KR101223470B1 - 취성 재료 기판의 가공 방법 - Google Patents

취성 재료 기판의 가공 방법 Download PDF

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Publication number
KR101223470B1
KR101223470B1 KR1020107025334A KR20107025334A KR101223470B1 KR 101223470 B1 KR101223470 B1 KR 101223470B1 KR 1020107025334 A KR1020107025334 A KR 1020107025334A KR 20107025334 A KR20107025334 A KR 20107025334A KR 101223470 B1 KR101223470 B1 KR 101223470B1
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KR
South Korea
Prior art keywords
substrate
initial crack
crack
scribe
laser
Prior art date
Application number
KR1020107025334A
Other languages
English (en)
Korean (ko)
Other versions
KR20110005850A (ko
Inventor
켄지 후쿠하라
아츠시 이무라
고오지 야마모토
슈이치 이노우에
토루 구마가이
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20110005850A publication Critical patent/KR20110005850A/ko
Application granted granted Critical
Publication of KR101223470B1 publication Critical patent/KR101223470B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
KR1020107025334A 2008-04-14 2009-03-27 취성 재료 기판의 가공 방법 KR101223470B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2008-105191 2008-04-14
JP2008105191 2008-04-14
JP2008106220 2008-04-15
JPJP-P-2008-106220 2008-04-15
PCT/JP2009/056224 WO2009128334A1 (ja) 2008-04-14 2009-03-27 脆性材料基板の加工方法

Publications (2)

Publication Number Publication Date
KR20110005850A KR20110005850A (ko) 2011-01-19
KR101223470B1 true KR101223470B1 (ko) 2013-01-17

Family

ID=41199033

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107025334A KR101223470B1 (ko) 2008-04-14 2009-03-27 취성 재료 기판의 가공 방법

Country Status (5)

Country Link
JP (1) JP5325209B2 (zh)
KR (1) KR101223470B1 (zh)
CN (1) CN102026926B (zh)
TW (1) TWI380963B (zh)
WO (1) WO2009128334A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106932995B (zh) 2010-03-05 2021-07-13 Sage电致变色显示有限公司 电致变色装置到玻璃衬底的层合
FR2962682B1 (fr) 2010-07-16 2015-02-27 Saint Gobain Vitrage electrochimique a proprietes optiques et/ou energetiques electrocommandables
KR101772445B1 (ko) * 2010-10-27 2017-08-31 삼성디스플레이 주식회사 기판의 절단 방법
JP5244202B2 (ja) * 2011-01-27 2013-07-24 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
KR101297558B1 (ko) * 2011-08-23 2013-08-14 주식회사 로보스타 휠 레이저 공용 스크라이빙 유닛
JP5779074B2 (ja) * 2011-11-02 2015-09-16 三星ダイヤモンド工業株式会社 強化ガラス基板のスクライブ方法
IN2014DN08858A (zh) * 2012-04-05 2015-05-22 Sage Electrochromics Inc
KR101950450B1 (ko) * 2012-08-09 2019-02-21 (주)하드램 이동통신 단말기용 윈도우 플레이트 커팅 시스템 및 방법
CN106232311B (zh) 2014-03-31 2018-11-23 三星钻石工业股份有限公司 脆性材料基板的分断方法
JP6431686B2 (ja) * 2014-04-22 2018-11-28 株式会社オハラ 板ガラスの切断方法
JP2016069223A (ja) * 2014-09-30 2016-05-09 三星ダイヤモンド工業株式会社 ブレイク方法並びにブレイク装置
JP2016069222A (ja) * 2014-09-30 2016-05-09 三星ダイヤモンド工業株式会社 ブレイク方法並びにブレイク装置
CN106094305B (zh) * 2016-08-04 2019-08-30 深圳市华星光电技术有限公司 一种调整电子显示器尺寸的方法及应用
CN112601633A (zh) * 2018-07-26 2021-04-02 哈罗工业公司 材料解理中的受控裂纹扩展的入射辐射引起的表面损伤
CN109231806B (zh) * 2018-10-18 2023-10-31 常州大学怀德学院 一种止损生产中的玻璃裁宽失误的周转系统及方法
CN110255875A (zh) * 2019-06-30 2019-09-20 东莞市佰荣森机械设备有限公司 一种混合式结构双工位玻璃切割机

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100551526B1 (ko) * 2001-07-18 2006-02-13 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 장치 및 스크라이브 방법

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JP4342039B2 (ja) * 1999-06-15 2009-10-14 三星ダイヤモンド工業株式会社 ガラススクライバー及びスクライブ方法
JP2002100590A (ja) * 2000-09-22 2002-04-05 Sony Corp 割断装置及びその方法
TW568809B (en) * 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
DE60331423D1 (de) * 2002-04-01 2010-04-08 Mitsuboshi Diamond Ind Co Ltd Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung
CN101585655B (zh) * 2003-01-29 2013-04-24 三星宝石工业株式会社 基板切割设备和基板切割方法
RU2370462C2 (ru) * 2003-12-05 2009-10-20 Асахи Гласс Компани, Лимитед Способ и устройство для разделения листового стекла
TW200609191A (en) * 2004-09-07 2006-03-16 Tzujan Dev Inst The rotary knife of a glasscutter and its manufacturing method
WO2006129504A1 (ja) * 2005-06-03 2006-12-07 Asahi Glass Company, Limited 合わせガラスの切断方法および装置
KR101140164B1 (ko) * 2005-10-28 2012-04-24 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 라인 형성방법 및 스크라이브라인 형성장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100551526B1 (ko) * 2001-07-18 2006-02-13 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 장치 및 스크라이브 방법

Also Published As

Publication number Publication date
TW201002639A (en) 2010-01-16
KR20110005850A (ko) 2011-01-19
WO2009128334A1 (ja) 2009-10-22
CN102026926A (zh) 2011-04-20
CN102026926B (zh) 2013-06-05
JP5325209B2 (ja) 2013-10-23
TWI380963B (zh) 2013-01-01
JPWO2009128334A1 (ja) 2011-08-04

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