KR101184959B1 - 잉곳 블록의 복합 모따기 가공 장치 및 가공 방법 - Google Patents

잉곳 블록의 복합 모따기 가공 장치 및 가공 방법 Download PDF

Info

Publication number
KR101184959B1
KR101184959B1 KR1020100098194A KR20100098194A KR101184959B1 KR 101184959 B1 KR101184959 B1 KR 101184959B1 KR 1020100098194 A KR1020100098194 A KR 1020100098194A KR 20100098194 A KR20100098194 A KR 20100098194A KR 101184959 B1 KR101184959 B1 KR 101184959B1
Authority
KR
South Korea
Prior art keywords
grinding
grindstone
pair
wheel
ingot block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100098194A
Other languages
English (en)
Korean (ko)
Other versions
KR20110134811A (ko
Inventor
유타카 요시다
가즈오 고바야시
츠요시 요시다
유키오 우에하라
요시히로 데라쿠보
히로츠구 사이토우
Original Assignee
가부시키가이샤 오카모도 코사쿠 기카이 세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 오카모도 코사쿠 기카이 세이사쿠쇼 filed Critical 가부시키가이샤 오카모도 코사쿠 기카이 세이사쿠쇼
Publication of KR20110134811A publication Critical patent/KR20110134811A/ko
Application granted granted Critical
Publication of KR101184959B1 publication Critical patent/KR101184959B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/02—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a reciprocatingly-moved work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020100098194A 2010-06-09 2010-10-08 잉곳 블록의 복합 모따기 가공 장치 및 가공 방법 Expired - Fee Related KR101184959B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010131606A JP5406126B2 (ja) 2010-06-09 2010-06-09 インゴットブロックの複合面取り加工装置および加工方法
JPJP-P-2010-131606 2010-06-09

Publications (2)

Publication Number Publication Date
KR20110134811A KR20110134811A (ko) 2011-12-15
KR101184959B1 true KR101184959B1 (ko) 2012-10-02

Family

ID=45096603

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100098194A Expired - Fee Related KR101184959B1 (ko) 2010-06-09 2010-10-08 잉곳 블록의 복합 모따기 가공 장치 및 가공 방법

Country Status (3)

Country Link
US (1) US8460058B2 (enExample)
JP (1) JP5406126B2 (enExample)
KR (1) KR101184959B1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5129320B2 (ja) * 2010-12-15 2013-01-30 株式会社岡本工作機械製作所 円筒状単結晶シリコンインゴットブロックを四角柱状ブロックに加工する切断装置および切断方法
JP5108123B2 (ja) * 2011-01-27 2012-12-26 株式会社岡本工作機械製作所 円筒状インゴットブロックの切断装置およびそれを用いて四角柱状ブロックに加工する方法
EP2844428B1 (en) 2012-05-02 2016-11-09 MEMC Singapore Pte. Ltd. Systems and methods for single crystal
US11471998B2 (en) 2013-02-01 2022-10-18 Global Polishing Systems, Llc Tools for polishing and refinishing concrete and methods for using the same
ES2659374T3 (es) 2013-02-01 2018-03-15 Global Polishing Systems LLC Soluciones de tratamiento de corte, pulido y coloración de hormigón
CN104175198B (zh) * 2013-05-23 2017-02-08 董昊南 轻质隔热砖自动切磨装置
CN103639864B (zh) * 2013-12-18 2015-12-30 天津市鹏发自动化科技有限公司 散热器焊缝抛光机
CN103737443B (zh) * 2014-01-21 2016-08-24 宁波市鄞州大兴非标设备制造厂 自动倒角机
CN104369061B (zh) * 2014-09-19 2016-11-02 张家港市和恒精工机械有限公司 一种去毛刺机刷轮机构
CN104330294B (zh) * 2014-10-28 2016-10-19 山东科技大学 一种金相试样制备仪
CN105127859B (zh) * 2015-08-24 2017-03-22 苏州隆士丹自动化技术有限公司 一种刹车片毛刺打磨机
CN105081913B (zh) * 2015-08-25 2018-05-11 泉州市佳能机械制造有限公司 一种磨抛装置及磨抛机
CN106002519A (zh) * 2016-07-05 2016-10-12 常州飞宇电力设备有限公司 自动限位倒角机
CN106881765A (zh) * 2017-03-27 2017-06-23 江苏中天消防设备有限公司 一种防火板的切割磨边装置
CN110153891B (zh) * 2019-04-03 2021-05-25 放骋智能科技(上海)有限公司 一种不锈钢方钢条自动打磨设备
CN110370094B (zh) * 2019-07-29 2020-11-10 丹阳丹耀光学有限公司 一种磨砂棱镜的加工工艺及设备
CN110653704B (zh) * 2019-09-12 2024-11-15 青岛高测科技股份有限公司 一种高效磨倒一体机
CN214186720U (zh) * 2020-08-28 2021-09-14 天通日进精密技术有限公司 硅棒研磨机
CN112247731A (zh) * 2020-10-21 2021-01-22 桃江县鑫龙阳光木业胶板厂(普通合伙) 一种用于细木板加工的磨边机
JP6947455B1 (ja) * 2020-12-08 2021-10-13 宮▲崎▼機械システム株式会社 面取機
CN112571201B (zh) * 2020-12-28 2023-05-02 深圳市中意智能家居有限公司 一种木板边缘打磨设备
CN113211226B (zh) * 2021-05-29 2023-09-01 芜湖艾蔓设备工程有限公司 一种汽车管道内外壁的抛光装置
CN114147560B (zh) * 2021-12-13 2022-11-29 深圳明嘉瑞科技有限公司 一种芯片的核心材料硅片加工及打磨装置
CN114851002B (zh) * 2022-04-13 2023-04-28 深圳市华盛源机电有限公司 一种高效去毛刺倒角一体机
CN115070577B (zh) * 2022-05-27 2024-03-26 威海广宇大成数控机床有限公司 双磨头自动更换磨削装置
CN119566992B (zh) * 2024-09-27 2025-11-14 宁波可可磁业股份有限公司 一种管形钕铁硼磁件自动化加工设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008005547A (ja) 2007-09-04 2008-01-10 Ricoh Co Ltd ヒステリシスコンパレータ

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US543458A (en) * 1895-07-30 Machine for sharpening insertible saw-teeth
US1024435A (en) * 1911-09-21 1912-04-23 Joseph Bissell Grinding pen-nibs.
US1644057A (en) * 1921-10-08 1927-10-04 Cincinnati Grinders Inc Grinding machine
US1902022A (en) * 1929-04-11 1933-03-21 Gillette Safety Razor Co Metal sharpening machine
US2106442A (en) * 1935-04-24 1938-01-25 Firestone Tire & Rubber Co Buffing method and apparatus
US3079740A (en) * 1959-11-24 1963-03-05 Besly Welles Corp Method of positioning grinding disks
JPS5145480B2 (enExample) 1972-05-19 1976-12-03
DE3041663A1 (de) * 1980-11-05 1982-06-09 Buderus Ag, 6330 Wetzlar Verfahren und maschine zum innen- und aussenrundschleifen von werkstuecken
JPS59191246U (ja) * 1983-06-02 1984-12-19 三興機械株式会社 研削機
US4524547A (en) * 1983-09-06 1985-06-25 Litton Industrial Products, Inc. Automatic double disc grinder control cycle
US4586296A (en) * 1984-07-03 1986-05-06 Charlton Associates Method of finishing the surface of a disc
JPH04133935A (ja) 1990-09-27 1992-05-07 Bando Chem Ind Ltd ベルト駆動装置
JP2554408B2 (ja) 1991-04-19 1996-11-13 信越半導体株式会社 自動円筒研削方法及び装置
JP2903916B2 (ja) 1992-11-30 1999-06-14 信越半導体株式会社 半導体インゴット加工方法
JP2861715B2 (ja) 1993-02-18 1999-02-24 信越半導体株式会社 インゴット円筒研削機における空回転防止装置
JPH0873297A (ja) 1994-09-05 1996-03-19 Shin Etsu Chem Co Ltd 太陽電池用基板材料の製法とこれを用いた太陽電池
SE9500116L (sv) * 1995-01-16 1996-07-17 Danieli Centro Maskin Spa Förfarande vid slipning av företrädesvis ämnen och anordning för utövning av förfarandet
CA2169997A1 (en) * 1995-03-17 1996-09-18 Gregory Zang Multi-directional abrading machine
DE19513383C2 (de) * 1995-04-08 1997-11-20 Supfina Grieshaber Gmbh & Co Vorrichtung zum beidseitigen Feinstbearbeiten oder Superfinishen von scheibenförmigen Werkstücken
US5934983A (en) * 1996-04-08 1999-08-10 Kabushiki Kaisha Kobe Seiko Sho Double-side grinding method and double-side grinder
KR100516908B1 (ko) 1997-04-11 2005-09-23 지멘스 에너지 앤드 오토메이션 인코포레이티드 변압기 또는 이와 유사한 전기장치를 위한 자기 조립체
TW358764B (en) * 1997-07-07 1999-05-21 Super Silicon Crystal Res Inst A method of double-side lapping a wafer and an apparatus therefor
JP2000117544A (ja) * 1998-10-14 2000-04-25 Nisshin Unyu Kogyo Kk 長尺金属物外周面の鏡面加工方法
JP2000126929A (ja) * 1998-10-23 2000-05-09 Univ Saga 歯車高品質化処理システムおよび該システムに用い得るバレル処理装置
JP3648239B2 (ja) * 2000-09-28 2005-05-18 シャープ株式会社 シリコンウエハの製造方法
JP3405411B2 (ja) * 2001-02-22 2003-05-12 株式会社石井表記 角形基板の製造方法
JP2002356341A (ja) * 2001-06-01 2002-12-13 Shin Etsu Chem Co Ltd 光ファイバ母材インゴットの製造方法
US6682397B2 (en) * 2002-06-11 2004-01-27 Leslie Nien Machining device for processing metal hanging rod of blinds
KR100954534B1 (ko) * 2002-10-09 2010-04-23 고요 기카이 고교 가부시키가이샤 얇은 원판형상 공작물의 양면 연삭방법 및 양면 연삭장치
JP2004243418A (ja) * 2002-11-29 2004-09-02 Shuji Horichi 研削機
US7154933B2 (en) 2003-09-25 2006-12-26 Avneesh Agrawal Interference management for soft handoff and broadcast services in a wireless frequency hopping communication system
JP4133935B2 (ja) 2004-06-07 2008-08-13 シャープ株式会社 シリコンウエハの加工方法
DE102004053503B4 (de) * 2004-10-27 2015-06-18 Nagel Maschinen- Und Werkzeugfabrik Gmbh Honanlage mit mehreren Arbeitsstationen
US7591712B2 (en) 2005-05-11 2009-09-22 Mitsubishi Electric Corporation Method of producing silicon blocks and silicon wafers
DE102006007055B4 (de) * 2006-02-15 2008-07-17 Bsh Holice A.S. Verfahren zum Schleifen von stabförmigen Werkstücken, Schleifmaschine zur Durchführung des Verfahrens und Schleifzelle in Zwillingsanordnung
JP4916400B2 (ja) 2007-08-27 2012-04-11 日本電信電話株式会社 データ間引き処理方法およびデータ間引き処理回路
US7909678B2 (en) 2007-08-27 2011-03-22 Schott Ag Method for manufacturing silicone wafers
JP5150196B2 (ja) 2007-10-16 2013-02-20 シャープ株式会社 シリコンウエハの製造方法
JP5238317B2 (ja) * 2008-03-27 2013-07-17 株式会社ジェイシーエム シリコンブロックの研削研磨機及びシリコンウエハの加工方法
JP2010061844A (ja) 2008-09-01 2010-03-18 Seiko Epson Corp 光源装置およびプロジェクタ
JP2011173179A (ja) * 2010-02-23 2011-09-08 Okamoto Machine Tool Works Ltd シリコンインゴットの円筒研削方法または円弧研削方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008005547A (ja) 2007-09-04 2008-01-10 Ricoh Co Ltd ヒステリシスコンパレータ

Also Published As

Publication number Publication date
US20110306277A1 (en) 2011-12-15
JP2011255454A (ja) 2011-12-22
KR20110134811A (ko) 2011-12-15
US8460058B2 (en) 2013-06-11
JP5406126B2 (ja) 2014-02-05

Similar Documents

Publication Publication Date Title
KR101184959B1 (ko) 잉곳 블록의 복합 모따기 가공 장치 및 가공 방법
CN114131480B (zh) 硅棒研磨机
KR101731643B1 (ko) 잉곳 블록의 복합 모따기 가공 장치
JP5129319B2 (ja) 円筒状単結晶シリコンインゴットブロックを四角柱状ブロックに加工する方法およびそれに用いる複合面取り加工装置
JP2011136382A (ja) シリコンインゴットの面取り加工装置
JP2011255454A5 (enExample)
JP5238317B2 (ja) シリコンブロックの研削研磨機及びシリコンウエハの加工方法
JP2010263025A (ja) シリコンインゴットの面取り加工装置およびそれを用いる角柱状シリコンインゴットの面取り加工方法
JP2010262955A (ja) シリコンインゴットの面取り加工装置およびそれを用いる角柱状シリコンインゴットの面取り加工方法
JP2010214550A (ja) シリコンインゴットの面取り加工装置およびそれを用いる角柱状シリコンインゴットの面取り加工方法
JP5856245B2 (ja) インゴットブロックの複合面取り加工装置および面取り加工方法
CN211490756U (zh) 硅棒研磨机
CN112706046B (zh) 硅棒研磨机及硅棒研磨方法
CN103282173A (zh) 柱状部件的加工装置
JP2013010158A (ja) インゴットブロックの自動クランプ方法
JP5421132B2 (ja) シリコンインゴットの円筒研削装置および円筒研削方法
JP2010214552A (ja) 角柱状シリコンインゴットの面取り加工装置およびそれを用いる角柱状シリコンインゴットの面取り加工方法
JP2010207949A (ja) 角柱状シリコンインゴットの面取り加工装置およびそれを用いる角柱状シリコンインゴットの面取り加工方法
CN112706012B (zh) 硅棒研磨机及硅棒研磨方法
JP2011173179A (ja) シリコンインゴットの円筒研削方法または円弧研削方法
JP2012066310A (ja) インゴットブロックの複合面取り加工装置および加工方法
JP2013038111A (ja) 円柱状インゴットの複合面取り加工装置ならびにそれを用いてワークに円筒研削加工およびオリフラ研削加工をする方法
JP2013035079A (ja) 四角柱状インゴットの四隅ｒ面の円筒研削方法
CN211890289U (zh) 硅棒研磨机
CN214080919U (zh) 研磨修复装置及硅棒加工设备

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20180918

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20180918

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000