KR101127000B1 - 전자 재료용 구리 합금 및 그 제조 방법 - Google Patents

전자 재료용 구리 합금 및 그 제조 방법 Download PDF

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Publication number
KR101127000B1
KR101127000B1 KR1020097006854A KR20097006854A KR101127000B1 KR 101127000 B1 KR101127000 B1 KR 101127000B1 KR 1020097006854 A KR1020097006854 A KR 1020097006854A KR 20097006854 A KR20097006854 A KR 20097006854A KR 101127000 B1 KR101127000 B1 KR 101127000B1
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KR
South Korea
Prior art keywords
mass
copper alloy
electrical conductivity
strength
less
Prior art date
Application number
KR1020097006854A
Other languages
English (en)
Korean (ko)
Other versions
KR20090050101A (ko
Inventor
히로시 구와가키
나오히코 에라
Original Assignee
제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
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Application filed by 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 filed Critical 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
Publication of KR20090050101A publication Critical patent/KR20090050101A/ko
Application granted granted Critical
Publication of KR101127000B1 publication Critical patent/KR101127000B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
KR1020097006854A 2006-10-03 2007-10-02 전자 재료용 구리 합금 및 그 제조 방법 KR101127000B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2006-271770 2006-10-03
JP2006271770A JP5085908B2 (ja) 2006-10-03 2006-10-03 電子材料用銅合金及びその製造方法
PCT/JP2007/069269 WO2008041696A1 (fr) 2006-10-03 2007-10-02 Procédé de fabrication d'un alliage de cuivre pour un matériau électronique

Publications (2)

Publication Number Publication Date
KR20090050101A KR20090050101A (ko) 2009-05-19
KR101127000B1 true KR101127000B1 (ko) 2012-04-12

Family

ID=39268550

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097006854A KR101127000B1 (ko) 2006-10-03 2007-10-02 전자 재료용 구리 합금 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JP5085908B2 (fr)
KR (1) KR101127000B1 (fr)
CN (1) CN101522927B (fr)
TW (1) TWI415958B (fr)
WO (1) WO2008041696A1 (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5006405B2 (ja) * 2007-11-01 2012-08-22 古河電気工業株式会社 電子機器用導体線材およびそれを用いた配線用電線
EP2267172A1 (fr) * 2008-03-21 2010-12-29 The Furukawa Electric Co., Ltd. Matériau d'alliage du cuivre pour composants électriques et électroniques
CN102112639A (zh) 2008-07-31 2011-06-29 古河电气工业株式会社 用于电气电子部件的铜合金材料及其制造方法
EP2333127A4 (fr) * 2008-08-05 2012-07-04 Furukawa Electric Co Ltd Matière d'alliage de cuivre pour un composant électrique/électronique
WO2010016429A1 (fr) 2008-08-05 2010-02-11 古河電気工業株式会社 Matière d'alliage de cuivre pour un composant électrique/électronique
JP5619389B2 (ja) * 2008-08-05 2014-11-05 古河電気工業株式会社 銅合金材料
JP4708485B2 (ja) * 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP5619391B2 (ja) * 2009-08-12 2014-11-05 古河電気工業株式会社 銅合金材およびその製造方法
JP4934759B2 (ja) * 2009-12-02 2012-05-16 古河電気工業株式会社 銅合金板材及びこれを用いたコネクタ並びに銅合金板材の製造方法
JP4620173B1 (ja) 2010-03-30 2011-01-26 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ合金材
JP4830035B2 (ja) * 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系合金及びその製造方法
JP4708497B1 (ja) * 2010-06-03 2011-06-22 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法
JP2012144789A (ja) * 2011-01-13 2012-08-02 Jx Nippon Mining & Metals Corp Ｃｕ−Ｃｏ−Ｓｉ−Ｚｒ合金材
JP4857395B1 (ja) * 2011-03-09 2012-01-18 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP5451674B2 (ja) * 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP6077755B2 (ja) * 2012-03-30 2017-02-08 Ｊｘ金属株式会社 Ｃｕ−Ｚｎ−Ｓｎ−Ｎｉ−Ｐ系合金及びその製造方法
CN105400984A (zh) * 2015-11-13 2016-03-16 太仓荣中机电科技有限公司 一种性能均衡的电子合金材料
JP6600401B1 (ja) * 2018-10-11 2019-10-30 三芳合金工業株式会社 時効硬化型銅合金の製造方法
KR102005332B1 (ko) * 2019-04-09 2019-10-01 주식회사 풍산 굽힘가공성이 우수한 Cu-Co-Si-Fe-P계 구리 합금 및 그 제조 방법
JP7215735B2 (ja) * 2019-10-03 2023-01-31 三芳合金工業株式会社 時効硬化型銅合金

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02277735A (ja) * 1989-04-20 1990-11-14 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金
JP2514926B2 (ja) 1986-02-04 1996-07-10 古河電気工業株式会社 はんだ接合強度に優れた電子機器用銅合金とその製造法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4260435A (en) * 1979-07-02 1981-04-07 Ampco-Pittsburgh Corporation Copper-nickel-silicon-chromium alloy having improved electrical conductivity
KR950004935B1 (ko) * 1986-09-30 1995-05-16 후루까와 덴끼 고교 가부시끼가이샤 전자 기기용 구리 합금
JPS63307232A (ja) * 1987-06-04 1988-12-14 Sumitomo Metal Mining Co Ltd 銅合金

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2514926B2 (ja) 1986-02-04 1996-07-10 古河電気工業株式会社 はんだ接合強度に優れた電子機器用銅合金とその製造法
JPH02277735A (ja) * 1989-04-20 1990-11-14 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金

Also Published As

Publication number Publication date
CN101522927A (zh) 2009-09-02
TWI415958B (zh) 2013-11-21
JP5085908B2 (ja) 2012-11-28
CN101522927B (zh) 2011-01-12
TW200823303A (en) 2008-06-01
WO2008041696A1 (fr) 2008-04-10
KR20090050101A (ko) 2009-05-19
JP2008088512A (ja) 2008-04-17

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