KR101138703B1 - Part providing apparatus of bonding equipment and part providing method using the same - Google Patents

Abstract

A material input device for a bonding facility and a material input method using the same are disclosed. The disclosed material input device includes a loader for supplying a substrate, an unloader for recovering substrates spaced a predetermined distance from the loader, and a substrate disposed between the loader and the unloader and loaded in the magazine of the loader in order. An indexer for transferring to the indexer, and a plurality of sensors disposed in the indexer for detecting the transfer of the substrates or the transfer failure of the substrates. Therefore, according to the material input device and the material input method using the disclosed bonding equipment, it is possible to detect all the troubles occurring during the transfer of the substrate and to automatically solve it, so that the down time of the device is very short, so the overall productivity is greatly increased. Is increased.

Description

Part providing apparatus of bonding equipment and part providing method using the same}

1 is a perspective view showing an embodiment of a material input device of the bonding facility according to the present invention.

2 is a block diagram showing the control relationship of the material input device according to the present invention.

3A and 3B are flowcharts showing one embodiment of a material input method according to the present invention.

<Description of the symbols for the main parts of the drawings>

100: bonding equipment

110: loader

114: magazine moving unit

130: indexer

133: guide rail

150: Unloader

The present invention relates to an apparatus and a method used in a semiconductor assembly process, and more particularly, to a material input device of a bonding facility for injecting a material such as a substrate so that a component such as a semiconductor chip is bonded, and a material input method using the same.

In general, a semiconductor assembly process separates an individual semiconductor chip (also called a die) from a manufactured silicon wafer through a wafer process, and then die-bonds the adhesive to a lead frame. Die bonding) process.

The lead frame to which the semiconductor chip is bonded is electrically connected to the semiconductor chip through a wire bonding process or by directly attaching a lead (inner lead) of the lead frame to a metal pad (electrode) of the semiconductor chip.

Next, when the semiconductor chip is electrically connected to the lead frame, a molding process is performed to protect the semiconductor chip from external moisture, dust, or impact. After the molding process, the lead is cut and mounted on an external PCB. The semiconductor assembly process is completed by performing a process of bending a lead (external lead) to have a shape suitable for the following.

Meanwhile, in such a semiconductor assembly process, the lead frame is transferred in a strip form, and since a plurality of identical lead patterns are repeated on one strip, the bonding facility can die-bond or wire-bond several semiconductor chips at the same time. do.

Here, a device for transferring a lead frame strip (hereinafter, referred to as a substrate) to a bonding stage of a bonding facility (referring to a portion where bonding is directly performed) so that die bonding or wire bonding proceeds is a material input device. In this case, the material input device normally supplies the substrate to the bonding facility through a magazine in which a plurality of substrates are stacked up and down.

Therefore, in the bonding equipment for performing die bonding or wire bonding, the above-described material input device sequentially transfers the substrate to the bonding stage, thereby performing die bonding or wire bonding on the transferred substrate.

However, in the conventional case, the substrate is often not smoothly transferred due to the deformation of the substrate on which the lead pattern is formed or the length or width tolerance of the magazine in which the substrate is loaded. Accordingly, the conventional material input device stops driving the device while generating an error, and the operator removes the cause of the error every time and restarts the device.

However, in the case of the conventional material input device, even if an error occurs due to a very small factor, the device is stopped immediately without any first action, and as a whole, the stop time of the device is very long, and the overall productivity is greatly reduced. Problem occurs.

Therefore, the present invention has been made in view of the above problems, the technical problem to be achieved by the present invention is to provide a material input device of the bonding equipment and material input method using the same that can minimize the down time of the device.

According to a first aspect of the present invention for realizing such a technical problem, a loader for supplying a substrate, an unloader for recovering the substrates at a predetermined interval from the loader, and between the loader and the unloader An indexer disposed in the magazine of the loader loaded in the magazine of the loader sequentially into the magazine of the unloader, and a plurality of sensors disposed in the indexer to detect the transfer of the substrates or the transfer failure of the substrates. There is provided a material input device for a bonding facility comprising a). The loader includes a first magazine holder (Holder) on which a magazine loaded with a plurality of substrates is mounted, and a first magazine moving unit for moving the first magazine holder in the vertical direction and the front and rear directions according to the process progress. The unloader includes a second magazine holder in which a separate magazine is mounted to load the substrates, and a second magazine moving unit that moves the second magazine holder in the vertical direction and the front and rear directions as the process progresses. The indexer includes a material transfer unit for transferring the substrates, a guide rail for guiding the transfer of the substrates, and a rail interval adjusting unit for adjusting the distance between the guide rails.

In addition, the material input device may further include a controller for selectively driving the first magazine moving unit, the second magazine moving unit, and the rail interval adjusting unit according to the detection of the sensors. In this case, the sensors include an input sensor for detecting whether the substrate is drawn out to the indexer when the material transfer unit pulls out the substrate from the magazine of the loader, and the substrate drawn out by the material transfer unit is used. A load position sensor that detects whether the indexer is pulled out at the correct position of the indexer, and whether the substrate located at the indexer is discharged into the magazine of the unloader when the material transfer unit ejects the substrate located at the indexer. It may include an output sensor for detecting whether or not, and a jam detect sensor for detecting whether the substrate discharged by the material transfer unit is caught during the discharge.

On the other hand, according to a second aspect of the present invention for achieving the above object, the step of mounting a magazine loaded with a plurality of substrates in the loader; Withdrawing the substrate from the magazine of the loader to the indexer; Checking a drawing trouble of the substrate in an input sensor provided in the indexer; If an error occurs in the drawout troubleshooting step, the board is pushed into the magazine of the loader, the first error factor is checked, and the board is again taken out. If the error does not occur in the drawout troubleshooting step, the board is removed. Transferring to a load position sensor provided in the indexer; Checking the transport trouble of the substrate at the load position sensor; If an error occurs in the transport trouble check step, the board is pushed into the magazine of the loader, a second error factor is checked, and the board is withdrawn again. If the error does not occur in the transport trouble check step, the board is removed. Transferring to a bonding stage of the indexer to perform bonding; Discharging the substrate of the bonding stage into the magazine of the unloader after performing the bonding; Checking a discharge trouble of the substrate at a jam detect sensor and an output sensor provided in the indexer; When an error occurs in the discharge trouble check step, the material input method using the material input device of the bonding facility comprising the step of transferring the substrate back to the bonding stage, checking the third error factor and then ejecting the substrate again Is provided.

In this case, the method for checking the first error factor includes a method of moving the magazine of the loader up and down, a method of moving the magazine of the loader back and forth, and a method of widening the interval between the guide rails. Checking the error factor includes performing the above methods sequentially one by one.

In addition, the method of checking the second error factor includes a method of widening the interval of the guide rail.

In addition, the method for checking the third error factor includes a method of moving the magazine of the unloader up and down, a method of moving the magazine of the unloader back and forth, and a method of widening the interval of the guide rail. Checking the third error factor includes performing the above methods sequentially one by one.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments disclosed herein are being provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Like numbers refer to like elements throughout.

1 is a perspective view showing an embodiment of a material input device of the bonding equipment according to the present invention, Figure 2 is a block diagram showing a control relationship of the material input device according to the present invention.

1 and 2, the material input device 100 of the bonding facility according to an embodiment of the present invention is a loader 110, an unloader 150 spaced a predetermined distance from the loader 110, and the loader An indexer 130 disposed between the 110 and the unloader 150 and provided with a bonding stage in which bonding is directly performed, a plurality of sensors installed in each part of the indexer 130, and a material input device 100 are provided. It includes a controller 170 for controlling overall.

More specifically, the loader 110 is a portion for supplying the substrate 95 to the bonding stage, which is provided at one side of the indexer 130, and has a magazine 90 loaded with a plurality of substrates 95 to be bonded. It comprises a first magazine holder 112 and a first magazine moving unit 114 for moving the first magazine holder 112 in the vertical direction and the front and rear directions as the process proceeds.

The unloader 150 is a part for recovering the substrate 95 via the bonding stage, and is provided on the other side of the indexer 130 facing the loader 110, and has a separate magazine so that the bonded substrates 95 are loaded. A second magazine holder 153 on which the 90 is mounted is provided, and a second magazine moving unit 155 for moving the second magazine holder 153 in the vertical direction and the front and rear directions as the process proceeds.

The indexer 130 is provided between the loader 110 and the unloader 150 and sequentially stacks the substrates 95 loaded on the magazine 90 of the loader 110. The substrates 95 are transferred to the inside, and the substrates 95 serve to pass through the bonding stage, and the material transfers the substrates 95 loaded on the loader 110 to the unloader 150 as the process progresses. It includes a unit, a guide rail 133 for guiding the substrates 95 transported in this way, and a rail spacing adjusting unit 134 for adjusting a distance between the guide rail 133. In this case, the bonding stage may be provided at the center of the indexer 130. In addition, the material transfer unit is a first material transfer unit installed on one side of the bonding stage, that is, the loader 110 of the guide rails 133 of the indexer 130 to serve as a puller and a gripper. And a second material transfer unit 136 installed on the other side of the bonding stage, that is, on the unloader 150 side of the guide rail 133 of the indexer 130 to serve as a gripper. .

On the other hand, the sensors are installed on each portion of the indexer 130 serves to detect the substrates 95 transferred along the guide rail 133. Specifically, the sensors are installed at the end of the indexer 130 close to the loader 110 so that the material transfer unit withdraws the substrate 95 from the magazine 90 of the loader 110, the substrate 95 of the loader 110 ) Is input sensor 131 for detecting whether the indexer 130 is drawn out, and the substrate is installed in the portion spaced apart from the input sensor 131 to the inside of the indexer 130 by a material transfer unit A load position sensor 132 for detecting whether or not the 95 is drawn out at the correct position of the indexer 130 and an end of the indexer 130 close to the unloader 150 are installed in the material transfer unit. Output sensor 137 and output sensor for detecting whether the substrate 95 located in the indexer 130 is discharged into the magazine 90 of the unloader 150 when discharging the substrate 95 located in the 137 is installed at a portion spaced apart from the inside of the indexer 130 by a predetermined distance to the material transfer unit. It consists of a jam detect sensor 138 that detects whether the substrate 95 discharged by it is caught during discharge. Accordingly, the substrates 95 transported along the guide rail 133 are all sensed by these sensors.

On the other hand, the controller 170 serves to drive the respective units provided in the loader 110, the unloader 130 and the indexer 130 as a whole. In particular, when an error in substrate transfer is detected according to the detection of the above-described sensors, the controller 170 adjusts the first magazine moving unit 114 and the second magazine moving unit 153 and the rail spacing so that such an error is eliminated. It selectively serves to drive the unit 134 or the like. Thus, the material input device is driven more smoothly.

3A and 3B, a material input method using the material input device 100 of the bonding facility according to the present invention will be described in detail as follows.

3A and 3B are flowcharts showing one embodiment of a material input method according to the present invention.

First, when the plurality of substrates 95 to be bonded are loaded in the magazine 90, the user mounts the magazine 90 on which the plurality of substrates 95 are loaded in the loader 110 and the material input device 100. It is driven (S10).

Thereafter, the first material transfer unit 135 serving as a puller and a gripper among the material transfer units draws the substrate 95 from the magazine 90 of the loader 110 to the indexer 130 (S20). In this case, the input sensor 131 provided in the indexer 130 may determine whether the substrate 95 is drawn out to the indexer 130 when the substrate 95 of the first material transfer unit 135 is pulled out. The outgoing trouble is checked and the check value is transmitted to the controller 170 (S30).

Therefore, when an error occurs in the outflow trouble check step (S30), the controller 170 pushes the substrate 95 into the magazine 90 of the loader 110 using the first material transfer unit 135 ( S330) After checking the first error factor (S340), the substrate 95 is again taken out (S20). At this time, the method for checking the first error factor is a method of moving the magazine 90 of the loader 110 up and down, a method of moving the magazine 90 of the loader 110 back and forth, and the guide rail 133 Includes ways to widen the gap. Therefore, the controller 170 checks the first error factor by sequentially performing one of these methods whenever an error occurs. However, even when all of these methods are performed, when an error occurs, that is, at the fourth error (S310), the device 100 is stopped while generating a separate alarm because the error is not solved even in this way. (S320). Accordingly, the user recognizes the occurrence of an error through this alarm and eliminates the cause of the error.

On the other hand, if an error does not occur in the take-out trouble check step (S30), the controller 170 is a load position sensor 132 provided in the indexer 130 to the substrate 95 using the first material transfer unit (135). It will be transferred to (S40).

In addition, the load position sensor 132 checks whether the substrate 95 transferred by the first material transfer unit 135 is drawn out at the correct position of the indexer 130, that is, the transfer trouble of the substrate 95. (S50).

Therefore, when an error occurs in the transport trouble check step (S50), the controller 170 pushes the substrate 95 into the magazine 90 of the loader 110 by using the first material transfer unit 135. After checking the second error factor (S540), the substrate 95 is again taken out (S20). At this time, the method of checking the second error factor includes a method of widening the interval of the guide rail 133. Thus, when the transfer trouble of the substrate 95 is generated, the controller 170 checks the second error factor by widening the interval of the guide rail 133 as described above. However, even when this method is performed, when an error occurs, that is, the second error (S510), the error is not solved even by such a method, so that the device 100 is stopped while generating a separate alarm ( S520). Accordingly, the user recognizes the occurrence of an error through this alarm and eliminates the cause of the error.

On the other hand, if no error occurs in the transport trouble check step (S50), the controller 170 uses the first material transfer unit 135 to bond the substrate 95 to the bonding stage of the indexer 130 to perform the bonding. It is transferred (S60). Therefore, the bonding apparatus of the bonding facility performs the bonding process of die bonding, wire bonding, etc. on the board | substrate 95 as mentioned above.

Then, when bonding is performed, the controller 170 discharges the substrate 95 of the bonding stage into the magazine 90 of the unloader 150 using the second material transfer unit 136 (S70).

In addition, the jam detect sensor 138 and the output sensor 137 provided in the indexer 130 may check whether the substrate 95 located in the indexer 130 is well discharged into the magazine 90 of the unloader 150. And whether the substrate 95 discharged by the second material transfer unit 136 is caught during the discharge, that is, the discharge trouble of the substrate 95 is checked (S80).

Therefore, when an error occurs in the discharge trouble checking step S80, the controller 170 transfers the substrate 95 back to the bonding stage by using the second material transfer unit 136 (S830) and causes a third error. After checking (S840) again to discharge the substrate 95 (S70). At this time, the method for checking the third error factor is a method of moving the magazine 90 of the unloader 150 up and down, a method of moving the magazine 90 of the unloader 150 back and forth, and a guide rail 133. It includes a method to widen the space between). Accordingly, the controller 170 checks the third error factor by sequentially performing one of these methods whenever an error occurs. However, even when all of these methods are performed, when an error occurs, that is, the fourth error (S810), the error is not solved even in this way, so that the device 100 is stopped while generating a separate alarm. (S820). Accordingly, the user recognizes the occurrence of an error through this alarm and eliminates the cause of the error.

On the other hand, if an error does not occur in the discharge trouble check step (S80), the substrate 95 is well transferred into the magazine 90 of the unloader 150, the controller 170 terminates the process Done.

As mentioned above, although the present invention has been described with reference to the illustrated embodiments, it is only an example, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the scope of the present invention should be defined by the appended claims and their equivalents.

As described above, according to the material input device of the bonding equipment and the material input method using the same according to the present invention, since most of the troubles generated during the transfer of the substrate is automatically solved, the downtime of the device is very short, the overall productivity is improved. The effect is greatly increased.

Claims (7)

A loader having a first magazine holder in which a magazine loaded with a plurality of substrates is mounted to supply the substrates, and a second magazine in which a separate magazine is mounted to recover the substrates and to load the substrates at a predetermined distance from the loader; An unloader having a holder, a material transfer unit which is disposed between the loader and the unloader and sequentially transfers the substrates loaded in the magazine of the loader into the magazine of the unloader and a guide for guiding the transfer of the substrates. In the material input device of the bonding equipment including an indexer having a rail spacing adjusting unit for adjusting the distance between the rail and the guide rail, The loader has a first magazine moving unit for moving the first magazine holder in the vertical direction and the front and rear directions as the process proceeds; The unloader includes a second magazine moving unit which moves the second magazine holder in the vertical direction and the front and rear directions as the process progresses. The indexer material input device of the bonding equipment including a plurality of sensors for detecting the transfer of the substrates or the transfer failure of the substrates. The method of claim 1, And a controller for selectively driving the first magazine moving unit, the second magazine moving unit, and the rail interval adjusting unit according to the detection of the sensors. The method according to claim 1 or 2, The sensors include an input sensor for detecting whether the substrate is withdrawn to the indexer when the material transfer unit withdraws the substrate from the magazine of the loader, and the substrate with which the substrate is drawn by the material transfer unit is accurate. A load position sensor that detects whether it is withdrawn in position, and an output sensor that detects whether the substrate located in the indexer is discharged into the magazine of the unloader when the material transfer unit discharges the substrate located in the indexer And a jam detection sensor for detecting whether the substrate discharged by the material transfer unit is caught during the discharge. Mounting a magazine loaded with a plurality of substrates in a loader; Withdrawing the substrate from the magazine of the loader to the indexer; Checking an output trouble of the substrate in an input sensor provided in the indexer; If an error occurs in the drawout troubleshooting step, the board is pushed into the magazine of the loader, the first error factor is checked, and the board is again taken out. If the error does not occur in the drawout troubleshooting step, the board is removed. Transferring to a load position sensor provided in the indexer; Checking the transport trouble of the substrate at the load position sensor; If an error occurs in the transport trouble check step, the board is pushed into the magazine of the loader, a second error factor is checked, and the board is withdrawn again. If the error does not occur in the transport trouble check step, the board is removed. Transferring to a bonding stage of the indexer to perform bonding; After the bonding, discharging the substrate of the bonding stage into the magazine of the unloader; Checking a discharge trouble of the substrate at a jam detect sensor and an output sensor provided in the indexer; And transferring the substrate back to the bonding stage, checking a third error factor, and then discharging the substrate again when an error occurs in the discharge trouble checking step. The method of claim 4, wherein The method for checking the first error factor includes a method of moving the magazine of the loader up and down, a method of moving the magazine of the loader back and forth, and a method of widening the interval between guide rails provided in the indexer and transferring the substrate. Including; The step of checking the first error factor is a material input method using the material input device of the bonding equipment, characterized in that to perform sequentially one by one method. The method of claim 4, wherein The method for checking the second error factor is a material input method using a material input device of the bonding equipment, characterized in that it comprises a method provided in the indexer to widen the interval of the guide rail for transporting the substrate. The method of claim 4, wherein The method for checking the third error factor includes a method of moving the magazine of the unloader up and down, a method of moving the magazine of the unloader back and forth, and a widening interval between guide rails provided at the indexer and transferring the substrate. Method, The step of checking the third error factor is a material input method using the material input device of the bonding equipment, characterized in that to perform the method sequentially one by one.

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