JP3831654B2 - Semiconductor device lead electrode cutting apparatus and method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device lead electrode cutting apparatus and method, and more particularly, to a cutting die having a die and a punch and cutting the lead electrode of the semiconductor device to a predetermined length, and lead electrode chips generated by the cutting. The present invention relates to an apparatus and method for cutting a lead electrode of a semiconductor device having a chip collection mechanism for collecting and removing the semiconductor chip.
[0002]
[Prior art]
As a semiconductor device package technology, a resin mold package in which a semiconductor element is encapsulated with a resin is employed for mass production. In this type of semiconductor device, a plurality of pieces are extended outward from the package body. The lead electrode is provided. In such a semiconductor device, after the semiconductor element is encapsulated with resin in the manufacturing process, the lead electrode extending outward from the package body is bent, and the lead electrode is further cut into a predetermined length. It is supposed to be. In this lead electrode cutting, a cutting die is generally used.
[0003]
Chips are generated in the above lead electrode cutting. If this chip adheres to the cutting die, problems such as breakage of the cutting die and defects in which the lead electrode cannot be cut with a predetermined size and shape will occur. Therefore, after cutting the lead electrode, a method such as blowing by suction or gas blowing is used. The chips are removed and recovered.
[0004]
In practice, however, chips are strongly attached to the cutting mold, and it is often impossible to remove and collect chips even by suction or gas blowing. In addition, when the suction force or blowing force is increased during the removal or collection of chips, the chips are often scattered and adhered to each part of the lead electrode cutting device.
[0005]
In order to solve such a problem, Japanese Patent Application Laid-Open No. 2000-40782 is provided with an external force adding means, and when cutting the lead electrode, an external force is applied to the chip in the chip falling direction to ensure chip removal and recovery. The technology is disclosed.
Further, in Japanese Patent Laid-Open No. 2001-210773, a cutting die is shaped so that chips come into contact with only one point, and the chips rotate around the contact point as a fulcrum and are blown by air blowing or the like. A technique for facilitating removal is disclosed.
[0006]
By the way, the semiconductor devices as described above are generally manufactured collectively from those mounted on a long lead frame. Recently, in order to efficiently manufacture a larger number of semiconductor devices, the interval between the mounted semiconductor devices has been shortened. In such a case, the size of the chips generated at the time of cutting the lead electrode becomes small, and even if the technique disclosed in the above publication is used, there is a possibility that the chips cannot be removed and collected.
[0007]
[Problems to be solved by the invention]
Therefore, the present invention eliminates the problems of the prior art, and even if the chips generated at the time of cutting the lead electrode are short, the chip can be easily and reliably removed and collected. It is an object of the present invention to provide a cutting apparatus and method.
[0008]
[Means for Solving the Problems]
According to the present invention, this technical problem is solved by employing the following technical means.
(1) A semiconductor device lead having a die having a die and a punch, and having a cutting die for cutting the lead electrode of the semiconductor device to a predetermined length, and a chip recovery mechanism for recovering and removing chips of the lead electrode generated by the cutting. In the electrode cutting device,
The die is configured to be horizontally slidable, and
2. A lead electrode cutting device for a semiconductor device, comprising: a chip detachment means provided in contact with the slide surface of the die of the chip recovery mechanism and configured to contact the chip attached to the sliding die and release the chip from the die.
(2) In a lead electrode cutting method for a semiconductor device, using a cutting die having a die and a punch, cutting the lead electrode of the semiconductor device to a predetermined length, and collecting and removing chips of the lead electrode generated by the cutting. ,
A method for cutting a lead electrode of a semiconductor device, comprising: sliding the die in a horizontal direction, and applying chips to the chip release means to release chips from the die.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail based on preferred examples.
The semiconductor device that is the subject of the present invention means various components that have lead electrodes such as mini-mold transistors and ICs and that are manufactured together using a lead frame. In the following embodiment, an IC will be described as an example.
[0010]
FIG. 1 schematically shows a lead electrode cutting device for a semiconductor device according to an embodiment of the present invention. In the figure, 1 is a semiconductor device (IC), 2 is a lead electrode of the semiconductor device 1, 3 is a punch, 4 is a fixing jig, 5 is a die, 6 is a chip stopper as a chip detachment means, 7 is a chip collection hole, 8 Is chips.
[0011]
The cutting die in the lead electrode cutting apparatus of the present embodiment basically includes a punch 3, a fixing jig 4 and a die 5. The punch 3 and the fixing jig 4 can be moved up and down by a vertical movement mechanism (not shown). The die 5 is slidable back and forth (left and right in the figure) in a horizontal plane with respect to the semiconductor device 1 to be processed by a slide mechanism (not shown), and serves as a guide for aligning the semiconductor device 1. I also have a role. The punch 3 and the fixing jig 4 are fixed by sandwiching the semiconductor device 1 at the time of cutting the lead electrode, and the semiconductor device 1 is raised in that state, and the lead electrode 2 is cut to a predetermined length by the punch 3 and the die 5. It has become.
[0012]
In addition, the chip collection mechanism in the lead electrode cutting apparatus of the present embodiment includes a chip stopper 6 and a chip collection hole 7. The chip stopper 6 slides the die 5 and applies the chip 8 attached to the die 5 to cause the chip 8 to be detached from the die 5. For this reason, the chip stopper 6 is provided so as to contact the lower surface of the die 5, its position in the horizontal plane is fixed, and its tip position recedes from the tip position of the die 5 when cutting the lead electrode, In addition, the position is set so as to be retracted from the tip position of the lead electrode 2 before cutting. The chip collection hole 7 is a hole for dropping and collecting the chip 8 generated by cutting the lead electrode. The inside of the chip collection hole 7 is sucked by a suction mechanism (not shown). By this suction, the chips 8 attached to the die 5 are removed, and the chips 8 are reliably recovered in the chip recovery holes 7. Suction in the chip collection hole 7 may be performed constantly or only during collection.
[0013]
Next, the operation of the lead electrode cutting apparatus having the above configuration will be described with reference to FIG. First, as shown in FIG. 2A, the semiconductor device 1 is loaded into the cutting die of the present embodiment by a loading means (vacuum suction nozzle or the like) (not shown), placed on the punch 3, and then the loading means. And move it to a different position. Next, the die 5 is advanced to the semiconductor device 1 side, and after positioning the semiconductor device 1 in the horizontal direction, the semiconductor device 1 is fixed by the fixing jig 4 (FIG. 2B).
Next, the die 5 is moved (retracted) to the cutting position, raised while the semiconductor device 1 is fixed by the punch 3 and the fixing jig 4, and the lead electrode 2 is cut to a predetermined length by the punch 3 and the die 5 ( FIG. 2 (c)). After cutting the lead electrode, the fixing jig 4 is raised and moved to another position. Thereafter, the semiconductor device 1 is unloaded to the next processing position by unillustrated unloading means (which may be the same as or different from the above-described loading means) (FIG. 2D). At this time, the chips 8 are attached to the lower surface of the die 5.
Simultaneously with the carrying out, the die 5 starts to be retracted in the horizontal plane, and when the die 5 is retracted to a predetermined position, the chips 8 hit the chip stopper 6 (FIG. 2 (e)), and the die 5 is further retracted so that the tip position of the die 5 is When it comes to the rear side from the tip position of the chip stopper 6, the chip 8 is detached from the die 5, falls in the chip collection hole 7, and is collected (FIG. 2 (f)).
Through the above steps, even when the chips generated when cutting the lead electrode are short, the chips can be easily and reliably removed and collected.
[0014]
The present invention has been described based on the embodiments. However, the present invention is not limited to the above embodiments, and various modifications and changes can be made.
For example, the shape and arrangement of the punch, die, fixing jig, and chip recovery hole are not limited to those illustrated, and may be arranged upside down.
Further, the chip recovery method is not limited to suction as described above, but may be gas or liquid spray from the opposite side of the chip recovery hole, external force in the recovery direction, application of vibration, sweeping with a brush, or the like.
Further, in the above, the die also serves as a guide for positioning, but it may be a separate one.
[0015]
【The invention's effect】
According to the present invention, at the time of cutting the lead electrode of the semiconductor device, by sliding the die to which the chips are attached and applying the chips to the chip removing means, even small chips can be reliably and easily separated from the die, Reliable chip removal and recovery can be realized.
[Brief description of the drawings]
FIG. 1 schematically shows a structure of a lead electrode cutting device for a semiconductor device according to an embodiment of the present invention.
2 is a process explanatory diagram of a lead electrode cutting operation by the lead electrode cutting apparatus of the embodiment of FIG. 1; FIG.
[Explanation of symbols]
1 Semiconductor device (IC)
2 Lead electrode 3 Punch 4 Fixing jig 5 Die 6 Chip stopper 7 Chip recovery hole 8 Chip

Claims (2)

A lead electrode cutting device for a semiconductor device having a die and a punch, a cutting die for cutting the lead electrode of the semiconductor device to a predetermined length, and a chip collecting mechanism for collecting and removing the chip of the lead electrode generated by the cutting In
The die is configured to be horizontally slidable, and
2. A lead electrode cutting device for a semiconductor device, comprising: a chip detaching means provided in contact with the slide surface of the die of the chip collecting mechanism and configured to contact the chips attached to the sliding die and release the chips from the die. In a lead electrode cutting method for a semiconductor device, using a cutting die having a die and a punch, cutting the lead electrode of the semiconductor device to a predetermined length, and collecting and removing chips of the lead electrode generated by the cutting,
A method of cutting a lead electrode of a semiconductor device, wherein the chip is detached from the die by sliding the die in a horizontal direction and applying the chips adhering to the die to the chip removing means.

Images