KR200187487Y1 - Apparatus for marking lead frame of due bonder - Google Patents
Apparatus for marking lead frame of due bonder Download PDFInfo
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- KR200187487Y1 KR200187487Y1 KR2019980005947U KR19980005947U KR200187487Y1 KR 200187487 Y1 KR200187487 Y1 KR 200187487Y1 KR 2019980005947 U KR2019980005947 U KR 2019980005947U KR 19980005947 U KR19980005947 U KR 19980005947U KR 200187487 Y1 KR200187487 Y1 KR 200187487Y1
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- lead frame
- marking
- epoxy
- die bonding
- bonding equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
본 고안은 반도체 다이본딩장비의 리드프레임 마킹장치에 관한 것으로, 리드프레임(10)의 패들(10a)에 에폭시를 도포시에 고정플레이트(7)에 설치된 마킹수단으로 가이드레일(10b)에 마킹을 하여, 후공정인 몰딩공정이후에도 가이드레일에 형성된 마킹으로 보고 작업을 진행할 수 있도록 함으로써, 혼입불량이 발생되는 것을 방지하는 효과가 있다.The present invention relates to a lead frame marking apparatus of a semiconductor die bonding equipment, and marking on the guide rail (10b) by the marking means installed on the fixing plate (7) when the epoxy is applied to the paddle (10a) of the lead frame (10). Thus, even after the molding process, which is a post-process, the reporting work can be performed by marking formed on the guide rail, thereby preventing mixing defects from occurring.
Description
본 고안은 반도체 다이본딩장비의 리드프레임 마킹장치에 관한 것으로, 특히 리드프레임의 가이드 레일에 마킹을 실시하여 후공정에서 작업자가 용이하게 제품을 인식할 수 있도록 하는데 적합한 반도체 다이본딩장비의 리드프레임 마킹장치에 관한 것이다.The present invention relates to a lead frame marking apparatus of a semiconductor die bonding equipment. In particular, the lead frame marking of a semiconductor die bonding equipment is suitable for marking a guide rail of a lead frame so that an operator can easily recognize a product in a later process. Relates to a device.
일반적으로 반도체 패키지 제조시에는 스트립상태의 리드프레임에 칩을 부착하는 다이본딩공정과, 금속와이어를 연결하는 와이어본딩 및 에폭시로 몰딩하는 몰딩공정을 실시한 다음, 싱글레이션공정을 실시하여 낟개의 패키지로 완성한다.In general, in the manufacture of semiconductor packages, a die bonding process for attaching chips to a lead frame in a strip state, a wire bonding process for molding metal wires, and a molding process for molding with epoxy are performed, followed by a singulation process. Complete
그리고, 상기 다이본딩공정을 실시하는 종래 다이본딩장비가 도 1에 도시되어 있는 바, 이를 간단히 설명하면 다음과 같다.In addition, a conventional die bonding apparatus for performing the die bonding process is illustrated in FIG. 1, which will be briefly described as follows.
도 1은 종래 다이본딩장비의 구성을 보인 사시도로서, 도시된 바와 같이, 종래 다이본딩장비는 위크홀더(1)에 리드프레임을 로딩하기 위한 리드프레임 로딩부(2)와, 상기 워크홀더(1)에서 이송되는 리드프레임의 패들들에 에폭시를 떨어뜨리기 위한 에폭시 형성부(3)와, 그 리드프레임의 패들에 형성된 에폭시를 이용하여 패들에 칩을 고정부착하는 칩본딩부(4)와, 칩들이 본딩된 리드프레임을 언로딩하기 위한 리드프레임 언로딩부(5)로 구성되어 있다.1 is a perspective view showing the configuration of a conventional die bonding equipment, as shown, the conventional die bonding equipment is a lead frame loading unit 2 for loading a lead frame into the weak holder (1), and the work holder (1) Epoxy forming portion (3) for dropping the epoxy on the paddle of the lead frame transferred from the), chip bonding portion (4) for fixing the chip to the paddle using the epoxy formed on the paddle of the lead frame, and the chip And a lead frame unloading unit 5 for unloading the lead frame bonded thereto.
그리고, 상기 에폭시 형성부(3)는 에폭시가 수납되는 에폭시 탱크(6)가 승강가능하게 설치된 고정플레이트(7)에 고정되어 있고, 에폭시 탱크(6)의 하단부에는 노즐(8)이 설치되어 있으며, 클램프(9)들에 의하여 워크홀더(1)의 상면으로 이동하는 리드프레임(10)의 패들(10a)들에 노즐(8)에서 에폭시를 떨어뜨릴 수 있도록 되어 있다.In addition, the epoxy forming unit 3 is fixed to a fixed plate 7 provided with an epoxy tank 6 in which an epoxy is stored. The nozzle 8 is provided at a lower end of the epoxy tank 6. In addition, epoxy 9 is dropped from the nozzle 8 to the paddles 10a of the lead frame 10 moving to the upper surface of the work holder 1 by the clamps 9.
도면중 미설명 부호12는 리드프레임 감지센서, 13은 리드프레임 스택 메거진, 14는 리드프레임 픽-업 홀더이다.In the drawings, reference numeral 12 denotes a leadframe sensor, 13 a leadframe stack magazine, and 14 a leadframe pick-up holder.
상기와 같이 구성되어 있는 종래 다이본딩장비에서는 리드프레임 스택 메거진(13)에 있는 리드프레임(10)들 중 1개를 리드프레임 픽-업 홀더(14)에서 픽-업하여 워크홀더(1)의 입구부 상면에 얹어 놓는다.In the conventional die-bonding equipment configured as described above, one of the lead frames 10 in the lead frame stack magazine 13 is picked up from the lead frame pick-up holder 14 so that the work holder 1 Place it on the top of the entrance.
그리고, 상기와 같이 워크홀더(1)에 얹혀진 리드프레임(10)은 클램프(9)들에 의하여 이송되며, 이송되는 리드프레임(10)이 에폭시 탱크(6)의 하측에 이송하여 리드프레임 감지센서(12)에 감지되면 고정플레이트(7)에 의하여 에폭시 탱크(6)가 하강을 하고, 이송되는 리드프레임(10)들의 패들(10a)들에 각각 노즐(8)을 통하여 일정양의 에폭시를 떨어뜨린다.In addition, the lead frame 10 mounted on the work holder 1 is transferred by the clamps 9 as described above, and the lead frame 10 to be transferred is transferred to the lower side of the epoxy tank 6 so as to detect the lead frame. When it is detected by 12, the epoxy tank 6 is lowered by the fixing plate 7, and a certain amount of epoxy is dropped through the nozzles 8 to the paddles 10a of the lead frames 10 to be transferred. Drop.
그런 다음, 상기와 같이 패들(10a)에 에폭시가 도포된 리드프레임(10)이 칩본딩부(4)에서 칩을 본딩하고, 리드프레임 언로딩부(5)를 통하여 언로딩되는 일련의 동작을 연속적으로 진행하며 다이본딩작업이 진행된다.Then, as described above, the lead frame 10 coated with epoxy on the paddle 10a bonds the chip in the chip bonding unit 4 and performs a series of operations of unloading through the lead frame unloading unit 5. The die bonding work is carried out continuously.
그러나, 상기와 같이 다이본딩된 리드프레임(10)들이 후공정인 와이어본딩과 몰딩이 진행되며 혼입되는 경우가 종종 발생되고, 몰딩된 후에는 몰딩형태가 동일한 패키지들은 구분이 힘들어 혼입된 모든제품을 폐기하여야 하므로 그로인한 손실이 발생되는 문제점이 있었다.However, when the die-bonded leadframes 10 are mixed with the wire-bonding and molding process, which is a post-process, often, the packages having the same molding form are difficult to distinguish after molding. Since it must be discarded, there was a problem that the loss caused.
상기와 같은 문제점을 감안하여 안출한 본 고안의 목적은 다이본딩작업시 리드프레임의 가이드레일에 마킹을 하여 몰딩후에도 제품종류의 식별이 용이하여 혼입불량이 발생되는 것을 방지하도록 하는데 적합한 반도체 다이본딩장비의 리드프레임 마킹장치를 제공함에 있다.The object of the present invention devised in view of the above problems is to mark the guide rail of the lead frame during the die bonding operation, so that it is easy to identify the product type even after molding, so that the semiconductor die bonding equipment is suitable for preventing the occurrence of mixing defects. To provide a lead frame marking apparatus of.
도 1은 종래 다이본딩장비의 구성을 보인 사시도.1 is a perspective view showing the configuration of a conventional die bonding equipment.
도 2는 본 고안 리드프레임 마킹장치가 설치된 다이본딩장비의 구성을 보인 사시도.Figure 2 is a perspective view showing the configuration of the die bonding equipment is installed lead frame marking device of the present invention.
도 3은 본 고안의 마킹장치에 의하여 마킹된 리드프레임.3 is a lead frame marked by the marking device of the present invention.
* * 도면의 주요 부분에 대한 부호의 설명 * ** * Explanation of symbols for the main parts of the drawing * *
6 : 에폭시 탱크 7 : 고정플레이트6: epoxy tank 7: fixed plate
10 : 리드프레임 10b : 가이드 레일10: lead frame 10b: guide rail
20 : 마킹플레이트20: marking plate
상기와 같은 본 고안의 목적을 달성하기 위하여 다이본딩장비의 에폭시 탱크 고정용 고정플레이트 일측에 설치되어 리드프레임의 가이드 레일에 일정크기의 표시를 하기 위한 마킹수단을 구비하여서 구성되는 것을 특징으로 하는 반도체 다이본딩장비의 리드프레임 마킹장치가 제공된다.In order to achieve the object of the present invention as described above is installed on one side of the fixing plate for fixing the epoxy tank of the die bonding equipment semiconductor comprising a marking means for marking a certain size on the guide rail of the lead frame A leadframe marking apparatus of die bonding equipment is provided.
이하, 상기와 같이 구성되는 본 고안 반도체 다이본딩장비의 리드프레임 마킹장치를 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, with reference to the embodiment of the accompanying drawings, the lead frame marking apparatus of the present invention die-bonding equipment configured as described above in more detail as follows.
도 2는 본 고안 리드프레임 마킹장치가 설치된 다이본딩장비의 구성을 보인 사시도로서, 도시된 바와 같이, 본 고안 리드 프레임 마킹장치가 설치된 다이본딩 장비는 위크홀더(1)에 리드프레임을 로딩하기 위한 리드프레임 로딩부(2)와, 상기 워크홀더(1)에서 이송되는 리드프레임의 패들들에 에폭시를 떨어뜨리기 위한 에폭시 형성부(3)와, 그 리드프레임의 패들에 형성된 에폭시를 이용하여 패들에 칩을 고정부착하는 칩본딩부(4)와, 칩들이 본딩된 리드프레임을 언로딩하기 위한 리드프레임 언로딩부(5)로 구성되어 있고, 상기 에폭시 형성부(3)는 에폭시가 수납되는 에폭시 탱크(6)가 승강가능하게 설치된 고정플레이트(7)에 고정되어 있고, 에폭시 탱크(6)의 하단부에는 노즐(8)이 설치되어 있으며, 클램프(9)들에 의하여 워크홀더(1)의 상면으로 이동하는 리드프레임(10)의 패들(10a)들에 노즐(8)에서 에폭시를 떨어뜨릴 수 있도록 되어 있는 구성은 종래와 유사하다.Figure 2 is a perspective view showing the configuration of the die bonding equipment is installed lead frame marking device of the present invention, as shown, the die bonding equipment is equipped with the lead frame marking device of the present invention for loading the lead frame in the weak holder (1) The lead frame loading portion 2, an epoxy forming portion 3 for dropping the epoxy on the paddle of the lead frame conveyed from the work holder 1, and the epoxy formed on the paddle of the lead frame to the paddle It consists of a chip bonding part (4) for fixing the chip and a lead frame unloading part (5) for unloading the lead frame bonded the chip, the epoxy forming part (3) is epoxy containing epoxy The tank 6 is fixed to a fixed plate 7 provided to be movable up and down, the lower end of the epoxy tank 6 is provided with a nozzle 8, the upper surface of the work holder (1) by the clamps (9) To go to Configuration, which is to drop the epoxy from nozzles 8 in the paddle (10a) of the de frame 10 is similar to the prior art.
여기서, 상기 에폭시 탱크(6)가 고정되어 있는 고정플레이트(7)의 일측에 마킹수단으로서 하면에 조립되는 패키지의 제품명, 롯드 번호 등의 인식마크가 양각되어 있는 마킹플레이트(20)가 설치되어 있다.Here, a marking plate 20 is provided on one side of the fixing plate 7 to which the epoxy tank 6 is fixed, on which recognition marks such as product name and lot number of the package assembled on the lower surface are embossed as marking means. .
도면중 미설명 부호12는 리드프레임 감지센서, 13은 리드프레임 스택 메거진, 14는 리드프레임 픽-업 홀더이다.In the drawings, reference numeral 12 denotes a leadframe sensor, 13 a leadframe stack magazine, and 14 a leadframe pick-up holder.
상기와 같이 구성되어 종래 리드프레임 마킹장치가 설치된 다이본딩장비의 동작을 설명하면 다음과 같다.Referring to the operation of the die-bonding equipment is configured as described above conventional installation of the lead frame marking device is as follows.
리드프레임 스택 메거진(13)에 있는 리드프레임(10)들 중 1개를 리드프레임 픽-업 홀더(14)에서 픽-업하여 워크홀더(1)의 입구부 상면에 얹어 놓은 다음, 클램프(9)에 의하여 이송되며, 이와 같이 이송되는 리드프레임(10)이 에폭시 탱크(6)의 하측에 이송하여 리드프레임 감지센서(12)에 감지되면 고정플레이트(7)에 의하여 에폭시 탱크(6)가 하강을 하고, 이송되는 리드프레임(10)들의 패들(10a)들에 각각 노즐(8)을 통하여 일정양의 에폭시를 떨어뜨리는 동작은 종래와 유사하다.One of the leadframes 10 in the leadframe stack magazine 13 is picked up from the leadframe pick-up holder 14 and placed on the top of the inlet of the workholder 1 and then clamped 9 When the lead frame 10 is transferred to the lower side of the epoxy tank 6 and sensed by the lead frame sensor 12, the epoxy tank 6 is lowered by the fixing plate 7. And, the operation of dropping a certain amount of epoxy through the nozzle (8) to the paddle (10a) of the lead frame 10 to be transferred is similar to the conventional.
여기서, 상기 고정플레이트(7)가 하강을 할 때 고정플레이트(7)의 일측에 고정설치된 마킹플레이트(20)가 동시에 하강하게 되며, 그 마킹플레이트(20)의 하면에 형성된 인식표시가 리드프레임(10)의 가이드레일(10b)에 도 3과 같이 음각으로 마킹되어 GMS001이라고 표시된다.Here, when the fixing plate 7 is lowered, the marking plate 20 fixed to one side of the fixing plate 7 is lowered at the same time, and the recognition mark formed on the lower surface of the marking plate 20 is lead frame ( 10) is marked intaglio as shown in Fig. 3 on the guide rail (10b) is displayed as GMS001.
그런 다음, 상기와 같이 패들(10a)에 에폭시가 도포됨과 동시에 가이드레일(10b)에 마킹이된 리드프레임(10)이 이송되어 칩본딩부(4)에서 칩을 본딩하게 되고, 리드프레임 언로딩부(5)를 통하여 언로딩되는 일련의 동작을 연속적으로 진행하며 다이본딩작업이 진행된다.Then, the epoxy is applied to the paddle (10a) as described above, and the lead frame (10) marked on the guide rail (10b) is transferred to bond the chip in the chip bonding portion 4, the lead frame unloading The die-bonding operation is performed while continuously performing a series of operations unloaded through the unit 5.
상기 실시예에서는 마킹수단으로서 하면에 인식표시가 양각된 마킹플레이트(20)가 고정플레이트(7)에 설치된 것을 예로들어 설명하였으나, 꼭 그에 한정하는 것은 아니고, 본 고안의 사상과 범주를 벗어나지 않는 범위내에서 레이저 마커등 마킹할 수 있는 여가가지의 설치 및 응용이 가능하다.In the above embodiment, although the marking plate 20 having the recognition mark embossed on the lower surface as the marking means has been described as an example in the fixing plate 7, the present invention is not limited thereto, and the scope does not depart from the spirit and scope of the present invention. It is possible to install and apply leisure equipment that can mark laser markers within.
이상에서 상세히 설명한 바와 같이, 본 고안 반도체 다이본딩장비의 리드프레임 마킹장치는 리드프레임의 패들에 에폭시를 도포시에 고정플레이트에 설치된 마킹수단으로 가이드레일에 마킹을 하여, 후공정인 몰딩공정이후에도 가이드레일에 형성된 마킹으로 보고 작업을 진행할 수 있도록 함으로써, 혼입불량이 발생되는 것을 방지하는 효과가 있다.As described in detail above, the lead frame marking apparatus of the inventive die-bonding equipment is marked on the guide rail by marking means installed on the fixing plate when epoxy is applied to the paddle of the lead frame, so that the guide after the molding process is a post process. By allowing the reporting operation to proceed with the marking formed on the rail, there is an effect of preventing the mixing failure.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019980005947U KR200187487Y1 (en) | 1998-04-15 | 1998-04-15 | Apparatus for marking lead frame of due bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019980005947U KR200187487Y1 (en) | 1998-04-15 | 1998-04-15 | Apparatus for marking lead frame of due bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990039618U KR19990039618U (en) | 1999-11-15 |
| KR200187487Y1 true KR200187487Y1 (en) | 2000-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019980005947U KR200187487Y1 (en) | 1998-04-15 | 1998-04-15 | Apparatus for marking lead frame of due bonder |
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| Country | Link |
|---|---|
| KR (1) | KR200187487Y1 (en) |
-
1998
- 1998-04-15 KR KR2019980005947U patent/KR200187487Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR19990039618U (en) | 1999-11-15 |
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