and method therefor
AT409194B (de) 2000-02-23 2002-06-25 Riegl Laser Measurement Sys Verfahren zur aufnahme eines objektraumes
US7120285B1 (en) 2000-02-29 2006-10-10 Advanced Micro Devices, Inc. Method for evaluation of reticle image using aerial image simulator
JP2001338868A (ja) 2000-03-24 2001-12-07 Nikon Corp 照度計測装置及び露光装置
CA2342095A1 (en) * 2000-03-27 2001-09-27 Symagery Microsystems Inc. Image capture and processing accessory
US20030210041A1 (en) * 2000-04-07 2003-11-13 Le Cuong Duy Eddy current measuring system for monitoring and controlling a chemical vapor deposition (CVD) process
AT412030B (de) * 2000-04-07 2004-08-26 Riegl Laser Measurement Sys Verfahren zur aufnahme eines objektraumes
US6532403B2 (en) * 2000-04-21 2003-03-11 Microtool, Inc Robot alignment system and method
US6952656B1 (en) 2000-04-28 2005-10-04 Applied Materials, Inc. Wafer fabrication data acquisition and management systems
US7414732B2 (en) * 2000-05-16 2008-08-19 Steinbichler Optotechnik Gmbh Method and device for determining the 3D profile of an object
JP2001326162A (ja) * 2000-05-17 2001-11-22 Canon Inc 半導体製造装置および半導体デバイス製造方法
AU2001253547A1 (en) * 2000-05-23 2001-12-03 Atmel Corporation Integrated ic chip package for electronic image sensor die
DE10035192C1 (de) * 2000-07-20 2001-10-11 Carl Mahr Holding Gmbh Kapazitiver Wegaufnehmer für stromsparende Messgeräte
US6990215B1 (en) 2000-07-31 2006-01-24 Geodetic Services, Inc. Photogrammetric measurement system and method
US6691068B1 (en) * 2000-08-22 2004-02-10 Onwafer Technologies, Inc. Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control
EP1184805A1 (en) 2000-08-29 2002-03-06 Motorola, Inc. Electronic device for a wafer container, wafer manufacturing system, and method
US6465281B1 (en) * 2000-09-08 2002-10-15 Motorola, Inc. Method of manufacturing a semiconductor wafer level package
AU2001291082A1 (en) * 2000-09-12 2002-03-26 Transchip Inc Single chip cmos image sensor system with video compression
US6966235B1 (en) 2000-10-06 2005-11-22 Paton Eric N Remote monitoring of critical parameters for calibration of manufacturing equipment and facilities
US6958768B1 (en) * 2000-10-20 2005-10-25 Asti Holdings Limited CMOS inspection apparatus
JP2002134498A (ja) * 2000-10-25 2002-05-10 Sony Corp 成膜方法および成膜装置
US6518775B1 (en) * 2000-11-15 2003-02-11 Promos Technologies Inc. Process for determining spacing between heater and showerhead
KR100471018B1 (ko) * 2000-11-28 2005-03-08 스미도모쥬기가이고교 가부시키가이샤 두 개의 대상물 간의 갭 조절장치 및 조절방법
US6681151B1 (en) 2000-12-15 2004-01-20 Cognex Technology And Investment Corporation System and method for servoing robots based upon workpieces with fiducial marks using machine vision
US6801257B2 (en) 2001-01-12 2004-10-05 Cognitens Ltd. Optical three-dimensional digital imaging and mensuration system for industrial applications
US7391433B2 (en) * 2001-01-30 2008-06-24 Pollack Laboratories, Inc. Monitoring system for hostile environment
NL1017593C2 (nl) * 2001-03-14 2002-09-17 Asm Int Inspectiesysteem ten behoeve van procesapparaten voor het behandelen van substraten, alsmede een sensor bestemd voor een dergelijk inspectiesysteem en een werkwijze voor het inspecteren van procesapparaten.
JP3694808B2 (ja) * 2001-04-13 2005-09-14 株式会社安川電機 ウェハ搬送用ロボットの教示方法および教示用プレート
US6859260B2 (en) * 2001-04-25 2005-02-22 Asml Holding N.V. Method and system for improving focus accuracy in a lithography system
JP4712220B2 (ja) * 2001-05-02 2011-06-29 大亜真空株式会社 圧力測定装置
US6607951B2 (en) 2001-06-26 2003-08-19 United Microelectronics Corp. Method for fabricating a CMOS image sensor
EP1407472A4 (en) 2001-06-28 2009-07-15 Pollack Lab Inc AUTONOMOUS DETECTION APPARATUS AND SYSTEM
US7206080B2 (en) * 2001-07-30 2007-04-17 Topcon Corporation Surface shape measurement apparatus, surface shape measurement method, surface state graphic apparatus
FR2828560B1 (fr) * 2001-08-09 2004-02-20 Schlumberger Services Petrol Capteur resonnant a excitation optique et dispositif de surveillance utilisant ce capteur
JP2003086672A (ja) * 2001-09-06 2003-03-20 Applied Materials Inc リフロー方法及び装置、並びに、膜形成方法及び装置
JP3535137B2 (ja) * 2002-01-23 2004-06-07 濱田重工株式会社 熱電対取り付け構造及び温度センサー
US7035913B2 (en) * 2001-09-28 2006-04-25 Hewlett-Packard Development Company, L.P. System for collection and distribution of calendar information
US6891276B1 (en) * 2002-01-09 2005-05-10 Bridge Semiconductor Corporation Semiconductor package device
US7142500B2 (en) * 2002-01-11 2006-11-28 Hewlett-Packard Development Company, L.P. Sensor with varying capacitance based on relative position between objects
IL147692A0 (en) 2002-01-17 2002-08-14 Innersense Ltd Machine and environment analyzer
CA2369845A1 (en) 2002-01-31 2003-07-31 Braintech, Inc. Method and apparatus for single camera 3d vision guided robotics
US20050233770A1 (en) * 2002-02-06 2005-10-20 Ramsey Craig C Wireless substrate-like sensor
US7289230B2 (en) 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
US20050224902A1 (en) * 2002-02-06 2005-10-13 Ramsey Craig C Wireless substrate-like sensor
US20050224899A1 (en) * 2002-02-06 2005-10-13 Ramsey Craig C Wireless substrate-like sensor
US6836212B2 (en) 2002-10-10 2004-12-28 Motorola, Inc. Method and apparatus for reducing the likelihood of losing a portable electronic device
US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
EP1420264B1 (de) * 2002-11-15 2011-01-05 Leica Geosystems AG Verfahren und Vorrichtung zur Kalibrierung eines Messsystems
US6949938B2 (en) * 2002-11-20 2005-09-27 Taiwan Semiconductor Manufacturing Co., Ltd. Prevention of robot damage via capacitive sensor assembly
US7151366B2 (en) 2002-12-03 2006-12-19 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
US7135852B2 (en) 2002-12-03 2006-11-14 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
US6898558B2 (en) 2002-12-31 2005-05-24 Tokyo Electron Limited Method and apparatus for monitoring a material processing system
JP4067053B2 (ja) * 2003-03-13 2008-03-26 キヤノン株式会社 静電容量センサ式計測装置
US6815958B2 (en) * 2003-02-07 2004-11-09 Multimetrixs, Llc Method and apparatus for measuring thickness of thin films with improved accuracy
JP2004276151A (ja) 2003-03-13 2004-10-07 Yaskawa Electric Corp 搬送用ロボットおよび搬送用ロボットの教示方法
JP4325916B2 (ja) * 2003-04-07 2009-09-02 株式会社坂本電機製作所 水準器
US7144521B2 (en) * 2003-08-22 2006-12-05 Lam Research Corporation High aspect ratio etch using modulation of RF powers of various frequencies
US7059936B2 (en) * 2004-03-23 2006-06-13 Cabot Microelectronics Corporation Low surface energy CMP pad
KR100614801B1 (ko) * 2004-07-05 2006-08-22 삼성전자주식회사 반도체 장치의 막 형성방법
US20060055415A1 (en) * 2004-09-15 2006-03-16 Mark Takita Environmentally compensated capacitive sensor
US8167522B2 (en) * 2005-03-30 2012-05-01 Brooks Automation, Inc. Substrate transport apparatus with active edge gripper
US7682978B2 (en) 2005-06-24 2010-03-23 Tokyo Electron Limited Plasma processing method and high-rate plasma etching apparatus

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US20070222462A1 (en) 2007-09-27
CN101410690A (zh) 2009-04-15
DE112007000433T5 (de) 2009-01-02
JP2009527764A (ja) 2009-07-30
US7804306B2 (en) 2010-09-28
WO2007098149A3 (en) 2008-01-03
KR20080110732A (ko) 2008-12-19
WO2007098149A2 (en) 2007-08-30
KR101259218B1 (ko) 2013-04-29
CN101410690B (zh) 2011-11-23
GB0814226D0 (en) 2008-09-10
GB2450261A (en) 2008-12-17

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