KR100363577B1 - Apparatus for trimming and forming of semiconducting manufacturing process - Google Patents

Abstract

The present invention is a trimming process for removing a dambar that maintains the shape of a lead frame in a semiconductor manufacturing process, and forming a lead shape according to a form of a package. The present invention relates to a trimming and forming molding apparatus for a semiconductor manufacturing process that performs the work of the process. More specifically, a small semiconductor (CP3, CPH3 / 6) used in cellular phones, LCD drives, etc. It is a device for trimming and forming. It has a structure that pneumatically senses the product into the die holder of the lower mold and detects the departure from work waiting and after molding. By preventing the deformation of the product during pressing and detecting the deviation of the position, the die plate (1) and the back plate (2) to the die holder (3) fixing pins (4) (4) '), And the forming dies 6, 6' and the cutting dies 7, 7 'are installed inside the guide plates 5 and 5' installed at the center of the die plate 1, 6) The pneumatic sensing holes 8 and 8 'are drilled in the center of the 6' and the front end of the forming dies 6 and 6 'and the cutting dies 7 and 7'.後 狹) product introduction guide rail (9) (9 ') is installed, and product discharge guide rail (10) (10') is installed at the rear end, and forming, cutting die (6) (6 ') (7) Pneumatic sensing holes (8) with pneumatic pipes (12) and (12 ') mounted at lower sides thereof with lower buffer supporters (36) (36') and buffer springs (11) (11 '). Stripper plate 21, stripper back plate 22, punch plate 23 to the sliding supporter (S) (S ') installed on one side of the lower mold (L) connecting the (8') and the pneumatic chamber (13) And fixing the punch back plate 24 to the push holder 25 with the fixing pins 26 and the stripper plate 21. ) A stripper 27, a washer 28, a die die 29, and a cutting punch 30 are installed in the punch holder 31 at the center thereof, and a detection pin 32 is installed at one side of the stripper plate 21 so that the sensor The upper buffer supporter is inserted into the upper push holder 25 on which the cutting punch 30, the die die 29, and the stripper 27 are mounted. (37) A trimming and forming molding apparatus for a semiconductor manufacturing process, characterized in that an upper mold (T) provided with a shock absorbing spring (35 ') is mounted.

Description

Apparatus for trimming and forming of semiconducting manufacturing process

The present invention is a trimming process for removing a dambar that maintains the shape of a lead frame in a semiconductor manufacturing process, and forming a lead shape according to a form of a package. The present invention relates to a trimming and forming apparatus of a semiconductor manufacturing process that performs the work of the process, and more specifically, to a small semiconductor (CP3, CPH3 / 6) used in cellular phones and LCD drives. It is a device for trimming and forming. It has a structure that pneumatically senses the product into the die holder of the lower mold and detects the departure from work waiting and after molding. This prevents the shape deformation of the product during pressing and can detect the presence of deviation.

In general, semiconductor manufacturing consists of a process of inspection and packaging through chip bonding, gold wire, molding (resin), cleaning, trimming, and forming process on the lead frame. Wiring is completed from the wafer which has been processed in the FEB process to the dicing chip to complete the electrical operation. Molding and display for convenience , Packaging, etc. Among them, Dicing, Die Bonding, Wire Bonding, Molding, etc. are commonly referred to as Front End. It is divided into plastic package and ceramic package.

In the process of manufacturing a conventional semiconductor, the trimming and forming molding apparatus is a pack generated during molding when the upper and lower molds are pressed to remove the dam bar that maintains the shape of the lead frame and to make the lead shape according to the shape of the package. There is a problem that the error of trimming line is generated due to the size deviation (± 0.02) of the cage, which increases the defective rate of the formed product.In addition, the detection of the product at the position of the product before the trimming and forming molding and the detection of the product after molding There was a problem that the mold of the trimming and forming apparatus due to the continuous automatic operation in the state that the delay of the subsequent work or the product is not completely discharged is broken because it is not made clearly.

Therefore, the present invention was created for the purpose of solving the conventional problems as described above, the upper and lower molds to form a pressing when pressing, eliminating the error occurrence rate of the product trimming and forming process by a separate buffer to the bottom of the cutting die In addition, it detects whether the product is in the right position before being pressed by pneumatic sensing when it enters and discharges the forming and cutting dies, and manufactures the semiconductor to allow the product to be discharged by detecting the departure from the forming cutting die after molding. It is to provide a trimming and forming apparatus of the process.

In order to provide the above-mentioned device, a forming die and a cutting die are installed inside the guide plate installed in the center of the die plate of the lower mold in which the die plate and the back plate are fixed to the die holder with the fixing pins. And the front end of the forming die and the cutting die to install the product guide guide rail of the all-optical rear view and the rear end product discharge guide rail is installed, the lower buffer supporter and the buffer spring buffering the forming, cutting die to the inner bottom To the pneumatic pipe and to the pneumatic pipe at the side end, and to the stripper plate and washer in the center of the upper mold stripper plate which fixed the stripper plate, stripper back plate, punch plate and punch back plate to the push holder. Punch For Die and Cutting Punch The upper buffer supporter and the buffer spring are installed inside the push holder on the upper side where the cutting punch, the for die and the stripper are mounted. By installing the upper mold is mounted on the sliding supporter formed on one side of the lower mold to provide a device that enables the trimming and forming of the semiconductor product.

1 is a partial cutaway front structural view for explaining the overall structure of the present invention

Figure 2 is a partial cutaway side structure diagram for explaining the overall structure of the present invention

Figure 3 is a plan view of the lower mold of the present invention

Figure 4 is a side structural view of the present invention lower mold

Figure 5 is a bottom structure of the upper mold of the present invention

Figure 6 is a side structural view of the upper mold of the present invention

7 is a plan view, side structure of the product molded by the present invention

<Description of the symbols for the main parts of the drawings>

(1) die plate (2) back plate

(3) Die Holders (4) (4 ') Bottom Molding Pins

(5) (5 ') guide plate (6) (6') forming die

(7) (7 ') cutting die (8) (8') pneumatic detector

(9) (9 ') Entry Guide Rail (10) (10') Product Guide Guide Rail

(11) (11 ') 34 (35) (35') Shock Spring 12 (12 ') Pneumatic Pipe

(13) pneumatic chamber (21) stripper plate

22 stripper back plate 23 punch plate

(24) Punch Back Plate (25) Push Holder

(26) Upper mold fixing pin (27) Stripper

(28) Washers (29) Po Die

30 Cutting Punch 31 Punch Holder

(32) Detection pins (33) Sensor

(36) (36 ') upper buffer supporter (37) (37') lower buffer supporter

(L) Lower mold (T) Upper mold

(S) (S ') sliding supporter

Hereinafter, the configuration and operation of the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 are partial cutaway and side structural diagrams for explaining the overall structure of the present invention. The upper mold and the lower mold are coupled to each other by a sliding supporter, and FIG. 3 is a plan view of the lower mold of the present invention. Figure 4 is a side structural view of the lower mold of the present invention, Figure 5 is a bottom structure of the upper mold of the present invention, Figure 6 is a side structural view of the upper mold of the present invention.

In the upper mold (T) and the lower mold (L) for trimming and forming a semiconductor product,

The die plate 1 and the back plate 2 are fixed to the die holder 3 with fixing pins 4 and 4 ', and then to the inside of the guide plates 5 and 5' installed at the center of the die plate 1. Forming dies 6, 6 'and cutting dies 7, 7' are installed, and pneumatic sensing holes 8, 8 'are drilled in the center of the forming dies 6, 6' and the forming die (6) (6 ') and the front end of the cutting die (7) (7'), install the guide rail (9) (9 ') of the all-light rear side, and the rear end of the product exit guide rail ( 10) (10 ') is installed, the lower buffer supporters 36, 36' and the buffer spring (11) (B) to buffer the forming dies (6), (6 '), (7) and (7') inside the bottom. 11 ') and a sliding supporter provided on one side of the lower mold L connecting the pneumatic sensing holes 8, 8' and the pneumatic chamber 13 with pneumatic pipes 12 and 12 'at the side ends thereof. The stripper plate 21, the stripper back plate 22, the punch plate 23 and the punch back plate 24 are attached to S) (S '). The pins 26 are fixed to the sheath holder 25, and the stripper 27, the washer 28, the die die 29, and the cutting punch 30 are installed in the punch holder 31 at the center of the stripper plate 21. The detection pin 32 is installed on one side of the stripper plate 21 to be detected by the sensor 33, and the buffer spring 34 is installed on the upper end of the cutting punch 30, the die 4 and the stripper. The upper mold (T) provided with the upper buffer supporters (37) (37 ') and the buffer springs (35) (35') are mounted inside the push holder (25) of the upper end (27).

In the drawings, reference numeral 41 denotes a sub guide post, 42 and 42 'upper mold stopper, 43 and 43', a lower mold stopper, 44 a semiconductor product, and 45 an upper fixing pin. It is a shock absorbing spring.

The present invention thus made in manufacturing a semiconductor,

Lead Frame ⇒ Chip Bonding ⇒ Au Wire ⇒ Molding ⇒ Washing process is completed, that is, the process of separating wafers into chips and picking up chips Process by using adhesive on the paddle of lead frame by using adhesive, and connects between pad of chip and lead of lead frame with Au wire to electrically connect chip and lead frame. And a semiconductor product 44 as shown in FIG. 7 which is cleaned by sealing with EMC thermosetting resin in order to protect the finished product and the wire bonding finished product by physical, electrical and chemical impact. The product 44 is fed into the guide guide rails 9 and 9 'formed at the center front end of the guide plate 6 and 6' of the lower mold L by feeding and trimming and forming. The front ends of the rails 9 and 9 'are formed in an all-optical narrow structure so that the product 44 is smoothly supplied to the forming dies 6, 6' and the cutting dies 7, 7 'without trouble. When the product 44 is seated on the pneumatic sensing holes 8 and 8 ', the forming die is formed through the pneumatic pipes 12 and 12' by an air inhaler (not shown) separately installed in the pneumatic chamber 13. (6) If air is sucked into the pneumatic sensing holes 8 and 8 'in the center of (6') and the product 44 is not seated in place, one of the pneumatic sensing holes 8 and 8 '. If the air continues to be sucked through the detection hole (8), the molding machine stops operating, and if the product (44) is seated in the right position and the air is not sucked into the pneumatic detection hole (8) (8 '), the upper mold is detected. Giving an operation signal to (T) and the upper mold (T) is to move down along the sliding supporter (S) (S ') to trim and form the product (44).

When the upper mold (T) is lowered as described above, the forming pin 32 mounted on the bottom of the stripper plate 21 detects the product 44 through the sensor 33 and continues to descend when the molding operation is performed. The forming dies 6, 6 'and the cutting die of the lower mold L are formed by the stripper 27, the washer 28, the four die 29 and the cutting punch 30 mounted on the punch holder 31. 7) The product 44 seated on 7 'is trimmed and molded.

At this time, the lower buffer supporters 26, 26 'and the buffer springs 11, 11 separately mounted on the lower ends of the forming dies 6, 6' and the cutting dies 7, 7 'of the lower mold L. ') And the upper punching supporter 37 (37') installed inside the upper end (i.e., the push holder 25) on which the cutting punch 30 of the upper mold T and the die die 29 and the stripper 27 are mounted. The upper mold T is lowered to a predetermined stroke by the buffer springs 35 and 35 'so that the upper and lower buffer supporters 36, 36', 37, 37 'and the buffer spring 11 are pressed at the time of pressing. 11 ', 35' and 35 'are compressed and compressed to prevent deformation and defects of the product 44, forming the lower mold L, cutting dies 6, 6', 7 '( The product 44 seated on the 7 ') is gradually raised by the shock absorber (buffer supporter, the buffer spring) when the upper mold T rises, thus forming and cutting dies 6, 6', 7 and 7 '. ) Does not escape.

In the above operation, the buffer spring 34 at the rear end of the detection pin 32 mounted on the upper mold T and the buffer spring 45 at the rear end of the fixing pin 26 are also cushioned and molded. The mold T rises again and waits for the next work.

When the above process is completed, the formed product 44 on the forming die 6, 6 ′ and the cutting die 7, 7 ′ of the lower mold L is pneumatic pipe 12 in the pneumatic chamber 13. Air is sucked into the pneumatic sensor holes 8 and 8 'which are drilled in the center of the forming dies 6 and 6' through the product 12 '. If air is continuously sucked into one of the pneumatic detecting holes 8 and 8 ', the operation of the device is stopped, and if it is no longer sucked, the product 44 is molded and detected to be seated in the right position. The subsequent process is carried out to discharge the finished product by a transfer or robot hand and to perform a continuous operation by the same method as above to form the product 44.

As described above, the semiconductor product undergoes trimming and forming process and prevents oxidation and corrosion of the lead frame in the air, and soldering process for plating tin and lead so that the PCB is soldered well. After marking the number and the like using a laser beam or ink, the packaging is passed to the consumer after the final inspection.

The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.

Therefore, the present invention eliminates the incidence of errors in the trimming and forming process of the product by a separate buffer device for forming and cutting die when pressing the upper and lower mold in the trimming and forming molding process while manufacturing a semiconductor product, and also the product is forming, It detects whether it is in the right position before being pressed by pneumatic sensing when entering and exiting the cutting die, and detects whether the product is separated from the forming die and cutting die after molding so that it can be discharged. Minimize the error rate of the product and can prevent the damage of the mold due to the malfunction of the molding apparatus in advance.

Claims (1)

In the upper mold (T) and the lower mold (L) for trimming and forming a semiconductor product, The die plate 1 and the back plate 2 are fixed to the die holder 3 with fixing pins 4 and 4 ', and then to the inside of the guide plates 5 and 5' installed at the center of the die plate 1. Forming dies 6, 6 'and cutting dies 7, 7' are installed, and pneumatic sensing holes 8, 8 'are drilled in the center of the forming dies 6, 6' and the forming die (6) (6 ') and the front end of the cutting die (7) (7'), install the guide rail (9) (9 ') of the all-light rear side, and the rear end of the product exit guide rail ( 10) (10 ') is installed, the lower buffer supporters 36, 36' and the buffer spring (11) (B) to buffer the forming dies (6), (6 '), (7) and (7') inside the bottom. 11 ') and a sliding supporter provided on one side of the lower mold L connecting the pneumatic sensing holes 8, 8' and the pneumatic chamber 13 with pneumatic pipes 12 and 12 'at the side ends thereof. The stripper plate 21, the stripper back plate 22, the punch plate 23 and the punch back plate 24 are attached to S) (S '). The pins 26 are fixed to the sheath holder 25, and the stripper 27, the washer 28, the die die 29, and the cutting punch 30 are installed in the punch holder 31 at the center of the stripper plate 21. The detection pin 32 is installed on one side of the stripper plate 21 to be detected by the sensor 33, and the buffer spring 34 is installed on the upper end of the cutting punch 30, the die 4 and the stripper. The upper mold (T) provided with the upper buffer supporter (37) (37 ') and the buffer spring (35) (35') is mounted inside the upper push holder (25) on which the upper (27) is mounted. Trimming and forming molding equipment in manufacturing process.