JP5325209B2 - 脆性材料基板の加工方法 - Google Patents

脆性材料基板の加工方法 Download PDF

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Publication number
JP5325209B2
JP5325209B2 JP2010508164A JP2010508164A JP5325209B2 JP 5325209 B2 JP5325209 B2 JP 5325209B2 JP 2010508164 A JP2010508164 A JP 2010508164A JP 2010508164 A JP2010508164 A JP 2010508164A JP 5325209 B2 JP5325209 B2 JP 5325209B2
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JP
Japan
Prior art keywords
substrate
initial crack
scribe line
crack
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010508164A
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English (en)
Japanese (ja)
Other versions
JPWO2009128334A1 (ja
Inventor
健司 福原
淳史 井村
幸司 山本
修一 井上
透 熊谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2010508164A priority Critical patent/JP5325209B2/ja
Publication of JPWO2009128334A1 publication Critical patent/JPWO2009128334A1/ja
Application granted granted Critical
Publication of JP5325209B2 publication Critical patent/JP5325209B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
JP2010508164A 2008-04-14 2009-03-27 脆性材料基板の加工方法 Expired - Fee Related JP5325209B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010508164A JP5325209B2 (ja) 2008-04-14 2009-03-27 脆性材料基板の加工方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2008105191 2008-04-14
JP2008105191 2008-04-14
JP2008106220 2008-04-15
JP2008106220 2008-04-15
JP2010508164A JP5325209B2 (ja) 2008-04-14 2009-03-27 脆性材料基板の加工方法
PCT/JP2009/056224 WO2009128334A1 (ja) 2008-04-14 2009-03-27 脆性材料基板の加工方法

Publications (2)

Publication Number Publication Date
JPWO2009128334A1 JPWO2009128334A1 (ja) 2011-08-04
JP5325209B2 true JP5325209B2 (ja) 2013-10-23

Family

ID=41199033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010508164A Expired - Fee Related JP5325209B2 (ja) 2008-04-14 2009-03-27 脆性材料基板の加工方法

Country Status (5)

Country Link
JP (1) JP5325209B2 (zh)
KR (1) KR101223470B1 (zh)
CN (1) CN102026926B (zh)
TW (1) TWI380963B (zh)
WO (1) WO2009128334A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106932995B (zh) 2010-03-05 2021-07-13 Sage电致变色显示有限公司 电致变色装置到玻璃衬底的层合
FR2962682B1 (fr) 2010-07-16 2015-02-27 Saint Gobain Vitrage electrochimique a proprietes optiques et/ou energetiques electrocommandables
KR101772445B1 (ko) * 2010-10-27 2017-08-31 삼성디스플레이 주식회사 기판의 절단 방법
JP5244202B2 (ja) * 2011-01-27 2013-07-24 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
KR101297558B1 (ko) * 2011-08-23 2013-08-14 주식회사 로보스타 휠 레이저 공용 스크라이빙 유닛
JP5779074B2 (ja) * 2011-11-02 2015-09-16 三星ダイヤモンド工業株式会社 強化ガラス基板のスクライブ方法
IN2014DN08858A (zh) * 2012-04-05 2015-05-22 Sage Electrochromics Inc
KR101950450B1 (ko) * 2012-08-09 2019-02-21 (주)하드램 이동통신 단말기용 윈도우 플레이트 커팅 시스템 및 방법
CN106232311B (zh) 2014-03-31 2018-11-23 三星钻石工业股份有限公司 脆性材料基板的分断方法
JP6431686B2 (ja) * 2014-04-22 2018-11-28 株式会社オハラ 板ガラスの切断方法
JP2016069223A (ja) * 2014-09-30 2016-05-09 三星ダイヤモンド工業株式会社 ブレイク方法並びにブレイク装置
JP2016069222A (ja) * 2014-09-30 2016-05-09 三星ダイヤモンド工業株式会社 ブレイク方法並びにブレイク装置
CN106094305B (zh) * 2016-08-04 2019-08-30 深圳市华星光电技术有限公司 一种调整电子显示器尺寸的方法及应用
CN112601633A (zh) * 2018-07-26 2021-04-02 哈罗工业公司 材料解理中的受控裂纹扩展的入射辐射引起的表面损伤
CN109231806B (zh) * 2018-10-18 2023-10-31 常州大学怀德学院 一种止损生产中的玻璃裁宽失误的周转系统及方法
CN110255875A (zh) * 2019-06-30 2019-09-20 东莞市佰荣森机械设备有限公司 一种混合式结构双工位玻璃切割机

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001002438A (ja) * 1999-06-15 2001-01-09 Mitsuboshi Diamond Industrial Co Ltd ガラススクライバー
JP2002100590A (ja) * 2000-09-22 2002-04-05 Sony Corp 割断装置及びその方法
WO2003008352A1 (en) * 2001-07-18 2003-01-30 Mitsuboshi Diamond Industrial Co., Ltd. Device and method for scribing fragile material substrate
WO2004067243A1 (ja) * 2003-01-29 2004-08-12 Mitsuboshi Diamond Industrial Co., Ltd. 基板分断装置および基板分断方法
WO2005054142A1 (ja) * 2003-12-05 2005-06-16 Asahi Glass Company, Limited 板ガラスの切断方法及び装置
JP2006076873A (ja) * 2004-09-07 2006-03-23 Shizen Gijutsu Kenkyusho ガラス切削用ホイール及びその製造方法
WO2006129504A1 (ja) * 2005-06-03 2006-12-07 Asahi Glass Company, Limited 合わせガラスの切断方法および装置
WO2007049668A1 (ja) * 2005-10-28 2007-05-03 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板のスクライブライン形成方法およびスクライブライン形成装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW568809B (en) * 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
DE60331423D1 (de) * 2002-04-01 2010-04-08 Mitsuboshi Diamond Ind Co Ltd Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001002438A (ja) * 1999-06-15 2001-01-09 Mitsuboshi Diamond Industrial Co Ltd ガラススクライバー
JP2002100590A (ja) * 2000-09-22 2002-04-05 Sony Corp 割断装置及びその方法
WO2003008352A1 (en) * 2001-07-18 2003-01-30 Mitsuboshi Diamond Industrial Co., Ltd. Device and method for scribing fragile material substrate
WO2004067243A1 (ja) * 2003-01-29 2004-08-12 Mitsuboshi Diamond Industrial Co., Ltd. 基板分断装置および基板分断方法
WO2005054142A1 (ja) * 2003-12-05 2005-06-16 Asahi Glass Company, Limited 板ガラスの切断方法及び装置
JP2006076873A (ja) * 2004-09-07 2006-03-23 Shizen Gijutsu Kenkyusho ガラス切削用ホイール及びその製造方法
WO2006129504A1 (ja) * 2005-06-03 2006-12-07 Asahi Glass Company, Limited 合わせガラスの切断方法および装置
WO2007049668A1 (ja) * 2005-10-28 2007-05-03 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板のスクライブライン形成方法およびスクライブライン形成装置

Also Published As

Publication number Publication date
TW201002639A (en) 2010-01-16
KR20110005850A (ko) 2011-01-19
KR101223470B1 (ko) 2013-01-17
WO2009128334A1 (ja) 2009-10-22
CN102026926A (zh) 2011-04-20
CN102026926B (zh) 2013-06-05
TWI380963B (zh) 2013-01-01
JPWO2009128334A1 (ja) 2011-08-04

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