KR101206246B1 - Substrate chucking plate and chucking/de-chucking method using it - Google Patents

Abstract

The present invention can be transferred to the inside of the deposition chamber in the chucking state of the substrate to proceed with the deposition process, the large area of the substrate can be fixed and uniformly adsorbed and adhered as a whole, so that the separation can be more easily separated The present invention provides a substrate chucking plate and a substrate chucking dechucking method using the same, which can contribute to the chucking and dechucking performance of the substrate.

Description

Substrate chucking plate and chucking / de-chucking method using it}

The present invention relates to an apparatus and method for chucking or de-checking substrates used to make OLEDs and the like.

In general, OLED (Organic Light Emitting Diode), also called organic EL, refers to a self-luminous organic material that emits itself by using an electroluminescence phenomenon that emits light when a current flows through a fluorescent organic compound.

OLED deposition equipment is needed to make display of TV or mobile phone using OLED and to produce lighting equipment.

OLED deposition equipment is used to form a thin film by depositing organic materials on a substrate, and is a key equipment for OLED production.

As a deposition equipment for OLED manufacturing, a vacuum evaporation system is mainly used. In general, a deposition space portion where a substrate is introduced and deposited is provided on an upper portion of a deposition chamber, and a source for supplying a deposition material thereunder. And a heating device for heating the source.

Such a vacuum thermal evaporation apparatus is configured to deposit organic materials on a substrate by providing organic matter (possibly inorganic) evaporated from a source in a state where a substrate is positioned in a deposition space.

In particular, the substrate is deposited in a state in which the substrate is bonded to the mask, such as a method of injecting only the substrate under the condition that the mask is set in the deposition chamber, a method of bonding the substrate and the mask outside the deposition chamber to the deposition chamber.

In either case, the substrate is generally introduced into the deposition chamber with the module supporting it.

There are several ways to set the substrate in the module, one of which uses the chucking plate, which is placed in the deposition chamber with the substrate fixed to the chucking plate, and also in the chucking plate after being discharged from the deposition chamber. The method is to separate the substrate.

In the method using the chucking plate, the dechucking technique of chucking the substrate to the chucking plate before the deposition process and separating the substrate after the deposition process is completed has a significant effect on the process performance, thereby achieving more efficient chucking and dechucking. The development of a chucking plate is required.

The contents of the background art described above are technical information that the inventor of the present application holds for the derivation of the present invention or acquired in the derivation process of the present invention and is a known technology disclosed to the general public prior to the filing of the present invention I can not.

The present invention has been made in order to solve the above problems, and can be carried out in the state of chucking the substrate to proceed with the process, in particular, while fixing the substrate to be large area more uniformly, it is easy to remove the substrate at the time of substrate separation It is an object of the present invention to provide a substrate chucking plate and a substrate chucking dechucking method using the same, which can contribute to improve substrate chucking and dechucking performance.

Substrate chucking plate according to the present invention for realizing the above object is a plurality of adhesion chuck is disposed on the upper surface at regular intervals and the substrate is attached and fixed, and a plurality of suction to penetrate up and down to form a negative pressure for adsorbing the substrate The hole is provided, characterized in that configured to be transported together in a state where the substrate is fixed on the upper surface.

The chucking plate, the sticking chuck and the suction hole is provided with a chucking portion to which the substrate is fixed, and the outer portion provided around the chucking portion, the outer portion is preferably provided with a reinforcement plate to reinforce the rigidity Do.

Preferably, the chucking plate is provided with a plurality of dechucking holes in which a dechucking unit separating the substrate is located.

At this time, each of the adhesive chuck is preferably configured to be arranged around the dechucking hole.

Each adhesive chuck includes a circular ring or a polygonal ring-shaped base plate installed on an upper surface of the chucking plate around the dechucking hole, and an adhesive ring provided on the upper surface of the base plate to provide adhesion to the substrate. It is preferred to be configured.

The adhesive ring is preferably configured such that the adhesive projections are arranged at regular intervals on the upper surface.

It is preferable that a suction groove connected to the suction hole is formed on an upper surface of the chucking plate.

At this time, the suction groove is preferably configured to pass through the circumference of each adhesive chuck.

Substrate chucking method according to the present invention for realizing the above object is a plate loading step of fixing the chucking plate on the base frame after adjusting the position after raising the chucking plate on the base frame; After the plate loading step, placing the substrate on top of the chucking plate and then adjusting the position to fix the substrate on the chucking plate; After the substrate loading step, the step of releasing the fixing state of the chucking plate in the base frame characterized in that it comprises a setting module input step of transferring the setting module fixed to the chucking plate into the chamber for the process progress.

A substrate dechucking method according to the present invention for realizing the above object comprises: a setting module discharging step of discharging a setting module having a substrate fixed to the chucking plate from a chamber for processing; A setting module loading step of fixing the setting module on the base frame after raising the setting module discharged through the setting module discharge step on the base frame and then adjusting the position; A substrate unloading step of separating the substrate fixed to the chucking plate after the setting module loading step; After the substrate unloading step, characterized in that it comprises a substrate discharge step of discharging the substrate.

The main problem solving means of the present invention as described above, will be described in more detail and clearly through examples such as 'details for the implementation of the invention', or the accompanying 'drawings' to be described below, wherein In addition to the main problem solving means as described above, various problem solving means according to the present invention will be further presented and described.

The substrate chucking plate and the substrate chucking dechucking method using the same according to the present invention may be transported into the deposition chamber while the substrate is chucked to proceed with the deposition process, and in particular, a large area of the substrate is uniformly adsorbed and adhered and fixed. In addition, since the separation can be performed more easily at the time of separating the substrate, it provides an effect that can contribute to the improvement of the chucking and dechucking performance of the substrate.

1 is a plan view showing an embodiment of a substrate chucking dechucking apparatus according to the present invention.
FIG. 2 is a cross-sectional configuration diagram in the AA line direction of FIG. 1.
3 is a cross-sectional configuration diagram in the BB line direction of FIG. 1.
Figure 4 is a plan view showing an embodiment of a substrate chucking apparatus according to the present invention.
5 is a plan view showing an embodiment of a substrate dechucking apparatus according to the present invention.
Figure 6 is a perspective view and an enlarged view of the main portion showing the upper surface of the chucking plate used in the present invention.
7 is a sectional view of an essential part of a chucking plate used in the present invention.
8 is a perspective view showing the bottom of the chucking plate used in the present invention.
Figure 9 is a perspective view showing the configuration of an adhesive chuck provided with a chucking plate of the present invention.
10 is a cross-sectional view showing an embodiment of a dechucking unit used in the present invention.
11 is a flow chart showing one embodiment of a substrate chucking method according to the present invention.
12 is a flow chart showing one embodiment of a substrate dechucking method according to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

1 to 3 is a plan view showing an embodiment of a substrate chucking dechucking apparatus according to the present invention, a cross-sectional configuration of the A-A line, B-B line direction of FIG.

As illustrated in these figures, a chucking plate 10 capable of mounting and fixing the substrate S is provided. The chucking plate 10 is provided with a plurality of holes through which the components constituting the lift pin unit 60 and the dechucking unit 70 to be described below, and the adhesive chuck 110 for fixing the substrate S. 6).

A detailed configuration of the chucking plate 10 will be described below in detail with reference to FIGS. 6 to 9.

The chucking plate 10 is supported on and fixed to the upper portion of the base frame 20.

If the base frame 20 is a structure that can be fixed while supporting the chucking plate 10 can be carried out by varying the shape and structure in accordance with the implementation conditions.

In the reference figure of this embodiment, the base frame 20 is composed of two support blocks 21 spaced apart from each other illustrates a structure capable of supporting both ends of the chucking plate 10. Of course, the two support blocks 21 are preferably made of a structure fixed to each other by a support structure installed below.

The floating unit 25 supporting the chucking plate 10 to be horizontally moved within a predetermined range is provided at a portion where the chucking plate 10 is placed above the base frame 20.

Referring to FIGS. 2 and 3, the floating unit 25 is movable in a horizontal direction to a certain extent in a state where the upper support plate 26 is supported by a bearing or the like, and when the position of the chucking plate 10 is fixed. It is preferable that the fixing cylinder (not shown) inside operates so that the support plate 26 does not move so that the position of the chucking plate 10 can be fixed.

That is, the support plate 26 flows in the horizontal direction so that the position of the chucking plate 10 can be adjusted in the initial stage when the chucking plate 10 is placed on the floating unit 25, but the position adjustment operation of the chucking plate 10 is performed. When this is completed, the fixing cylinder is configured to be able to fix the position of the support plate 26 so that the chucking plate 10 no longer moves.

As illustrated in FIG. 1, six floating units 25 may be installed in the upper portion of the base frame 20.

In addition, a fixing clamp 30 is provided on the upper portion of the base frame 20 to fix the chucking plate 10 (see FIG. 1).

The fixed clamp 30 is configured to fix the chucking plate 10 on the base frame 20 by pressing the upper surface of the chucking plate 10 while the clamping arm 31 operated by hydraulic pressure or pneumatic is linearly moved. It is preferable.

In addition, the base frame 20 is provided with a plate alignment mechanism 40 and a substrate alignment mechanism 50 for adjusting the positions of the chucking plate 10 and the substrate S placed on the chucking plate.

Referring to FIG. 2, the plate alignment mechanism 40 includes a movable body 41 moving horizontally on the base frame 20 and a linear drive provided on the base frame 20 to move the moving body 41. It may be configured to include an alignment arm 45, which is installed on the mechanism 43, the movable body 41 to move the chucking plate 10 while being in contact with or in close contact with the side of the chucking plate 10.

At this time, the linear drive mechanism 43 can be configured using a known linear drive mechanism such as a pneumatic cylinder.

Referring to FIG. 3, the substrate alignment mechanism 50 is provided with a movable body 51 moving in the horizontal direction on the base frame 20, and mounted on the base frame 20 to move the movable body 51. The linear drive mechanism 53, the alignment arm 55 which is supported by the movable body 51 and moves the substrate S while being in contact with the side surface of the substrate S, and the movable body 51 It may be configured to include a rotation drive mechanism 57 provided between the arms 55 to rotate the alignment arm 55.

The substrate alignment mechanism 50 may have a basic configuration similar to that of the plate alignment mechanism 40, and further includes a rotation driving mechanism 57. The rotation drive mechanism 57 is further included in order to prevent interference from occurring when the chucking plate 10 larger than the area of the substrate S is placed on the base frame 20.

Next, various devices are provided between the supporting blocks 21 constituting the base frame 20 to fix (or close) the substrate S onto the chucking plate 10 and to separate the substrate S, which will be described.

The base frame 20 is provided with a lift pin unit 60 for raising and lowering the substrate S from the chucking plate 10.

The lift pin unit 60 is configured to be movable up and down. In the drawing, a plurality of lift pins 63 are installed on one pin driving plate 61 to illustrate a lift pin unit 60 configured to move up and down at the same time. have. In addition to the above method, the lift pins 63 may be vertically moved without the pin drive plate 61, or the pin drive plates 61 may be divided into several parts to move up and down.

Of course, the pin drive plate 61 can be configured using a well-known drive mechanism which generates a vertical linear driving force, including a ball screw linear movement mechanism.

Meanwhile, a hole 10a may be formed in the chucking plate 10 to allow the lift pin 63 to pass therethrough.

In addition, the base frame 20 is provided with a suction unit 65 for bringing the substrate S into close contact with the chucking plate 10.

The suction unit 65 is a component part which forms a negative pressure on the upper surface of the chucking plate 10 to adhere the substrate S to the chucking plate 10, and the suction pipe 66 is installed to be movable upward and downward, and the suction pipe. It may be made of a suction drive plate 68 to move the (66) up and down.

Of course, the suction pipe 66 is configured to be connected to the suction force providing mechanism to receive the suction force. In the drawings, the suction pipes 66 are provided on both sides of the suction drive plate 68, but the suction pipes 66 positioned in the center are omitted to avoid the complexity of the drawings.

The suction drive plate 68 may be configured using a known drive mechanism that generates a vertical linear driving force, including a ball screw linear movement mechanism like the pin drive plate 61. Of course, it is also possible to configure the suction pipe 66 in a manner of moving up and down separately without the suction drive plate 68.

The suction unit 65 is configured to be in close contact with the bottom surface of the chucking plate 10 to provide suction power through the suction hole 13 (see FIG. 6) formed in the chucking plate 10, and chuck the substrate S. The substrate S is attached to the plate 10 so as to be fixed to the adhesive chuck 110 (see FIG. 6) provided in the chucking plate 10.

In addition, the base frame 20 is provided with a dechucking unit 70 for separating the substrate (S) in close contact with the chucking plate 10.

The dechucking unit 70 is also installed on the base frame 20 so as to be movable up and down, and a plurality of dechucking rods 71 are preferably configured to be moved up and down simultaneously by the dechucking plate 79. At this time, the dechucking rod 71 may also be configured to enable individual driving without the dechucking plate 79. In addition, the driving method of the dechucking plate 79 may be the same as the driving method of the pin driving plate 61 and the suction driving plate 68 described above.

A detailed configuration of the dechucking rod 71 will be described below with reference to FIG. 10.

Meanwhile, the chucking plate 10 has a dechucking hole 15 through which the dechucking rod 71 passes.

The substrate chucking dechucking apparatus 100 as described above has been described based on a configuration in which both a chucking operation for fixing the substrate S and a dechucking operation for separating the substrate S are performed in one apparatus. However, the present invention is not limited thereto, and the substrate chucking device 200 and the substrate dechucking device 300 capable of implementing the chucking operation and the dechucking operation may be separately configured.

Referring to FIG. 4, the substrate chucking apparatus 200 includes a chucking plate 10, a base frame 20, a floating unit 25, a fixing clamp 30 (see FIG. 1), a plate alignment mechanism 40, and The board alignment mechanism 50 (refer FIG. 3), the lift pin unit 60, the suction unit 65, etc. are comprised. That is, in the substrate chucking dechucking apparatus 100 described above, the dechucking unit 70 for separating the substrate S is omitted.

Referring to FIG. 5, the substrate dechucking apparatus 300 includes a chucking plate 10, a base frame 20, a floating unit 25, a fixing clamp 30 (see FIG. 1), and a plate alignment mechanism 40. And a substrate alignment mechanism 50 (see FIG. 3), a lift pin unit 60, and a dechucking unit 70. That is, in the substrate chucking dechucking apparatus 100 described above, the suction unit 65 for fixing the substrate S is omitted. The lift pin unit 60 may also be omitted. In this case, the dechucking unit 70 is preferably configured to lift the substrate S in place of the lift pin unit 60.

Since the other configuration is the same as or similar to the configuration of the substrate chucking dechucking apparatus 100 as described above, the same reference numerals will be given and the description thereof will be omitted.

As such, when the substrate chucking device 200 and the substrate dechucking device 300 are separated from each other, the substrate chucking device 200 may be formed around the deposition chamber (not shown) for depositing the organic material on the substrate S. 100 and position the substrate S while the substrate dechucking device 300 is positioned on the other side while continuously moving the substrate S in the order of the substrate chucking device 200, the deposition chamber, and the substrate dechucking device 300. You can proceed.

Now, the main components provided in the substrate chucking dechucking apparatus 100, the substrate chucking apparatus 200, and the substrate dechucking apparatus 300 will be described below.

First, the chucking plate 10 will be described with reference to FIGS. 6 to 8.

The chucking plate 10 has a rectangular plate-like structure with a constant thickness.

The chucking plate 10 may be largely divided into a chucking portion 12 to which the outer portion 11 and the substrate S are fixed. At this time, the chucking plate 10 is preferably composed of an aluminum material.

As described above, the outer portion 11 is a portion which is mounted on the floating unit 25 and fixed by the fixing clamp 30, and when the outer portion 11 is put in the deposition chamber or the like, which is placed on or supported by the transfer device. Part.

The outer portion 11 is preferably made of a structure that is further attached to the upper surface of the stainless steel plate (11a) as a reinforcement plate so that the chucking plate 10 as a whole has sufficient rigidity. This is in order to simply replace and use only the stainless steel plate 11a when the upper surface of the outer portion 11 is damaged.

The chucking part 12 is a part to which the board | substrate S adheres and is fixed, and the surface can be comprised by anodizing.

The chucking unit 12 includes a suction hole 13, a pin hole (not shown), a dechucking hole 15, and the like, and an adhesive chuck 110 to which the substrate S is attached.

The suction hole 13 may be variously configured as long as the suction hole 13 penetrates upward from the bottom of the chucking plate 10. In the drawing of the present embodiment, the suction hole 13 is disposed at a predetermined interval in a slit structure. The suction groove 14 is continuously formed on the upper surface of the chucking plate 10 so that the negative pressure can be uniformly formed around the suction hole 13. That is, in the drawing, one slit-shaped suction hole 13 is formed between the four dechucking holes 15, and each dechucking hole 15 and the adhesive chuck 110 are centered around the suction hole 13. The suction groove 14 is connected to pass through the perimeter.

In this structure, the suction holes 13 and the suction grooves 14 may be uniformly disposed on the upper surface of the chucking plate 10 to uniformly adsorb and adhere the substrate S.

In particular, the suction groove 14 which is continued from the suction hole 13 is formed to pass around the adhesive chuck 110 so that the substrate S may be adhered to the adhesive chuck 110 more firmly. .

The pin hole is a component part through which the lift pin 63 of the lift pin unit 60 may pass, and is omitted in the drawings of the present exemplary embodiment illustrated in FIGS. 6 to 8. That is, the pin hole (not shown) may be used in common depending on the dechucking hole 15 and the implementation conditions, and the lift pin 63 may be configured to pass through the dechucking hole 15. Of course, the pin hole may be formed separately from the dechucking hole 15 in the chucking plate 10.

The dechucking hole 15 is a portion configured to allow the dechucking rod 71 of the dechucking unit 70 to pass therethrough.

The adhesive chuck 110 may be formed in a circular ring structure or a polygonal ring structure around the dechucking hole 15 as illustrated in the drawing. In the present embodiment, a description will be given of the circular ring structure.

7 and 9, the adhesive chuck 110 includes a circular ring-shaped base plate 111 provided on an upper surface of the chucking plate 10 around the dechucking hole 15, and the base plate ( It is configured to include an adhesive ring 115 is provided on the upper surface of the 111 to provide an adhesive force to which the substrate (S) is attached.

The base plate 111 may be installed on the chucking plate 10 by a screw assembly method, and the inner upper surface on which the adhesive ring 115 is installed is formed to be relatively lower than the outer upper surface.

The adhesive ring 115 is made of a material that provides the adhesive force, it is preferable that the adhesive projection 117 is disposed on the upper surface at a predetermined interval.

On the other hand, the chucking plate 10 is formed with a chuck installation groove 121 of a circular structure so that the base plate 111 of the adhesive chuck 110 is installed around the dechucking hole 15, the base plate ( The upper surface of the 111 and the upper surface of the chucking plate 10 is preferably configured to have the same height.

Of course, the adhesive protrusion 117 formed on the adhesive ring 115 is preferably formed to a certain degree higher than the upper surface of the chucking plate 10.

FIG. 8 is a view illustrating a lower structure of the chucking plate 10. The lower portion of the chucking plate 10 includes a structure in which a plurality of ribs 19 are formed between the outer edges 18.

The chucking plate 10 having the lower structure as described above may minimize the thickness of the chucking plate 10 through the outer frame 18 and the plurality of ribs 19, thereby realizing light weight and maintaining rigidity.

In Fig. 8, reference numeral 17 denotes a positioning pin.

Next, the dechucking rod 71 which is a main component part of the dechucking unit 70 is demonstrated with reference to FIG.

The dechucking rod 71 is composed of a pipe-shaped rod 72 into which air pressure is injected, and a diaphragm 73 provided at an upper end of the rod 72 to expand and contract.

The upper end of the pipe-shaped rod 72 is provided with a circular flange-shaped support 74 having a space for supporting the diaphragm 73 and the air pressure is injected.

The dechucking rod 71 configured as described above expands the diaphragm 73 through the rod 72 when the substrate S attached to the adhesive chuck 110 of the chucking plate 10 is separated as described above. By doing so, the substrate S can be separated from the adhesive chuck 110.

In addition, the dechucking rod 71 may be configured to serve as a function of the lift pin unit 60. The dechucking rod 71 may be configured to move relative to the vertical direction in order to load / unload the substrate S. When the chucking plate 10 can be configured to move up and down through the dechucking hole 15 (see Fig. 6).

Now, the substrate chucking dechucking method using the substrate chucking dechucking apparatus 100, the substrate chucking apparatus 200, and the substrate dechucking apparatus 300 as described above will be described.

First, the substrate chucking method will be described with reference to FIG. 11 and the like.

Substrate chucking method according to the invention, the plate loading step (S1) for fixing the chucking plate 10 on the base frame 20 after raising the chucking plate 10 on the base frame 20 and then adjust the position, After the plate loading step (S1) to raise the substrate (S) on top of the chucking plate 10 and then adjust the position of the substrate loading step (S2) for fixing the substrate (S) on the chucking plate 10, and After the substrate loading step S2, the setting module input step of releasing the chucking plate 10 from the base frame 20 to transfer the setting module having the substrate S fixed to the chucking plate 10 into the deposition chamber. It includes (S3).

The substrate chucking method will be described in detail with respect to each of the above steps.

The substrate chucking method may be performed using the substrate chucking dechucking apparatus 100 or the substrate chucking apparatus 200 described above.

1) The plate loading step (S1) will be described.

The chucking plate 10 is carried in the upper portion of the base frame 20 of the substrate chucking dechucking apparatus 100 (or the substrate chucking apparatus 200) (see FIG. 2).

When the loading of the chucking plate 10 is confirmed, the plate alignment mechanism 40 operates to adjust the position of the chucking plate 10, and when the position adjustment of the chucking plate 10 is completed, the fixing clamp 30 is operated. To fix the chucking plate 10 and to lock the floating unit 25.

2) The substrate loading step S2 will be described.

In order to load the substrate S on the top of the chucking plate 10, the lift pin unit 60 is operated to raise the lift pin 63 to the top of the chucking plate 10 by a predetermined height. In such a state, the board | substrate S is carried over the lift pin 63, and when carrying in of the board | substrate S is confirmed, the board | substrate alignment mechanism 50 is operated and the position of the board | substrate S is adjusted.

At this time, with respect to the substrate position adjustment procedure, referring to FIG. 3, the rotation driving mechanism 57 of the substrate alignment mechanism 50 is operated to rotate the alignment arm 55 in the direction of the substrate S, and the linear driving mechanism 53 is operated to adjust the position of the substrate S while advancing the movable body 51 and the alignment arm 55 in the direction of the substrate S. As shown in FIG. When the position adjustment of the substrate S is completed, the linear drive mechanism 53 is operated to reverse the movable body 51 and the alignment arm 55, and then the rotation drive mechanism 57 is operated to align the arm 55. Rotate in a direction away from the substrate (S).

When the substrate position adjustment is completed in this manner, the lift pin 63 is lowered so that the substrate S is placed on the chucking plate 10, and the suction pipe 66 of the suction unit 65 is raised. After contacting the suction hole 13 of the chucking plate 10, a suction force is generated to adhere the substrate S to the chucking plate 10. In this case, since the adhesive chucks 110 are provided on the upper surface of the chucking plate 10, the substrate S is chucked and fixed while being in close contact with the adhesive chuck 110.

As such, when the substrate S is fixed by the adhesive chuck 110 of the chucking plate 10, the suction pipe 66 is lowered.

3) The setting module input step (S3) will be described.

As described above, when the substrate S is fixed to the chucking plate 10 through the plate loading step S1 and the substrate loading step S2, the fixing clamp 30 is operated to fix the chucking plate 10. Then, the setting module having the substrate S fixed to the chucking plate 10 is introduced into the process progress space such as a deposition chamber by using a transfer robot.

When the setting module is put into the deposition chamber through the above steps, the chucking plate 10 is moved to the deposition process progress position while being mounted on a transfer device such as a roller provided in the deposition chamber, and then the substrate S When the deposition process is completed after the deposition process of depositing the organic material on the, the setting module is discharged out of the deposition chamber, the dechucking process of the present invention is carried out.

Next, the substrate dechucking method will be described with reference to FIG. 12 and the like.

In the substrate dechucking method according to the present invention, the setting module discharged from the deposition chamber is placed on the base frame 20 and then the setting module loading step of fixing the setting module on the base frame 20 after adjusting the position (S4). Wow; After the setting module loading step (S4), the substrate unloading step (S5) for separating the substrate (S) fixed to the chucking plate 10; After the substrate unloading step (S5), it comprises a substrate discharge step (S6) for moving the substrate (S).

The substrate dechucking method will be described in detail with respect to each of the above steps.

The substrate dechucking method may be performed using the substrate chucking dechucking apparatus 100 or the substrate dechucking apparatus 300 described above.

4) The setting module loading step (S4) will be described.

The setting module discharged from the deposition chamber is loaded on the base frame 20 of the substrate chucking dechucking apparatus 100 (or the substrate dechucking apparatus 300).

When the setting module is checked, the plate alignment mechanism 40 operates to adjust the position of the chucking plate 10, and when the position adjustment of the chucking plate 10 is completed, the fixing clamp 30 is operated to operate the chucking plate. (10) is fixed and the floating operation of the floating unit 25 is performed.

5) The substrate unloading step S5 will be described.

The dechucking rod 71 of the dechucking unit 70 is raised to separate the substrate S attached to the chucking plate 10. At this time, the diaphragm 73 is expanded by injecting air pressure after raising the dechucking rod 71 to separate the substrate S from the chucking plate 10.

When the substrate S is separated from the chucking plate 10, the lift pin 63 of the lift pin unit 60 is raised to raise the substrate S from the chucking plate 10. In this case, the substrate S may be raised using the dechucking rod 71 of the dechucking unit 70 instead of the lift pin unit 60.

In a state where the substrate S is raised, the substrate alignment mechanism 50 is operated to adjust the position of the substrate S. FIG. That is, the alignment arm 55 is rotated by the rotation drive mechanism 57, the alignment arm 55 is advanced by the linear drive mechanism 53 to adjust the position of the substrate S, and then the alignment arm ( After reversing 55, the align arm 55 is rotated and returned.

6) The substrate discharge step (S6) will be described.

The arm for transferring the substrate S is inserted between the lift pins 63 supporting the substrate S after raising the substrate S, and then the substrate S is lifted up to discharge the substrate S to the outside.

After the substrate S is discharged as described above, the clamp unit is operated to release the chucking plate 10, and then the chucking plate 10 is also taken out.

On the contrary, in the case of the substrate chucking dechucking apparatus 100, since the chucking and the dechucking method can be implemented in one apparatus, the process of carrying out the chucking plate 10 to the outside is omitted, with reference to FIG. 11. Substrate loading and substrate position alignment, substrate fixing work, etc. which were demonstrated can be performed.

Meanwhile, in the above description of the embodiment of the present invention, the apparatus and method used when the substrate is brought into and out of the deposition equipment for manufacturing OLED are described, but the present invention is not limited thereto. It can be used by applying to the chucking dechucking device and method, such as all the equipment to put and take out the setting module in a fixed state, that is, display manufacturing equipment or semiconductor manufacturing equipment.

As described above, the technical ideas described in the embodiments of the present invention can be performed independently of each other, and can be implemented in combination with each other. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art. It is possible. Accordingly, the technical scope of the present invention should be determined by the appended claims.

Claims (10)

A plurality of adhesive chucks disposed on one side at regular intervals and attached to and fixed to the substrate, and a plurality of suction holes penetrating up and down to form a negative pressure for adsorbing the substrate, are fixed to the one side of the substrate. Configured to be transported together,
The substrate chucking plate, characterized in that the suction groove is connected to the suction hole to provide a suction force from the suction hole to the periphery.
The method according to claim 1,
The chucking plate, the sticking chuck and the suction hole is provided with a chucking portion to which the substrate is fixed, and an outer portion provided around the chucking portion,
The outer portion is a substrate chucking plate comprising a reinforcing plate is further provided to reinforce the rigidity.
The method according to claim 1,
And the chucking plate includes a plurality of dechucking holes in which a dechucking unit separating the substrate is provided.
The method according to claim 3,
Each of the adhesive chuck is a substrate chucking plate, characterized in that configured to be disposed around the dechucking hole.
The method according to claim 3,
Each adhesive chuck has a circular ring or a polygonal ring-shaped base plate installed on one side of the chucking plate around the dechucking hole, and an adhesive ring provided on one side of the base plate to provide adhesion to the substrate. Substrate chucking plate comprising a comprising.
The method of claim 5,
The adhesive ring is a substrate chucking plate, characterized in that the adhesive projections are arranged at intervals on one side.
delete The method according to claim 1,
And the suction groove includes one configured to pass through the circumference of each adhesive chuck.
A plate loading step of fixing the chucking plate on the base frame after adjusting the position after raising the chucking plate according to claim 1 on the base frame;
After the plate loading step, placing the substrate on top of the chucking plate and then adjusting the position to fix the substrate on the chucking plate;
After the substrate loading step, the substrate chucking method comprising the step of releasing the fixing state of the chucking plate in the base frame to transfer the setting module fixed to the chucking plate substrate into the chamber for the process progress.
A setting module discharging step of discharging a setting module having a substrate fixed to the chucking plate according to claim 1 from a chamber for processing the process;
A setting module loading step of fixing the setting module on the base frame after raising the setting module discharged through the setting module discharge step on the base frame and then adjusting the position;
A substrate unloading step of separating the substrate fixed to the chucking plate after the setting module loading step;
And a substrate discharging step of discharging the substrate after the substrate unloading step.

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