KR101224997B1 - 프린트 배선판 및 그 제조방법, 프린트 배선판 반제품 연쇄체 - Google Patents

프린트 배선판 및 그 제조방법, 프린트 배선판 반제품 연쇄체 Download PDF

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KR101224997B1
KR101224997B1 KR1020117012557A KR20117012557A KR101224997B1 KR 101224997 B1 KR101224997 B1 KR 101224997B1 KR 1020117012557 A KR1020117012557 A KR 1020117012557A KR 20117012557 A KR20117012557 A KR 20117012557A KR 101224997 B1 KR101224997 B1 KR 101224997B1
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KR
South Korea
Prior art keywords
grooves
printed wiring
wiring board
bending
insulating layer
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KR1020117012557A
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English (en)
Korean (ko)
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KR20110082598A (ko
Inventor
미츠아키 다카쿠라
다츠야 사이토
Original Assignee
닛폰 하츠죠 가부시키가이샤
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Application filed by 닛폰 하츠죠 가부시키가이샤 filed Critical 닛폰 하츠죠 가부시키가이샤
Publication of KR20110082598A publication Critical patent/KR20110082598A/ko
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Publication of KR101224997B1 publication Critical patent/KR101224997B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
KR1020117012557A 2008-12-01 2009-11-12 프린트 배선판 및 그 제조방법, 프린트 배선판 반제품 연쇄체 KR101224997B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008306759A JP5154387B2 (ja) 2008-12-01 2008-12-01 プリント配線板及びその製造方法、プリント配線板半製品連鎖体
JPJP-P-2008-306759 2008-12-01
PCT/JP2009/006060 WO2010064364A1 (ja) 2008-12-01 2009-11-12 プリント配線板及びその製造方法、プリント配線板半製品連鎖体

Publications (2)

Publication Number Publication Date
KR20110082598A KR20110082598A (ko) 2011-07-19
KR101224997B1 true KR101224997B1 (ko) 2013-01-22

Family

ID=42233023

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117012557A KR101224997B1 (ko) 2008-12-01 2009-11-12 프린트 배선판 및 그 제조방법, 프린트 배선판 반제품 연쇄체

Country Status (4)

Country Link
JP (1) JP5154387B2 (ja)
KR (1) KR101224997B1 (ja)
CN (1) CN102227957B (ja)
WO (1) WO2010064364A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101352519B1 (ko) 2012-10-08 2014-01-17 정인원 연성인쇄회로 및 이의 제조 방법

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5629135B2 (ja) * 2010-06-15 2014-11-19 住友電気工業株式会社 フレキシブル基板モジュール
KR101330770B1 (ko) * 2011-11-16 2013-11-18 엘지이노텍 주식회사 백라이트 유닛용 절곡 인쇄회로기판
KR101304733B1 (ko) 2011-12-26 2013-09-05 주식회사 포스코 방열구조를 가지는 인쇄회로기판 및 이를 포함하는 ｌｅｄ 조명장치
KR101294943B1 (ko) * 2011-12-26 2013-08-08 주식회사 포스코 방열구조를 가지는 인쇄회로기판 및 이를 포함하는 ｌｅｄ 조명장치
KR102009293B1 (ko) * 2012-10-31 2019-08-09 엘지이노텍 주식회사 인쇄회로기판 및 이를 구비한 조명장치용 하우징
KR102170480B1 (ko) * 2013-12-09 2020-10-28 엘지이노텍 주식회사 인쇄회로기판
CN105472878A (zh) * 2016-01-05 2016-04-06 友达光电(厦门)有限公司 软性电路板以及显示装置
CN107035979A (zh) * 2017-04-27 2017-08-11 浙江阳光美加照明有限公司 一种可弯折的灯丝条及使用该灯丝条的led灯丝灯
WO2021199866A1 (ja) * 2020-03-30 2021-10-07 株式会社村田製作所 回路モジュール
DE102021100307A1 (de) 2021-01-11 2022-07-14 Marelli Automotive Lighting Reutlingen (Germany) GmbH Verfahren zum Bearbeiten einer Schaltungsträgerplatte und Schaltungsträgerplatte

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0311786A (ja) * 1989-06-09 1991-01-21 Ibiden Co Ltd プリント配線板
JPH0538994U (ja) * 1991-10-18 1993-05-25 オリジン電気株式会社 電源モジユール
JP2001160664A (ja) * 1999-12-01 2001-06-12 Denki Kagaku Kogyo Kk 金属ベース回路基板及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5899855U (ja) * 1981-12-26 1983-07-07 株式会社フジクラ ほうろう基板
JPS6378590A (ja) * 1986-09-22 1988-04-08 株式会社東芝 メタルプリント基板
JPH03157985A (ja) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd 部品実装用金属基板
JPH09162507A (ja) * 1995-12-08 1997-06-20 Nippon Seiki Co Ltd 金属ベースプリント基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0311786A (ja) * 1989-06-09 1991-01-21 Ibiden Co Ltd プリント配線板
JPH0538994U (ja) * 1991-10-18 1993-05-25 オリジン電気株式会社 電源モジユール
JP2001160664A (ja) * 1999-12-01 2001-06-12 Denki Kagaku Kogyo Kk 金属ベース回路基板及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101352519B1 (ko) 2012-10-08 2014-01-17 정인원 연성인쇄회로 및 이의 제조 방법

Also Published As

Publication number Publication date
CN102227957A (zh) 2011-10-26
JP2010129984A (ja) 2010-06-10
JP5154387B2 (ja) 2013-02-27
WO2010064364A1 (ja) 2010-06-10
CN102227957B (zh) 2013-10-16
KR20110082598A (ko) 2011-07-19

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