KR101246750B1 - 금속 나노입자로 표면 수식된 나노미터 두께의 금속 마이크로판을 함유하는 전도성 페이스트용 조성물 - Google Patents

금속 나노입자로 표면 수식된 나노미터 두께의 금속 마이크로판을 함유하는 전도성 페이스트용 조성물 Download PDF

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KR101246750B1
KR101246750B1 KR1020090026577A KR20090026577A KR101246750B1 KR 101246750 B1 KR101246750 B1 KR 101246750B1 KR 1020090026577 A KR1020090026577 A KR 1020090026577A KR 20090026577 A KR20090026577 A KR 20090026577A KR 101246750 B1 KR101246750 B1 KR 101246750B1
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KR
South Korea
Prior art keywords
silver
modified
metal
metal nanoparticle
microplate
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KR1020090026577A
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English (en)
Korean (ko)
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KR20100108098A (ko
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김윤진
고창모
조호숙
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엘에스전선 주식회사
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Priority to KR1020090026577A priority Critical patent/KR101246750B1/ko
Priority to PCT/KR2010/001876 priority patent/WO2010110626A2/fr
Publication of KR20100108098A publication Critical patent/KR20100108098A/ko
Application granted granted Critical
Publication of KR101246750B1 publication Critical patent/KR101246750B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Nanotechnology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
KR1020090026577A 2009-03-27 2009-03-27 금속 나노입자로 표면 수식된 나노미터 두께의 금속 마이크로판을 함유하는 전도성 페이스트용 조성물 KR101246750B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020090026577A KR101246750B1 (ko) 2009-03-27 2009-03-27 금속 나노입자로 표면 수식된 나노미터 두께의 금속 마이크로판을 함유하는 전도성 페이스트용 조성물
PCT/KR2010/001876 WO2010110626A2 (fr) 2009-03-27 2010-03-26 Composition pour une pâte conductrice contenant des microplaques métalliques qui ont une épaisseur de l'ordre du nanomètre avec des nanoparticules métalliques modifiant la surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090026577A KR101246750B1 (ko) 2009-03-27 2009-03-27 금속 나노입자로 표면 수식된 나노미터 두께의 금속 마이크로판을 함유하는 전도성 페이스트용 조성물

Publications (2)

Publication Number Publication Date
KR20100108098A KR20100108098A (ko) 2010-10-06
KR101246750B1 true KR101246750B1 (ko) 2013-03-26

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KR1020090026577A KR101246750B1 (ko) 2009-03-27 2009-03-27 금속 나노입자로 표면 수식된 나노미터 두께의 금속 마이크로판을 함유하는 전도성 페이스트용 조성물

Country Status (2)

Country Link
KR (1) KR101246750B1 (fr)
WO (1) WO2010110626A2 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
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CN102013281A (zh) * 2010-12-11 2011-04-13 广东风华高新科技股份有限公司 高功率led用导电银胶
KR101273694B1 (ko) * 2011-02-25 2013-06-12 삼성전기주식회사 구리 나노 페이스트 및 그 형성 방법, 그리고 상기 구리 나노 페이스트를 이용한 전극 형성 방법
EP2753668B1 (fr) 2011-09-06 2019-03-27 Henkel IP & Holding GmbH Matériau conducteur et procédé associé
KR101331112B1 (ko) * 2011-09-28 2013-11-19 (주)바이오니아 탄소나노튜브 및 금속산화물으로 이루어진 나노복합체 및 이의 제조방법
US9888568B2 (en) 2012-02-08 2018-02-06 Crane Electronics, Inc. Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module
CN104145538B (zh) * 2012-02-08 2018-12-14 克兰电子公司 多层式电子组件和用于将电路部件嵌入三维模块的方法
US9441117B2 (en) * 2012-03-20 2016-09-13 Basf Se Mixtures, methods and compositions pertaining to conductive materials
TWI518708B (zh) * 2012-09-13 2016-01-21 達泰科技股份有限公司 包含奈米銀顆粒之銀漿及其用於製造光伏元件之用途
KR101483733B1 (ko) * 2012-09-26 2015-01-16 김상호 전도성 분말 및 그 제조방법
KR20140085732A (ko) * 2012-12-27 2014-07-08 코오롱글로텍주식회사 Ａｇ Ｆｌａｋｅ를 포함하는 전극 형성용 페이스트 조성물, 상기 조성물 제조 방법 및 이를 이용한 전극
WO2014113937A1 (fr) * 2013-01-23 2014-07-31 Henkel IP & Holding GmbH Encre conductrice souple
JP6576345B2 (ja) 2013-08-16 2019-09-18 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング サブミクロン銀粒子インク組成物、プロセスおよび応用
KR101499141B1 (ko) * 2013-09-06 2015-03-11 동아대학교 산학협력단 전도성 분말의 제조방법 및 전도성 분말을 이용한 전도성 페이스트
CN109994373B (zh) * 2019-04-12 2021-06-22 中国电子科技集团公司第三十八研究所 一种微组装裸芯片连接及返修方法
US20210230398A1 (en) * 2020-01-27 2021-07-29 The University Of Akron Electrically conductive polymer adhesives with complex dimensional filters
CN115602357A (zh) * 2022-10-24 2023-01-13 浙江振有电子股份有限公司（Cn） 一种强稳定性、高导电性的贯孔铜浆及其制备方法

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KR20050116594A (ko) * 2004-06-08 2005-12-13 (주)나노클러스터 세라믹 분말을 사용하여 착색한 금속 나노 입자가 첨가된 전도성 분말 및 그 제조방법
JP2007149522A (ja) * 2005-11-29 2007-06-14 Sumitomo Metal Mining Co Ltd 銀とカーボンナノチューブを含む導電性樹脂ペースト組成物およびこれを用いた半導体装置

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JPH08148035A (ja) * 1994-11-24 1996-06-07 Hitachi Chem Co Ltd 導電性材料及びそれを用いた導電性ペースト
GB0108888D0 (en) * 2001-04-09 2001-05-30 Du Pont Conductor composition IV
JP4514390B2 (ja) * 2002-03-19 2010-07-28 東洋紡績株式会社 導電性ペースト及びこれを用いた印刷回路
JP2005078967A (ja) * 2003-09-01 2005-03-24 Toyobo Co Ltd 導電性ペースト
JP2006120665A (ja) * 2004-10-19 2006-05-11 Sumitomo Metal Mining Co Ltd 銀とカーボンナノチューブを含む導電性樹脂ペースト組成物およびこれを用いた半導体装置
TWI329323B (en) * 2006-04-21 2010-08-21 Kwo Kung Ming Method of fabricating conductive paste for conductive substrate or conductive film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050116594A (ko) * 2004-06-08 2005-12-13 (주)나노클러스터 세라믹 분말을 사용하여 착색한 금속 나노 입자가 첨가된 전도성 분말 및 그 제조방법
JP2007149522A (ja) * 2005-11-29 2007-06-14 Sumitomo Metal Mining Co Ltd 銀とカーボンナノチューブを含む導電性樹脂ペースト組成物およびこれを用いた半導体装置

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WO2010110626A3 (fr) 2010-12-09
KR20100108098A (ko) 2010-10-06
WO2010110626A2 (fr) 2010-09-30

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