KR101201698B1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

Info

Publication number
KR101201698B1
KR101201698B1 KR1020117025808A KR20117025808A KR101201698B1 KR 101201698 B1 KR101201698 B1 KR 101201698B1 KR 1020117025808 A KR1020117025808 A KR 1020117025808A KR 20117025808 A KR20117025808 A KR 20117025808A KR 101201698 B1 KR101201698 B1 KR 101201698B1
Authority
KR
South Korea
Prior art keywords
electrodes
pair
memory element
voltage
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020117025808A
Other languages
English (en)
Korean (ko)
Other versions
KR20110127286A (ko
Inventor
요지 노무라
히로코 아베
유지 이와키
?페이 야마자키
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 한도오따이 에네루기 켄큐쇼 filed Critical 가부시키가이샤 한도오따이 에네루기 켄큐쇼
Publication of KR20110127286A publication Critical patent/KR20110127286A/ko
Application granted granted Critical
Publication of KR101201698B1 publication Critical patent/KR101201698B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/22Safety or protection circuits preventing unauthorised or accidental access to memory cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/202Integrated devices comprising a common active layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009RRAM elements whose operation depends upon chemical change
    • G11C13/0014RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0059Security or protection circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C17/00Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • G11C17/16Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60Organic compounds having low molecular weight
    • H10K85/611Charge transfer complexes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60Organic compounds having low molecular weight
    • H10K85/631Amine compounds having at least two aryl rest on at least one amine-nitrogen atom, e.g. triphenylamine
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/04Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/77Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/79Array wherein the access device being a transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Security & Cryptography (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Read Only Memory (AREA)
KR1020117025808A 2004-10-18 2005-10-12 반도체 장치 Expired - Fee Related KR101201698B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004303595 2004-10-18
JPJP-P-2004-303595 2004-10-18
PCT/JP2005/019156 WO2006043573A1 (en) 2004-10-18 2005-10-12 Semiconductor device and driving method of the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020077011426A Division KR101164437B1 (ko) 2004-10-18 2005-10-12 반도체 장치 및 그것의 구동 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020127005780A Division KR20140015128A (ko) 2004-10-18 2005-10-12 반도체 장치

Publications (2)

Publication Number Publication Date
KR20110127286A KR20110127286A (ko) 2011-11-24
KR101201698B1 true KR101201698B1 (ko) 2012-11-15

Family

ID=36202988

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020117025808A Expired - Fee Related KR101201698B1 (ko) 2004-10-18 2005-10-12 반도체 장치
KR1020127005780A Ceased KR20140015128A (ko) 2004-10-18 2005-10-12 반도체 장치
KR1020077011426A Expired - Fee Related KR101164437B1 (ko) 2004-10-18 2005-10-12 반도체 장치 및 그것의 구동 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020127005780A Ceased KR20140015128A (ko) 2004-10-18 2005-10-12 반도체 장치
KR1020077011426A Expired - Fee Related KR101164437B1 (ko) 2004-10-18 2005-10-12 반도체 장치 및 그것의 구동 방법

Country Status (7)

Country Link
US (3) US7499305B2 (https=)
EP (2) EP2348460B1 (https=)
JP (1) JP5019737B2 (https=)
KR (3) KR101201698B1 (https=)
CN (2) CN100557813C (https=)
TW (2) TWI446606B (https=)
WO (1) WO2006043573A1 (https=)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101044624A (zh) * 2004-10-22 2007-09-26 株式会社半导体能源研究所 半导体器件
KR101219749B1 (ko) 2004-10-22 2013-01-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
WO2006051996A1 (en) 2004-11-11 2006-05-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7688624B2 (en) * 2004-11-26 2010-03-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8604547B2 (en) * 2005-02-10 2013-12-10 Semiconductor Energy Laboratory Co., Ltd. Memory element and semiconductor device
US7956352B2 (en) 2005-03-25 2011-06-07 Semiconductor Energy Laboratory Co., Ltd. Memory element comprising an organic compound and an insulator
US7926726B2 (en) * 2005-03-28 2011-04-19 Semiconductor Energy Laboratory Co., Ltd. Survey method and survey system
TWI475667B (zh) 2005-03-28 2015-03-01 半導體能源研究所股份有限公司 記憶裝置和其製造方法
CN101167189B (zh) * 2005-04-27 2013-09-18 株式会社半导体能源研究所 半导体器件的制造方法
EP1717862A3 (en) * 2005-04-28 2012-10-10 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
US7700984B2 (en) 2005-05-20 2010-04-20 Semiconductor Energy Laboratory Co., Ltd Semiconductor device including memory cell
EP1886261B1 (en) 2005-05-31 2011-11-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7868320B2 (en) 2005-05-31 2011-01-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7905397B2 (en) * 2005-06-01 2011-03-15 Semiconductor Energy Laboratory Co., Ltd. Data management method and data management system
KR101369864B1 (ko) 2005-08-12 2014-03-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그 제조방법
US7912439B2 (en) 2005-11-25 2011-03-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and operating method thereof
US7684781B2 (en) 2005-11-25 2010-03-23 Semiconductor Energy Laboratory Co., Ltd Semiconductor device
WO2007088795A1 (en) * 2006-02-03 2007-08-09 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of memory element, laser irradiation apparatus, and laser irradiation method
US8580700B2 (en) * 2006-02-17 2013-11-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
CN101401209B (zh) * 2006-03-10 2011-05-25 株式会社半导体能源研究所 存储元件以及半导体器件
EP1850378A3 (en) * 2006-04-28 2013-08-07 Semiconductor Energy Laboratory Co., Ltd. Memory device and semicondutor device
US7923719B2 (en) 2006-04-28 2011-04-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device wherein wiring contact is made through an opening in an organic compound layer
US7551471B2 (en) * 2006-04-28 2009-06-23 Semiconductor Energy Laboratory Co., Ltd. Memory element and semiconductor device
JP5230119B2 (ja) * 2006-04-28 2013-07-10 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
US7719001B2 (en) * 2006-06-28 2010-05-18 Semiconductor Energy Laboratory Co., Ltd Semiconductor device with metal oxides and an organic compound
EP1883109B1 (en) 2006-07-28 2013-05-15 Semiconductor Energy Laboratory Co., Ltd. Memory element and method of manufacturing thereof
WO2008047928A1 (en) * 2006-10-19 2008-04-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US7988057B2 (en) * 2006-11-28 2011-08-02 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
CN101529596B (zh) * 2006-11-29 2011-12-14 株式会社半导体能源研究所 装置及其制造方法
US8283724B2 (en) 2007-02-26 2012-10-09 Semiconductor Energy Laboratory Co., Ltd. Memory element and semiconductor device, and method for manufacturing the same
US7875881B2 (en) * 2007-04-03 2011-01-25 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
DE102007030308A1 (de) * 2007-06-29 2009-01-02 Printed Systems Gmbh Verfahren zum Herstellen einer Speicherstruktur
EP2107571B1 (en) 2008-04-03 2012-04-25 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device
KR20140069342A (ko) 2008-05-16 2014-06-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광소자 및 전자기기
JP4727702B2 (ja) * 2008-09-11 2011-07-20 株式会社 日立ディスプレイズ 液晶表示装置、及びその製造方法
US8593255B2 (en) * 2009-04-24 2013-11-26 Nokia Corporation Method and apparatus for providing user interaction via transponders
GB2470006B (en) * 2009-05-05 2012-05-23 Cambridge Display Tech Ltd Device and method of forming a device
US8469280B2 (en) 2009-10-22 2013-06-25 Intellipaper, Llc Programming devices and programming methods
US8469271B2 (en) 2009-10-22 2013-06-25 Intellipaper, Llc Electronic storage devices, programming methods, and device manufacturing methods
WO2011127183A2 (en) * 2010-04-07 2011-10-13 Intellipaper , Llc Memomy programming methods and memory programming devices
WO2011127328A2 (en) 2010-04-07 2011-10-13 Intellipaper, Llc Electronic assemblies and methods of forming electronic assemblies
KR101290003B1 (ko) * 2011-08-31 2013-07-31 한국과학기술원 플렉서블 메모리 소자 제조방법 및 이에 의하여 제조된 플렉서블 메모리 소자
US8947903B2 (en) * 2011-07-07 2015-02-03 Taiwan Semiconductor Manufacturing Company, Ltd. Memory chip with more than one type of memory cell
CN102761793B (zh) * 2012-06-12 2014-10-29 烽火通信科技股份有限公司 一种矩阵化eID总线电路
RU2702271C2 (ru) * 2015-06-10 2019-10-07 Тосиба Мемори Корпорейшн Запоминающее устройство с изменением сопротивления
KR101720867B1 (ko) * 2015-07-17 2017-03-28 국민대학교산학협력단 저항 변화를 이용한 비휘발성 메모리 소자
KR101720868B1 (ko) * 2015-07-18 2017-03-28 국민대학교산학협력단 저항 변화를 이용한 비휘발성 메모리 소자
CZ307127B6 (cs) * 2016-07-25 2018-01-24 Vysoké Učení Technické V Brně Radiofrekvenční identifikátor laditelný dielektrickými vložkami
CN107884732A (zh) * 2016-09-30 2018-04-06 西门子(深圳)磁共振有限公司 磁共振成像设备、射频线圈及其制造方法
CN109307964B (zh) * 2017-07-28 2021-09-10 京东方科技集团股份有限公司 断线修复方法、基板和显示装置
CN110632668B (zh) * 2019-10-14 2024-05-17 厦门顶尖电子有限公司 一种电子价签的定位方法、电子价签组件及系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100191975B1 (ko) 1994-09-09 1999-06-15 포만 제프리 엘 얇은 가요성 전자 무선 주파수 태그 장치
WO2002037500A1 (en) 2000-10-31 2002-05-10 The Regents Of The University Of California Organic bistable device and organic memory cells
JP2003002647A (ja) 2000-12-27 2003-01-08 Mitsubishi Materials Corp Plzt強誘電体薄膜、その形成用組成物及び形成方法

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833894A (en) * 1973-06-20 1974-09-03 Ibm Organic memory device
JPH02239664A (ja) * 1989-03-13 1990-09-21 Olympus Optical Co Ltd 電気的記憶装置
US5375250A (en) * 1992-07-13 1994-12-20 Van Den Heuvel; Raymond C. Method of intelligent computing and neural-like processing of time and space functions
US6340588B1 (en) 1995-04-25 2002-01-22 Discovery Partners International, Inc. Matrices with memories
WO1997030445A1 (en) 1996-02-16 1997-08-21 Philips Electronics N.V. Write-once read-many electrical memory element of a conjugated polymer or oligomer
TW317643B (https=) * 1996-02-23 1997-10-11 Handotai Energy Kenkyusho Kk
NO972803D0 (no) 1997-06-17 1997-06-17 Opticom As Elektrisk adresserbar logisk innretning, fremgangsmåte til elektrisk adressering av samme og anvendelse av innretning og fremgangsmåte
US6337492B1 (en) * 1997-07-11 2002-01-08 Emagin Corporation Serially-connected organic light emitting diode stack having conductors sandwiching each light emitting layer
US6396208B1 (en) * 1998-01-27 2002-05-28 Nec Corporation Organic electroluminescent device and its manufacturing process
US6812182B2 (en) * 1998-10-23 2004-11-02 Albemarle Corporation Compositions formed from hydroxyaluminoxane and their use as catalyst components
WO2001003208A1 (en) 1999-07-02 2001-01-11 President And Fellows Of Harvard College Nanoscopic wire-based devices, arrays, and methods of their manufacture
JP3622598B2 (ja) * 1999-10-25 2005-02-23 セイコーエプソン株式会社 不揮発性メモリ素子の製造方法
US6478229B1 (en) * 2000-03-14 2002-11-12 Harvey Epstein Packaging tape with radio frequency identification technology
JP2001345431A (ja) 2000-05-31 2001-12-14 Japan Science & Technology Corp 有機強誘電体薄膜及び半導体デバイス
JP3843703B2 (ja) * 2000-06-13 2006-11-08 富士ゼロックス株式会社 光書き込み型記録表示装置
DE10045192A1 (de) * 2000-09-13 2002-04-04 Siemens Ag Organischer Datenspeicher, RFID-Tag mit organischem Datenspeicher, Verwendung eines organischen Datenspeichers
US6646912B2 (en) * 2001-06-05 2003-11-11 Hewlett-Packard Development Company, Lp. Non-volatile memory
US6552409B2 (en) * 2001-06-05 2003-04-22 Hewlett-Packard Development Company, Lp Techniques for addressing cross-point diode memory arrays
JP2003007982A (ja) * 2001-06-22 2003-01-10 Nec Corp 磁気記憶装置及び磁気記憶装置の設計方法
US6872472B2 (en) * 2002-02-15 2005-03-29 Eastman Kodak Company Providing an organic electroluminescent device having stacked electroluminescent units
JP2003257506A (ja) 2002-02-27 2003-09-12 Fuji Photo Film Co Ltd 電解質組成物、光電変換素子及び光電池
US6683322B2 (en) * 2002-03-01 2004-01-27 Hewlett-Packard Development Company, L.P. Flexible hybrid memory element
US7204425B2 (en) * 2002-03-18 2007-04-17 Precision Dynamics Corporation Enhanced identification appliance
JP3940014B2 (ja) * 2002-03-29 2007-07-04 富士通株式会社 半導体集積回路、無線タグ、および非接触型icカード
KR100437458B1 (ko) * 2002-05-07 2004-06-23 삼성전자주식회사 상변화 기억 셀들 및 그 제조방법들
JP4539007B2 (ja) * 2002-05-09 2010-09-08 日本電気株式会社 半導体記憶装置
US6813182B2 (en) * 2002-05-31 2004-11-02 Hewlett-Packard Development Company, L.P. Diode-and-fuse memory elements for a write-once memory comprising an anisotropic semiconductor sheet
US6828685B2 (en) * 2002-06-14 2004-12-07 Hewlett-Packard Development Company, L.P. Memory device having a semiconducting polymer film
JP2004047791A (ja) * 2002-07-12 2004-02-12 Pioneer Electronic Corp 有機薄膜スイッチングメモリ素子及びメモリ装置
JP2004128471A (ja) * 2002-08-07 2004-04-22 Canon Inc 不揮発メモリ装置
US6784017B2 (en) * 2002-08-12 2004-08-31 Precision Dynamics Corporation Method of creating a high performance organic semiconductor device
US7051945B2 (en) * 2002-09-30 2006-05-30 Nanosys, Inc Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites
US6847047B2 (en) * 2002-11-04 2005-01-25 Advanced Micro Devices, Inc. Methods that facilitate control of memory arrays utilizing zener diode-like devices
US6870183B2 (en) * 2002-11-04 2005-03-22 Advanced Micro Devices, Inc. Stacked organic memory devices and methods of operating and fabricating
US7358848B2 (en) * 2002-11-19 2008-04-15 Farrokh Mohamadi Wireless remote sensor
US6963307B2 (en) * 2002-11-19 2005-11-08 Farrokh Mohamadi Inductively-coupled antenna array
US6944052B2 (en) * 2002-11-26 2005-09-13 Freescale Semiconductor, Inc. Magnetoresistive random access memory (MRAM) cell having a diode with asymmetrical characteristics
US7220985B2 (en) 2002-12-09 2007-05-22 Spansion, Llc Self aligned memory element and wordline
JP4089544B2 (ja) * 2002-12-11 2008-05-28 ソニー株式会社 表示装置及び表示装置の製造方法
JP4393859B2 (ja) * 2002-12-27 2010-01-06 株式会社半導体エネルギー研究所 記録媒体の作製方法
EP1437683B1 (en) 2002-12-27 2017-03-08 Semiconductor Energy Laboratory Co., Ltd. IC card and booking account system using the IC card
US6873219B2 (en) * 2003-01-28 2005-03-29 Hewlett-Packard Development Company, L.P. Printed circuit board noise attenuation using lossy conductors
US7973313B2 (en) * 2003-02-24 2011-07-05 Semiconductor Energy Laboratory Co., Ltd. Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container
JP4496712B2 (ja) 2003-03-31 2010-07-07 セイコーエプソン株式会社 燃料電池
US6977389B2 (en) * 2003-06-02 2005-12-20 Advanced Micro Devices, Inc. Planar polymer memory device
TWI227031B (en) * 2003-06-20 2005-01-21 Au Optronics Corp A capacitor structure
US6803267B1 (en) * 2003-07-07 2004-10-12 Advanced Micro Devices, Inc. Silicon containing material for patterning polymeric memory element
US7050326B2 (en) * 2003-10-07 2006-05-23 Hewlett-Packard Development Company, L.P. Magnetic memory device with current carrying reference layer
DE10355561A1 (de) * 2003-11-28 2005-06-30 Infineon Technologies Ag Halbleiteranordnung mit nichtflüchtigen Speichern
JP2005183619A (ja) * 2003-12-18 2005-07-07 Canon Inc 不揮発メモリ装置
WO2005096380A1 (en) 2004-04-02 2005-10-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method of the same
KR101219749B1 (ko) 2004-10-22 2013-01-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
CN101044624A (zh) 2004-10-22 2007-09-26 株式会社半导体能源研究所 半导体器件
US7688624B2 (en) * 2004-11-26 2010-03-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8188461B2 (en) * 2005-05-31 2012-05-29 Semiconductor Energy Laboratory Co., Ltd. Organic memory device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100191975B1 (ko) 1994-09-09 1999-06-15 포만 제프리 엘 얇은 가요성 전자 무선 주파수 태그 장치
WO2002037500A1 (en) 2000-10-31 2002-05-10 The Regents Of The University Of California Organic bistable device and organic memory cells
JP2003002647A (ja) 2000-12-27 2003-01-08 Mitsubishi Materials Corp Plzt強誘電体薄膜、その形成用組成物及び形成方法

Also Published As

Publication number Publication date
TWI472071B (zh) 2015-02-01
US20110227137A1 (en) 2011-09-22
US8223531B2 (en) 2012-07-17
KR20110127286A (ko) 2011-11-24
US8089799B2 (en) 2012-01-03
WO2006043573A1 (en) 2006-04-27
JP2006148080A (ja) 2006-06-08
TWI446606B (zh) 2014-07-21
CN101676931B (zh) 2012-06-27
CN100557813C (zh) 2009-11-04
KR101164437B1 (ko) 2012-07-13
EP2348460A1 (en) 2011-07-27
KR20140015128A (ko) 2014-02-06
CN101044623A (zh) 2007-09-26
EP1812893A1 (en) 2007-08-01
TW200633281A (en) 2006-09-16
US20090121874A1 (en) 2009-05-14
EP2348460B1 (en) 2014-04-23
EP1812893A4 (en) 2008-12-10
TW200908406A (en) 2009-02-16
US20070153565A1 (en) 2007-07-05
CN101676931A (zh) 2010-03-24
US7499305B2 (en) 2009-03-03
KR20070084394A (ko) 2007-08-24
JP5019737B2 (ja) 2012-09-05

Similar Documents

Publication Publication Date Title
KR101201698B1 (ko) 반도체 장치
CN100576557C (zh) 半导体器件及其制造方法
KR101258672B1 (ko) 반도체장치
JP5452959B2 (ja) 半導体記憶装置、及び半導体装置
CN100565900C (zh) 半导体器件
JP5164745B2 (ja) 記憶装置
JP4954537B2 (ja) 半導体装置
JP4767653B2 (ja) 半導体装置及び無線チップ
JP4912671B2 (ja) 半導体装置

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A16-div-PA0104

St.27 status event code: A-0-1-A10-A18-div-PA0104

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

A107 Divisional application of patent
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A16-div-PA0104

St.27 status event code: A-0-1-A10-A18-div-PA0104

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

Fee payment year number: 1

St.27 status event code: A-2-2-U10-U12-oth-PR1002

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20151016

Year of fee payment: 4

PR1001 Payment of annual fee

Fee payment year number: 4

St.27 status event code: A-4-4-U10-U11-oth-PR1001

FPAY Annual fee payment

Payment date: 20161017

Year of fee payment: 5

PR1001 Payment of annual fee

Fee payment year number: 5

St.27 status event code: A-4-4-U10-U11-oth-PR1001

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

Not in force date: 20171110

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

St.27 status event code: A-4-4-U10-U13-oth-PC1903

PC1903 Unpaid annual fee

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20171110

St.27 status event code: N-4-6-H10-H13-oth-PC1903

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000