KR101129715B1 - 진행중인 계측 작업을 동적으로 제어하는 방법 및 시스템 - Google Patents

진행중인 계측 작업을 동적으로 제어하는 방법 및 시스템 Download PDF

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Publication number
KR101129715B1
KR101129715B1 KR1020077008345A KR20077008345A KR101129715B1 KR 101129715 B1 KR101129715 B1 KR 101129715B1 KR 1020077008345 A KR1020077008345 A KR 1020077008345A KR 20077008345 A KR20077008345 A KR 20077008345A KR 101129715 B1 KR101129715 B1 KR 101129715B1
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South Korea
Prior art keywords
metrology
lot
wafer
lots
tool
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Expired - Fee Related
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KR1020077008345A
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English (en)
Korean (ko)
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KR20070051939A (ko
Inventor
매튜 에이. 퍼디
케이브 더블유. 닉식
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글로벌파운드리즈 인크.
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32247—Real time scheduler
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32306—Rules to make scheduling decisions
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80—Management or planning

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
KR1020077008345A 2004-10-05 2005-06-23 진행중인 계측 작업을 동적으로 제어하는 방법 및 시스템 Expired - Fee Related KR101129715B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/958,834 US7296103B1 (en) 2004-10-05 2004-10-05 Method and system for dynamically selecting wafer lots for metrology processing
US10/958,834 2004-10-05
PCT/US2005/022191 WO2006041542A2 (en) 2004-10-05 2005-06-23 Method and system for dynamically controlling metrology work in progress

Publications (2)

Publication Number Publication Date
KR20070051939A KR20070051939A (ko) 2007-05-18
KR101129715B1 true KR101129715B1 (ko) 2012-03-28

Family

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Family Applications (1)

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KR1020077008345A Expired - Fee Related KR101129715B1 (ko) 2004-10-05 2005-06-23 진행중인 계측 작업을 동적으로 제어하는 방법 및 시스템

Country Status (7)

Country Link
US (1) US7296103B1 (enExample)
EP (1) EP1797486A2 (enExample)
JP (1) JP2008523458A (enExample)
KR (1) KR101129715B1 (enExample)
CN (1) CN101036092B (enExample)
TW (1) TWI374345B (enExample)
WO (1) WO2006041542A2 (enExample)

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US7937177B2 (en) * 2007-06-27 2011-05-03 International Business Machines Corporation Manufacturing work in process management system
US7668615B2 (en) * 2007-10-02 2010-02-23 GlobalFoundries, Inc. Method and apparatus for randomizing dispatch order for single wafer processing
US8565910B2 (en) 2011-02-04 2013-10-22 International Business Machines Corporation Manufacturing execution system (MES) including a wafer sampling engine (WSE) for a semiconductor manufacturing process
US9027035B2 (en) * 2012-12-17 2015-05-05 Itron, Inc. Non real-time metrology data management
US10133263B1 (en) 2014-08-18 2018-11-20 Kla-Tencor Corporation Process condition based dynamic defect inspection
CN105470156B (zh) * 2014-09-09 2018-09-04 中芯国际集成电路制造(上海)有限公司 一种基于rtd的量测工艺
US10295979B2 (en) * 2015-09-15 2019-05-21 Applied Materials, Inc. Scheduling in manufacturing environments
US10763144B2 (en) * 2018-03-01 2020-09-01 Verity Instruments, Inc. Adaptable-modular optical sensor based process control system, and method of operation thereof
US11887862B2 (en) * 2021-09-14 2024-01-30 Deca Technologies Usa, Inc. Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL
US12362322B2 (en) 2023-06-22 2025-07-15 Deca Technologies Usa, Inc. Method of making a fan-out semiconductor assembly with an intermediate carrier

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Also Published As

Publication number Publication date
CN101036092A (zh) 2007-09-12
TW200627105A (en) 2006-08-01
EP1797486A2 (en) 2007-06-20
US7296103B1 (en) 2007-11-13
CN101036092B (zh) 2010-11-03
JP2008523458A (ja) 2008-07-03
WO2006041542A3 (en) 2006-06-01
WO2006041542A2 (en) 2006-04-20
KR20070051939A (ko) 2007-05-18
TWI374345B (en) 2012-10-11

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