KR101252068B1 - 투명 기판을 위한 통합 계측 챔버 - Google Patents

투명 기판을 위한 통합 계측 챔버 Download PDF

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Publication number
KR101252068B1
KR101252068B1 KR1020060001698A KR20060001698A KR101252068B1 KR 101252068 B1 KR101252068 B1 KR 101252068B1 KR 1020060001698 A KR1020060001698 A KR 1020060001698A KR 20060001698 A KR20060001698 A KR 20060001698A KR 101252068 B1 KR101252068 B1 KR 101252068B1
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KR
South Korea
Prior art keywords
substrate
etch
etch depth
measurement
etching
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020060001698A
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English (en)
Korean (ko)
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KR20060081365A (ko
Inventor
리차드 레윙톤
코레이 콜라드
스코트 앤더슨
크하임 엔구옌
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어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20060081365A publication Critical patent/KR20060081365A/ko
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Publication of KR101252068B1 publication Critical patent/KR101252068B1/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B43—WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
    • B43K—IMPLEMENTS FOR WRITING OR DRAWING
    • B43K29/00—Combinations of writing implements with other articles
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H29/00—Drive mechanisms for toys in general
    • A63H29/24—Details or accessories for drive mechanisms, e.g. means for winding-up or starting toy engines
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H3/00—Dolls
    • A63H3/18—Jumping jacks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020060001698A 2005-01-08 2006-01-06 투명 기판을 위한 통합 계측 챔버 Expired - Fee Related KR101252068B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/031,400 2005-01-08
US11/031,400 US20060154388A1 (en) 2005-01-08 2005-01-08 Integrated metrology chamber for transparent substrates

Publications (2)

Publication Number Publication Date
KR20060081365A KR20060081365A (ko) 2006-07-12
KR101252068B1 true KR101252068B1 (ko) 2013-04-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060001698A Expired - Fee Related KR101252068B1 (ko) 2005-01-08 2006-01-06 투명 기판을 위한 통합 계측 챔버

Country Status (5)

Country Link
US (2) US20060154388A1 (enExample)
EP (1) EP1679548A1 (enExample)
JP (1) JP5392972B2 (enExample)
KR (1) KR101252068B1 (enExample)
TW (1) TWI375288B (enExample)

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US20050197721A1 (en) * 2004-02-20 2005-09-08 Yung-Cheng Chen Control of exposure energy on a substrate
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US8012857B2 (en) * 2007-08-07 2011-09-06 Semiconductor Components Industries, Llc Semiconductor die singulation method
US8859396B2 (en) 2007-08-07 2014-10-14 Semiconductor Components Industries, Llc Semiconductor die singulation method
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US8956809B2 (en) * 2012-08-03 2015-02-17 Applied Materials, Inc. Apparatus and methods for etching quartz substrate in photomask manufacturing applications
US9136173B2 (en) 2012-11-07 2015-09-15 Semiconductor Components Industries, Llc Singulation method for semiconductor die having a layer of material along one major surface
US9484260B2 (en) 2012-11-07 2016-11-01 Semiconductor Components Industries, Llc Heated carrier substrate semiconductor die singulation method
US20150132959A1 (en) * 2013-11-08 2015-05-14 Leonard TEDESCHI Pattern formation and transfer directly on silicon based films
US10840102B2 (en) * 2013-11-27 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated system, integrated system operation method and film treatment method
US9418894B2 (en) 2014-03-21 2016-08-16 Semiconductor Components Industries, Llc Electronic die singulation method
US9385041B2 (en) 2014-08-26 2016-07-05 Semiconductor Components Industries, Llc Method for insulating singulated electronic die
US10095102B2 (en) * 2016-04-12 2018-10-09 Taiwan Semiconductor Manufacturing Co., Ltd. Photomask having a plurality of shielding layers
US10366923B2 (en) 2016-06-02 2019-07-30 Semiconductor Components Industries, Llc Method of separating electronic devices having a back layer and apparatus
US10373869B2 (en) 2017-05-24 2019-08-06 Semiconductor Components Industries, Llc Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus
US12112959B2 (en) 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions
KR102740093B1 (ko) * 2018-12-14 2024-12-06 도쿄엘렉트론가부시키가이샤 조명된 에칭 용액을 사용하여 재료의 거칠기를 감소시키기 위한 공정 시스템 및 플랫폼
US10818551B2 (en) 2019-01-09 2020-10-27 Semiconductor Components Industries, Llc Plasma die singulation systems and related methods
JP7365878B2 (ja) * 2019-12-06 2023-10-20 東京エレクトロン株式会社 計測装置及び計測方法

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Also Published As

Publication number Publication date
JP5392972B2 (ja) 2014-01-22
US20060154388A1 (en) 2006-07-13
US20070012660A1 (en) 2007-01-18
JP2006194878A (ja) 2006-07-27
KR20060081365A (ko) 2006-07-12
TWI375288B (en) 2012-10-21
EP1679548A1 (en) 2006-07-12
US7846848B2 (en) 2010-12-07
TW200633107A (en) 2006-09-16

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