KR101206261B1 - Adhesive plate for manufacturing OLED device - Google Patents

Abstract

The present invention configures the adhesive force of the adhesive members on the plate differently according to the installation position, and improves the performance of adhering and supporting the substrate as a whole, and also allows the substrate to be easily separated without being damaged when the substrate is separated. It provides a pressure-sensitive adhesive plate of the equipment for manufacturing OLED that can contribute to the improvement of.

Description

Adhesive plate for manufacturing OLED equipment {Adhesive plate for manufacturing OLED device}

The present invention relates to an adhesive plate for supporting and fixing a substrate in an OLED manufacturing equipment used in the equipment for manufacturing an OLED.

In general, OLED (Organic Light Emitting Diode), also called organic EL, refers to a self-luminous organic material that emits itself by using an electroluminescence phenomenon that emits light when a current flows through a fluorescent organic compound.

OLED deposition equipment is needed to make display of TV or mobile phone using OLED and to produce lighting equipment.

OLED deposition equipment is used to form a thin film by depositing organic materials on a substrate, and is a key equipment for OLED production.

As a deposition equipment for OLED manufacturing, a vacuum evaporation system is mainly used. In general, a deposition space portion where a substrate is introduced and deposited is provided on an upper portion of a deposition chamber, and a source for supplying a deposition material thereunder. And a heating device for heating the source.

Such a vacuum thermal evaporation apparatus is configured to deposit organic materials on a substrate by providing organic matter (possibly inorganic) evaporated from a source in a state where a substrate is positioned in a deposition space.

In particular, the substrate is deposited in a state in which the substrate is bonded to the mask, such as a method of injecting only the substrate under the condition that the mask is set in the deposition chamber, a method of bonding the substrate and the mask outside the deposition chamber to the deposition chamber.

In either case, the substrate is generally introduced into the deposition chamber with the module supporting it.

There are several ways to set the substrate in the module, one of which is using an adhesive plate, which is placed in the deposition chamber with the substrate fixed to the adhesive plate, and the organic material is applied to the substrate in a high vacuum environment in the deposition chamber. Will be deposited.

In the method of fixing and supporting a substrate using such an adhesive plate, as the substrate is enlarged, a necessity of supporting the substrate more stably is required.

In particular, the deposition chamber for OLED fabrication is carried out in a high vacuum and high temperature environment, since all the adhesive members (or adhesive chucks) provided on the adhesive plate are configured to have the same adhesive force, so that the substrate may be too thick or too weak as a whole. There is a problem that the substrate is not easily separated from the adhesive plate, or the substrate may be broken while the substrate falls from the adhesive plate.

The contents of the background art described above are technical information that the inventor of the present application holds for the derivation of the present invention or acquired in the derivation process of the present invention and is a known technology disclosed to the general public prior to the filing of the present invention I can not.

The present invention has been made in order to solve the above problems, by configuring the adhesive force of the pressure-sensitive adhesive member provided in the pressure-sensitive adhesive plate for each position, improve the performance of supporting the adhesive to the substrate as a whole, and also breaks when separating the substrate It is an object of the present invention to provide a pressure-sensitive adhesive plate of equipment for manufacturing OLED that can be easily separated without, thereby contributing to the improvement of process performance.

Adhesive plate of the equipment for manufacturing OLED according to the present invention for realizing the above object is a plate for supporting the substrate; A plurality of adhesive members are provided on the plate to provide an adhesive force so that the substrate can be attached, the plurality of adhesive members are characterized in that the adhesive force for adhering the substrate according to the installation position on the plate is different .

The plate is formed in a rectangular plate-like structure, and when the adhesive members are uniformly arranged on the rectangular plate shape, the adhesive force of the adhesive members provided in the region adjacent to each vertex of the plate differs from the adhesive members provided in the region other than the vertex. It can be configured to.

At this time, the pressure-sensitive adhesive plate, it is preferable that the adhesive force of the adhesive members provided in the region adjacent to each vertex is configured to have a higher adhesive force than the adhesive force of the adhesive members provided in the region other than the vertex.

The plate is formed in a rectangular plate structure, and when the adhesive members are uniformly arranged on the rectangular plate shape, the adhesive members are installed in an area adjacent to both corner portions of the plate and adhesive members provided in an area other than both corner portions. It may be configured so that the adhesive force is different.

At this time, the pressure-sensitive adhesive plate, it is preferable that the adhesive force of the adhesive members provided in the region adjacent to both corner portions is configured to have a higher adhesive force than the adhesive force of the adhesive members installed in the region other than the both corner portions.

On the other hand, the pressure-sensitive adhesive plate, it is preferable that the pressure-sensitive adhesive members having a relatively high adhesive strength and the pressure-sensitive adhesive members having a relatively low adhesive strength are arranged in a symmetrical arrangement around the center of the plate.

The main problem solving means of the present invention as described above, will be described in more detail and clearly through examples such as 'details for the implementation of the invention', or the accompanying 'drawings' to be described below, wherein In addition to the main problem solving means as described above, various problem solving means according to the present invention will be further presented and described.

Since the pressure-sensitive adhesive plate of the OLED manufacturing equipment according to the present invention is configured differently depending on the installation position of the pressure-sensitive adhesive member provided on the pressure-sensitive adhesive plate, it improves the performance of supporting and sticking the substrate as a whole. It can be easily separated without providing an effect that can contribute to the improvement of process performance.

Figure 1 is a schematic diagram showing the internal configuration of the equipment for manufacturing OLED using the adhesive plate according to the present invention.
2 is a perspective view of a first embodiment showing an adhesive plate according to the present invention.
3 is a reference graph showing the hardness of the adhesive material and the strength of the adhesive force in the adhesive plate according to the present invention.
4 is a perspective view of a second embodiment showing an adhesive plate according to the present invention.
5 is a perspective view of a third embodiment showing an adhesive plate according to the present invention.
6 is a perspective view and detailed view of another embodiment showing an adhesive plate according to the present invention.
FIG. 7 is a perspective view of an essential part of the adhesive plate illustrated in FIG. 6.
FIG. 8 is a perspective view illustrating an adhesive chuck provided in the adhesive plate illustrated in FIG. 6.
9 is a rear perspective view of the pressure-sensitive adhesive plate illustrated in FIG. 6.
FIG. 10 is a perspective view showing a dechucking rod used for the adhesive plate as illustrated in FIG. 6.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

Referring to FIG. 1, a deposition apparatus for manufacturing an OLED includes a deposition chamber 20 in which a substrate S is introduced and deposition is performed.

In the deposition chamber 20, the substrate S is positioned in the upper space, and the deposition material supply device 30 for supplying a deposition material made of an organic material or an inorganic material in the lower space is preferably configured to be positioned. However, the present invention is not limited thereto, but the substrate S is positioned in the lower space and the deposition material supply device 30 is positioned in the upper space, or the substrate S is disposed in a vertical or inclined direction. It is also possible to configure the deposition material supply device 30 in front of the).

The arrangement of the substrate S and the deposition material supply device 30 may be variously changed using a known structure according to the implementation conditions.

Preferably, the substrate S is introduced into the deposition chamber 20 in a state of being integrally set to the adhesive plate 10, and the substrate S is introduced in a state in which the substrate S is bonded to the mask or in the deposition chamber 20. In this case, the mask is bonded with the mask. In the drawings of this embodiment, the mask is omitted.

 In addition, the pressure-sensitive adhesive plate 10 is preferably positioned in a state supported by the transport structure 25 or the support structure in the deposition chamber 20.

Specific configuration of the pressure-sensitive adhesive plate 10 will be described in detail below with reference to FIGS. 2 to 9.

The deposition material supply device 30 may be configured of a point source, a linear source, and the like, which are commonly used. In addition, a heating device 33 for heating the container (or crucible) 31 in which the deposition material is stored is provided.

Meanwhile, although not illustrated in the drawing, various known configurations for the deposition process, such as a film thickness measuring apparatus capable of measuring the film thickness deposited on the substrate S, may be provided inside the deposition chamber 20.

Now, various embodiments of the adhesive plate 10 will be described with reference to FIGS. 2 to 9.

For reference, FIGS. 2, 4 and 5 illustrate embodiments of an adhesive plate having an adhesive member, and FIGS. 6 to 9 illustrate an adhesive plate having a different structure (a circular ring-shaped adhesive chuck). Figures of one embodiment. In these drawings and detailed description, the same reference numerals are given to the same or similar constituent parts, and the repeated description is omitted if possible.

First, with reference to FIG. 2, FIG. 4, FIG. 5, the adhesive plate 10 which has an adhesion member is demonstrated.

Referring to FIG. 2, the adhesive plate 10 includes a plate 101 supporting a substrate and an adhesive member 105 provided on one side of the plate 101 (upper surface in FIG. 2, etc.).

The shape of the plate 101 is preferably configured according to the shape of the substrate S. In the drawing of the present embodiment, the plate 101 of the rectangular plate structure is illustrated so as to support the substrate of the rectangular structure.

The plate 101 may be largely divided into the chucking part 103 to which the outer part 102 and the substrate S are fixed. At this time, the plate 101 is preferably composed of an aluminum material.

The outer portion 102, with reference to FIG. 1, is a component that is mounted on top of the transfer structure 25 or the support structure within the deposition chamber 20.

The outer portion 102 is preferably made of a structure in which a stainless steel plate 103, which is a reinforcing plate, is further attached to one side (substrate attaching surface) so that the adhesive plate 10 may have sufficient rigidity as a whole. This is to simply replace the stainless steel plate 103 when the upper surface of the outer portion 102 is damaged.

The chucking part 104 is a part to which the board | substrate S adheres and is fixed, and the surface can be comprised by anodizing.

In particular, the chucking unit 104 is provided with an adhesive member 105 having an adhesive force so that the substrate S is attached and fixed.

The adhesive member 105 is configured to be uniformly disposed at regular intervals as a whole on the chucking portion 104 of the plate 101 when the plate 101 is configured in a rectangular plate shape as illustrated in FIG. 2 and the like. desirable.

The adhesive member 105 may be configured using any material having a known adhesive force, such as silicone rubber or an acrylic material having adhesive force.

As such, the adhesive members 105 provided on the upper portion of the plate 101 are configured to have different adhesive strengths for adhering the substrate according to the installation position on the plate 101.

That is, as shown in FIG. 2, the adhesive force of the adhesive members 106 positioned at the vertex portion side of the plate 101 may be higher than that of the adhesive members 107 positioned at the other portion.

In this case, the size of the adhesive force may be adjusted by adjusting physical properties when the adhesive member 105 is made of the same or similar material.

That is, as illustrated in FIG. 3, the higher the hardness of the adhesive material, the lower the strength of the adhesive force, and the lower the hardness, the higher the strength of the adhesive force, thereby controlling the adhesive force of the adhesive member 105.

Therefore, the specific adhesive material can be formed by adding a functional material capable of adjusting the hardness of the material, for example, an inorganic material such as glass fiber. That is, since the adhesive material may be mostly made of a polymer material, it is also possible to adjust the hardness by adding a functional material to control the molecular weight of the polymer material.

As described above, in the case where the adhesive force of the adhesive members 106 positioned at the vertex portion of the plate 101 is higher than the adhesive force of the adhesive members 107 positioned at the other portion, the vertex portion of the substrate is formed in the plate ( Since it is placed in the deposition chamber in a state where it is firmly attached to the 101, it is possible to solve the problem of the substrate falling from the plate (101). In addition, by increasing the adhesive force of the adhesive member 106 only at a vertex portion or the like that can be relatively easily dropped without increasing the adhesive force to all the adhesive members 105, the substrate 101 is maintained in the plate 101 as well as maintaining the overall stable adhesion state. It is easy to separate even when separating.

4 shows an embodiment in which the adhesive force of the adhesive member 106 positioned at the corner portions of both sides of the plate 101 is higher than the adhesive force of the adhesive member 107 positioned at the other portions.

It is usually moved in a state in which it is mounted on a supporting structure such as a roller in the deposition chamber 20 (see FIG. 1) on both side portions of the plate 101, so that both side edge portions of the plate 101 are moved than other portions during the movement process. Since the substrate is easily separated from the side, the adhesive members 106 having relatively higher adhesive force than the adhesive members 107 of the other parts are formed on both sides, thereby minimizing falling of both sides of the substrate from the adhesive plate 10, thereby ensuring stable attachment. State can be maintained.

FIG. 5 illustrates that the adhesive force of the adhesive member 106 positioned symmetrically around the center portion of the plate 101 and the center portion thereof is higher than that of the adhesive member 107 positioned elsewhere. An example is shown.

In this case, the adhesive force of the adhesive member 105 is increased only partially on the plate 101, and thus the substrate is attached and supported, thereby maintaining a stable substrate attachment state and increasing the adhesive force of the entire adhesive member 105 even when the substrate is separated. The substrate can be separated more smoothly.

In addition to the configuration illustrated through the various embodiments described above, the adhesive force of the adhesive members 105 formed on the plate 101 in accordance with the implementation conditions is configured by appropriately setting the size of the adhesive force according to the installation position of the plate 101 can do.

In addition, the adhesive force of the adhesive member 105 according to the installation position is not divided into two, but it is also possible to comprise so that it may have a difference of three or more adhesive forces.

As described above, by using the basic structure of the pressure-sensitive adhesive plate 10 having the pressure-sensitive adhesive member 105, the structure of the pressure-sensitive adhesive plate 10 having a different structure as a whole is possible.

6 to 10 are views showing another embodiment of the adhesive plate 10 according to the present invention.

As shown in FIG. 6, the adhesive plate 10 is composed of the plate 101 and the adhesive member 110 in the same manner as the above-described embodiments.

However, in the present embodiment, the adhesive member 110 having a circular ring structure is configured.

That is, the suction hole 13, the dechucking hole 15, etc. are comprised in the chucking part 12 of the plate 101, and the adhesion member 110 which the board | substrate S adheres and is fixed is comprised.

The suction hole 13 may be configured in various ways as long as the suction hole 13 penetrates the adhesive plate 10. In the drawing of the present embodiment, the suction hole 13 is disposed at a predetermined interval in a slit structure, and the suction hole ( 13 shows a structure in which the suction grooves 14 are continuously formed on one side of the pressure-sensitive adhesive plate 10 so that negative pressure can be uniformly formed. That is, in the drawing, one slit-shaped suction hole 13 is formed between the four dechucking holes 15, and each dechucking hole 15 and the adhesive member 110 are centered around the suction hole 13. The suction groove 14 is connected to pass through the perimeter.

In this structure, the suction holes 13 and the suction grooves 14 may be uniformly disposed on one side of the adhesive plate 10 to uniformly adsorb and adhere the substrate S. FIG.

In addition, the suction groove 14, which is continued from the suction hole 13, is formed to pass around the adhesive member 110, so that the substrate S may be adhered to the adhesive member 110 more firmly. .

The dechucking hole 15 is a portion configured to pass through the dechucking rod 71 (see FIG. 10) for the dechucking operation. The dechucking rod 71 will be described in detail below with reference to FIG. 10.

The adhesive member 110 may be formed in a circular ring structure around the dechucking hole 15 as illustrated in the drawing.

The adhesive member 110 is provided with a circular ring-shaped base plate 111 provided on one side of the plate 101 around the dechucking hole 15, and provided on an upper surface of the base plate 111 to form a substrate (S). It is configured to include an adhesive ring 115 to provide an adhesive force to be attached).

The base plate 111 may be installed on the plate 101 by a screw assembly method, and the inner upper surface on which the adhesive ring 115 is installed is formed to be relatively lower than the outer upper surface.

The adhesive ring 115 is made of a material that provides the adhesive force, it is preferable that the adhesive projection 117 is disposed on the upper surface at a predetermined interval.

The adhesive ring 115 and the adhesive protrusion 117 is configured to change the size of the adhesive force according to the position on the plate 101, as described above with reference to FIGS. 2, 4, and 5. Since the configuration of the embodiment in which the adhesive force varies depending on the installation position of the adhesive member can be configured in the same or similar manner as the description of the above-described embodiment, repeated description is omitted.

Meanwhile, the adhesive plate 10 has a groove 121 formed in a circular structure so that the base plate 111 of the adhesive member 110 may be installed around the dechucking hole 15, and the base plate 111 may be formed. It is preferable that the upper surface and the upper surface of the plate 101 is configured to have the same height.

FIG. 9 is a view illustrating the other side structure of the adhesive plate 10, and has a structure in which a plurality of ribs 19 are formed between the outer edges 18 at the lower portion of the adhesive plate 10. The pressure-sensitive adhesive plate 10 having the other side structure as described above may minimize the thickness of the pressure-sensitive adhesive plate 10 through the outer frame 18 and the plurality of ribs 19, thereby realizing light weight and maintaining rigidity.

Meanwhile, the dechucking rod 71 will be briefly described with reference to FIG. 10.

The dechucking rod 71 is composed of a pipe-shaped rod 72 into which air pressure is injected, and a diaphragm 73 provided at an upper end of the rod 72 to expand and contract.

The upper end of the pipe-shaped rod 72 is provided with a circular flange-shaped support 74 having a space for supporting the diaphragm 73 and the air pressure is injected.

The dechucking rod 71 configured as described above expands the diaphragm 73 through the rod 72 when the substrate S attached to the adhesive member 110 of the adhesive plate 10 is separated as described above. By doing so, the substrate S can be separated from the adhesive member 110.

As described above, the technical ideas described in the embodiments of the present invention can be performed independently of each other, and can be implemented in combination with each other. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art. It is possible. Accordingly, the technical scope of the present invention should be determined by the appended claims.

Claims (6)

An adhesive plate comprising a plate for supporting a substrate,
A plurality of adhesive members are provided on the plate to provide an adhesive force to attach the substrate, and the plurality of adhesive members are different from each other to adhere the substrate according to an installation position on the plate.
The plate is provided with a plurality of suction holes in which a negative pressure for adsorbing the substrate is formed, and suction grooves connected with the plurality of suction holes,
The suction groove is a pressure-sensitive adhesive plate of the OLED manufacturing equipment, characterized in that formed continuously to pass through the circumference of the adhesive member.
The method according to claim 1,
The plate is formed in a rectangular plate structure,
When the adhesive members are installed uniformly arranged on a square plate,
The pressure-sensitive adhesive plate of the OLED manufacturing equipment, characterized in that the adhesive force of the pressure-sensitive adhesive members installed in the region adjacent to each vertex of the plate and the pressure-sensitive adhesive members provided in the region other than the vertex.
The method of claim 2,
The pressure-sensitive adhesive plate, the pressure-sensitive adhesive plate of the OLED manufacturing equipment, characterized in that the adhesive force of the pressure-sensitive adhesive members installed in the area adjacent to each vertex is configured to have a higher adhesive force than the pressure-sensitive adhesive force of the pressure-sensitive adhesive members provided in the area other than the vertex.
The method according to claim 1,
The plate is formed in a rectangular plate structure,
When the adhesive members are installed uniformly arranged on a square plate,
The pressure-sensitive adhesive plate of the OLED manufacturing equipment, characterized in that the adhesive force of the pressure-sensitive adhesive members provided in the region adjacent to both corner portions of the plate and the pressure-sensitive adhesive members provided in the region other than the both corner portions.
The method of claim 4,
The pressure-sensitive adhesive plate, the pressure-sensitive adhesive plate of the OLED manufacturing equipment, characterized in that the adhesive force of the pressure-sensitive adhesive members installed in the areas adjacent to both corner portions are configured to have a higher adhesive force than the pressure-sensitive adhesive force of the pressure-sensitive adhesive members placed in the areas other than the both corner portions.
The method according to any one of claims 1 to 5,
The pressure-sensitive adhesive plate is a pressure-sensitive adhesive plate of the OLED manufacturing equipment, characterized in that the pressure-sensitive adhesive members having a relatively high adhesive force and the adhesive members having a relatively low adhesive force are arranged symmetrically around the center of the plate.

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