JP2008523458A - 処理中のメトロロジー作業を動的に制御する方法およびシステム - Google Patents

処理中のメトロロジー作業を動的に制御する方法およびシステム Download PDF

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Publication number
JP2008523458A
JP2008523458A JP2007535668A JP2007535668A JP2008523458A JP 2008523458 A JP2008523458 A JP 2008523458A JP 2007535668 A JP2007535668 A JP 2007535668A JP 2007535668 A JP2007535668 A JP 2007535668A JP 2008523458 A JP2008523458 A JP 2008523458A
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JP
Japan
Prior art keywords
metrology
lot
tool
wafer
processing
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Pending
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JP2007535668A
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English (en)
Japanese (ja)
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JP2008523458A5 (enExample
Inventor
エイ． パーディ マシュー
ダブリュ． ニクシク ケイブ
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2008523458A publication Critical patent/JP2008523458A/ja
Publication of JP2008523458A5 publication Critical patent/JP2008523458A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32247—Real time scheduler
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32306—Rules to make scheduling decisions
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80—Management or planning

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
JP2007535668A 2004-10-05 2005-06-23 処理中のメトロロジー作業を動的に制御する方法およびシステム Pending JP2008523458A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/958,834 US7296103B1 (en) 2004-10-05 2004-10-05 Method and system for dynamically selecting wafer lots for metrology processing
PCT/US2005/022191 WO2006041542A2 (en) 2004-10-05 2005-06-23 Method and system for dynamically controlling metrology work in progress

Publications (2)

Publication Number Publication Date
JP2008523458A true JP2008523458A (ja) 2008-07-03
JP2008523458A5 JP2008523458A5 (enExample) 2008-08-14

Family

ID=35311834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007535668A Pending JP2008523458A (ja) 2004-10-05 2005-06-23 処理中のメトロロジー作業を動的に制御する方法およびシステム

Country Status (7)

Country Link
US (1) US7296103B1 (enExample)
EP (1) EP1797486A2 (enExample)
JP (1) JP2008523458A (enExample)
KR (1) KR101129715B1 (enExample)
CN (1) CN101036092B (enExample)
TW (1) TWI374345B (enExample)
WO (1) WO2006041542A2 (enExample)

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JP2019153768A (ja) * 2018-03-01 2019-09-12 ヴェリティー インストルメンツ，インコーポレイテッド 適応型−モジュール型光学センサに基づくプロセス制御システム及びその動作の方法

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CN105470156B (zh) * 2014-09-09 2018-09-04 中芯国际集成电路制造(上海)有限公司 一种基于rtd的量测工艺
US10295979B2 (en) * 2015-09-15 2019-05-21 Applied Materials, Inc. Scheduling in manufacturing environments
US11887862B2 (en) * 2021-09-14 2024-01-30 Deca Technologies Usa, Inc. Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL
US12362322B2 (en) 2023-06-22 2025-07-15 Deca Technologies Usa, Inc. Method of making a fan-out semiconductor assembly with an intermediate carrier

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
JP2019153768A (ja) * 2018-03-01 2019-09-12 ヴェリティー インストルメンツ，インコーポレイテッド 適応型−モジュール型光学センサに基づくプロセス制御システム及びその動作の方法

Also Published As

Publication number Publication date
CN101036092A (zh) 2007-09-12
TW200627105A (en) 2006-08-01
EP1797486A2 (en) 2007-06-20
US7296103B1 (en) 2007-11-13
CN101036092B (zh) 2010-11-03
WO2006041542A3 (en) 2006-06-01
KR101129715B1 (ko) 2012-03-28
WO2006041542A2 (en) 2006-04-20
KR20070051939A (ko) 2007-05-18
TWI374345B (en) 2012-10-11

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