KR200230564Y1 - Apparatus for trimming and forming of semiconducting manufacturing process - Google Patents

Abstract

The present invention is a trimming process of removing a dambar that maintains the shape of a lead frame in a semiconductor manufacturing process, and a forming of a lead shape according to a package shape. The present invention relates to a trimming and forming molding apparatus for a semiconductor manufacturing process that performs the work of the process. More specifically, a small semiconductor (CP3, CPH3 / 6) used in cellular phones, LCD drives, etc. It is a device for trimming and forming. It has a structure that pneumatically senses the product into the die holder of the lower mold and detects the departure from work waiting and after molding. By preventing the deformation of the product shape during pressing and detecting the departure, the die plate (1) and the back plate (2) are fixed to the die holder (3) by the fixing pins (4) and (4 '). The forming dies 6 and 6 'and the cutting dies 7 and 7' are installed inside the guide plates 5 and 5 'installed in the center of the die plate 1, and the forming dies 6 ( At the center of 6 '), pneumatic sensing holes 8 and 8' are drilled and the front end of the forming dies 6 and 6 'and the cutting dies 7 and 7'. Product introduction guide rails (9) (9 ') and the rear end of the product discharge guide rails (10) (10') are installed, and the bottom of the forming, cutting dies (6) (6 ') (7) (7 Pneumatic sensing holes (8) (8 ') with pneumatic pipes (12) and (12') mounted at lower ends thereof with lower buffer supporters (36) (36 ') and buffer springs (11) (11') for cushioning '). ) And a stripper plate 21, stripper back plate 22, punch plate 23, and punch bag on a sliding supporter S (S ′) installed at one side of the lower mold L connecting the pneumatic chamber 13. The plate 24 is fixed to the push holder 25 with the fixing pin 26 and the stripper plate 21 The stripper 27, washer 28, cloth die 29 and the cutting punch 30 to the punch holder 31 and the detection pin 32 on one side of the stripper plate 21 to install the sensor 33 The upper buffer supporter 37 into the upper push holder 25 on which the cutting punch 30, the die die 29, and the stripper 27 are mounted. Trimming and forming molding apparatus of a semiconductor manufacturing process, characterized in that the upper mold (T) is installed (37 ') and the buffer spring (35, 35') is mounted.

Description

Apparatus for trimming and forming of semiconducting manufacturing process

The present invention is a trimming process of removing a dambar that maintains the shape of a lead frame in a semiconductor manufacturing process, and a forming of a lead shape according to a package shape. The present invention relates to a trimming and forming apparatus of a semiconductor manufacturing process that performs the work of the process, and more specifically, to a small semiconductor (CP3, CPH3 / 6) used in cellular phones and LCD drives. It is a device for trimming and forming. It has a structure that pneumatically senses the product into the die holder of the lower mold and detects the departure from work waiting and after molding. By preventing the deformation of the shape of the product when pressing and to detect the presence or absence of.

In general, semiconductor manufacturing consists of a process of inspection and packaging through chip bonding, gold wire, molding (resin), trimming, forming process after cleaning, and the above-mentioned assembly process. Wiring is completed from the wafer which has been processed in the FEB process to the dicing chip to complete the electrical operation. Molding and display for convenience , Packaging, etc. Among them, Dicing, Die Bonding, Wire Bonding, Molding, etc. are commonly called Front End. It is divided into plastic package and ceramic package.

In the process of manufacturing a conventional semiconductor, when the upper and lower molds are pressed to remove the dam bar that maintains the shape of the lead frame and make the lead shape according to the shape of the package, the size deviation of the package generated during molding (± 0.02) causes the error of the trimmed line, which increases the defective rate of the formed product.In addition, the product is not detected clearly after the confirmation of the entry of the product and the product is not clearly formed after the molding. There was a problem in that the mold of the trimming and forming apparatus is broken due to continuous automatic operation in the state of delayed work or the product is not completely discharged.

Therefore, the present invention was devised for the purpose of solving the conventional problems as described above, and the upper and lower molds are formed by pressing a separate buffer device for forming and cutting dies during pressing to eliminate the incidence of errors in the trimming and forming process of the product. A semiconductor that detects whether a product has been inserted into a position before being pressed by pneumatic sensing when forming, cutting, or ejecting into a forming or cutting die, and detects whether or not the product escapes from the forming and cutting die after molding. It is to provide a trimming and forming molding apparatus of the manufacturing process.

In order to provide the above-mentioned device, a forming die and a cutting die are installed inside the guide plate installed in the center of the die plate of the lower mold in which the die plate and the back plate are fixed to the die holder with a fixing pin, and a pneumatic sensing hole is drilled in the center of the forming die. And the front end of the forming die and the cutting die to install the product guide guide rail of the all-optical rear view and the rear end product discharge guide rail is installed, the lower buffer supporter and the buffer spring buffering the forming, cutting die to the inner bottom To the pneumatic pipe and to the pneumatic pipe at the side end, and to the stripper plate and washer in the center of the upper mold stripper plate which fixed the stripper plate, stripper back plate, punch plate and punch back plate to the push holder Punch For Die and Cutting Punch The upper buffer supporter and the buffer spring are installed inside the push holder on the upper side where the cutting punch, the for die and the stripper are mounted. By installing the upper mold is mounted on the sliding supporter formed on one side of the lower mold to provide a device that enables the trimming and forming of the semiconductor product.

1 is a partial cutaway front structural view for explaining the overall structure of the present invention

Figure 2 is a partial cutaway side structure diagram for explaining the overall structure of the present invention

3 is a plan view of the lower mold of the present invention

Figure 4 is a side structural view of the present invention lower mold

5 is a bottom structure diagram of the upper mold of the present invention

6 is a side structural view of the upper mold of the present invention

7 is a plan view, side structure of the product molded by the present invention

<Description of the symbols for the main parts of the drawings>

(1) die plate (2) back plate

(3) Die Holders (4) (4 ') Bottom Molding Pins

(5) (5 ') guide plate (6) (6') forming die

(7) (7 ') cutting die (8) (8') pneumatic detector

(9) (9 ') Entry Guide Rail (10) (10') Product Guide Guide Rail

(11) (11 ') 34 (35) (35') Shock Spring 12 (12 ') Pneumatic Pipe

(13) pneumatic chamber (21) stripper plate

22 stripper back plate 23 punch plate

(24) Punch Back Plate (25) Push Holder

(26) Upper mold fixing pin (27) Stripper

(28) Washers (29) Po Die

30 Cutting Punch 31 Punch Holder

(32) Detection pins (33) Sensor

(36) (36 ') lower buffer supporter (37) (37') upper buffer supporter

(L) Lower mold (T) Upper mold

(S) (S ') sliding supporter

Hereinafter, the configuration and operation of the present invention will be described in detail with reference to the accompanying drawings.

Figure 1 and 2 is a partial incision top, side structural view for explaining the overall structure of the subject innovation shown a state in which the upper mold and the lower mold coupled by a sliding supporter, Figure 3 is a planar structural diagram of the lower mold of the present invention, Figure 4 is a side structural view of the lower mold of the present invention, Figure 5 is a bottom structure of the upper mold of the present invention, Figure 6 is a side structural view of the upper mold of the present invention.

In the upper mold (T) and the lower mold (L) for trimming and forming a semiconductor product,

The die plate 1 and the back plate 2 are fixed to the die holder 3 with fixing pins 4 and 4 ', and then to the inside of the guide plates 5 and 5' installed at the center of the die plate 1. Forming dies 6, 6 'and cutting dies 7, 7' are installed, and pneumatic sensing holes 8, 8 'are drilled in the center of the forming dies 6, 6' and the forming die (6) (6 ') and the front end of the cutting die (7) (7'), install the guide rail (9) (9 ') of the all-light rear side, and the rear end of the product exit guide rail ( 10) (10 ') is installed, the lower buffer supporters 36, 36' and the buffer spring (11) (B) to buffer the forming dies (6), (6 '), (7) and (7') inside the bottom. 11 ') and a sliding supporter provided on one side of the lower mold L connecting the pneumatic sensing holes 8, 8' and the pneumatic chamber 13 with pneumatic pipes 12 and 12 'at the side ends thereof. The stripper plate 21, the stripper back plate 22, the punch plate 23 and the punch back plate 24 are attached to S) (S '). The pins 26 are fixed to the sheath holder 25, and the stripper 27, the washer 28, the die die 29, and the cutting punch 30 are installed in the punch holder 31 at the center of the stripper plate 21. The detection pin 32 is installed on one side of the stripper plate 21 to be detected by the sensor 33, and the buffer spring 34 is installed on the upper end of the cutting punch 30, the die 4 and the stripper. The upper mold (T) provided with the upper buffer supporters (37) (37 ') and the buffer springs (35) (35') are mounted inside the push holder (25) of the upper end (27).

In the drawings, reference numeral 41 denotes a sub guide post, 42 and 42 'upper mold stopper, 43 and 43', a lower mold stopper, 44 a semiconductor product, and 45 an upper fixing pin. It is a shock absorbing spring.

The present invention thus achieved in manufacturing a semiconductor,

Lead Frame ⇒ Chip Bonding ⇒ Au Wire ⇒ Molding ⇒ Washing process is completed, that is, the process of separating wafers into chips and picking up chips Process by using adhesive on the paddle of lead frame by using adhesive, and connects between pad of chip and lead of lead frame with Au wire to electrically connect chip and lead frame. And a semiconductor product 44 as shown in FIG. 7 which is cleaned by sealing with EMC thermosetting resin in order to protect the finished product and the wire bonding finished product by physical, electrical and chemical impact. The product 44 is fed into the guide guide rails 9 and 9 'formed at the center front end of the guide plate 6 and 6' of the lower mold L by feeding and trimming and forming. The front ends of the rails 9 and 9 'are formed in an all-optical narrow structure so that the product 44 is smoothly supplied to the forming dies 6, 6' and the cutting dies 7, 7 'without trouble. When the product 44 is seated, the pneumatic punched in the center of the forming dies 6 and 6 'through the pneumatic pipes 12 and 12' by means of an air inhaler (not shown) installed separately from the pneumatic chamber 13. If air is sucked into the sensing holes 8 and 8 'and the product 44 is not supplied in the proper position, the air is continuously sucked through the sensing hole 8 on one side among the pneumatic sensing holes 8 and 8'. At the same time, it stops the operation of the molding machine and when it is seated in the right position, air is no longer sucked into the pneumatic detecting hole (8) (8 ') so it detects this and gives an operation signal to the upper mold (T). The mold T is lowered along the sliding supporter S and S 'to trim and form the product 44.

As the upper mold (T) is lowered as described above, the detection pin 32 mounted on the bottom of the stripper plate 21 detects the product 44 through the sensor 33 and continues to descend when the molding operation is performed. The forming dies 6, 6 'and the cutting die of the lower mold L are formed by the stripper 27, the washer 28, the four die 29 and the cutting punch 30 mounted on the punch holder 31. 7) The product 44 seated on 7 'is trimmed and molded.

At this time, the lower buffer supporters 36, 36 'and the buffer springs 11, 11 separately mounted on the lower ends of the forming dies 6, 6' and the cutting dies 7, 7 'of the lower mold L. ') And the upper punching supporter 37 (37') installed inside the upper end (i.e., the push holder 25) on which the cutting punch 30 of the upper mold T and the die die 29 and the stripper 27 are mounted. The upper mold T is lowered to a predetermined stroke by the buffer springs 35 and 35 'so that the upper and lower buffer supporters 36, 36', 37, 37 'and the buffer spring 11 are pressed at the time of pressing. (11 ') (35) (35') is pressed and cushioned to prevent deformation and defects of the product (44), and after forming, forming of the lower mold (L), cutting die (6) (6 ') (7 The product 44 seated on the 7 'is gradually lifted by the lower buffer supporters 36 and 36' which receive the elasticity of the cushioning springs 11 and 11 'when the upper mold T rises. It does not escape from the die and buffers the rear end of the detection pin 32 mounted on the upper mold T during the above operation. The spring 34 and the buffer spring 45 at the rear end of the fixing pin 26 are also cushioned and molded in the same manner. When the molding is completed, the upper mold T rises again to wait for the next work.

When the above process is completed, the formed product 44 on the forming die 6, 6 ′ and the cutting die 7, 7 ′ of the lower mold L is pneumatic pipe 12 in the pneumatic chamber 13. Air is sucked into the pneumatic sensor holes 8 and 8 'which are drilled in the center of the forming dies 6 and 6' through the product 12 '. If the product 44 on the sensing hole 8 on one side of the pneumatic sensing holes 8 and 8 'is dislodged, the air is continuously sucked in, so that the operation of the device is stopped and the product is no longer sucked. ) Is seated in the right position to detect this and proceed to the subsequent process to discharge the finished product by transfer or robot hand and to form the product 44 by performing a continuous operation by the same method as the above process.

As described above, the semiconductor product undergoes trimming and forming process and prevents oxidation and corrosion of the lead frame in the air, and soldering process for plating tin and lead so that the PCB is soldered well. After marking the number and the like using a laser beam or ink, the packaging is passed to the consumer after the final inspection.

The present invention is not limited to the above-described specific preferred embodiments, and any person having ordinary skill in the art to which the present invention pertains may make various modifications without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.

Therefore, the present invention manufactures semiconductor products, and in the trimming and forming process, the error rate of trimming and forming process of the product is prevented by the buffers mounted on the lower die, the cutting die and the cutting punch, the forming die, and the stripper separately when pressing. Also, it detects whether the product is in the right position before being pressed by pneumatic sensing when entering and exiting the forming and cutting die, and after the product is detected, it can be discharged after detecting the departure from the forming and cutting die. By minimizing the error rate of the product that can occur in the continuous molding process of the product to prevent the damage of the mold due to the malfunction of the molding apparatus, and the like.

Claims (1)

In the upper mold (T) and the lower mold (L) for trimming and forming a semiconductor product, The die plate 1 and the back plate 2 are fixed to the die holder 3 with fixing pins 4 and 4 ', and then to the inside of the guide plates 5 and 5' installed at the center of the die plate 1. Forming dies 6, 6 'and cutting dies 7, 7' are installed, and pneumatic sensing holes 8, 8 'are drilled in the center of the forming dies 6, 6' and the forming die (6) (6 ') and the front end of the cutting die (7) (7'), install the guide rail (9) (9 ') of the all-light rear side, and the rear end of the product exit guide rail ( 10) (10 ') is installed, the lower buffer supporters 36, 36' and the buffer spring (11) (B) to buffer the forming dies (6), (6 '), (7) and (7') inside the bottom. 11 ') and a sliding supporter provided on one side of the lower mold L connecting the pneumatic sensing holes 8, 8' and the pneumatic chamber 13 with pneumatic pipes 12 and 12 'at the side ends thereof. The stripper plate 21, the stripper back plate 22, the punch plate 23 and the punch back plate 24 are attached to S) (S '). The pins 26 are fixed to the sheath holder 25, and the stripper 27, the washer 28, the die die 29, and the cutting punch 30 are installed in the punch holder 31 at the center of the stripper plate 21. The detection pin 32 is installed on one side of the stripper plate 21 to be detected by the sensor 33, and the buffer spring 34 is installed on the upper end of the cutting punch 30, the die 4 and the stripper. The upper mold (T) provided with the upper buffer supporter (37) (37 ') and the buffer spring (35) (35') is mounted inside the upper push holder (25) on which the upper (27) is mounted. Trimming and forming molding equipment in manufacturing process.