KR101108767B1 - 다관절 로봇 및 배선 방법 - Google Patents

다관절 로봇 및 배선 방법 Download PDF

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Publication number
KR101108767B1
KR101108767B1 KR1020087023056A KR20087023056A KR101108767B1 KR 101108767 B1 KR101108767 B1 KR 101108767B1 KR 1020087023056 A KR1020087023056 A KR 1020087023056A KR 20087023056 A KR20087023056 A KR 20087023056A KR 101108767 B1 KR101108767 B1 KR 101108767B1
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KR
South Korea
Prior art keywords
joint
cable
arm
core cable
connection hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020087023056A
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English (en)
Korean (ko)
Other versions
KR20080102223A (ko
Inventor
사토시 스에요시
켄타로 타나카
토모히로 마츠오
Original Assignee
가부시키가이샤 야스카와덴키
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 야스카와덴키 filed Critical 가부시키가이샤 야스카와덴키
Publication of KR20080102223A publication Critical patent/KR20080102223A/ko
Application granted granted Critical
Publication of KR101108767B1 publication Critical patent/KR101108767B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0025—Means for supplying energy to the end effector
    • B25J19/0029—Means for supplying energy to the end effector arranged within the different robot elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
KR1020087023056A 2006-07-11 2007-06-15 다관절 로봇 및 배선 방법 Expired - Fee Related KR101108767B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006190823 2006-07-11
JPJP-P-2006-00190823 2006-07-11
PCT/JP2007/062156 WO2008007517A1 (fr) 2006-07-11 2007-06-15 Robot à articulations multiples et procédé de câblage

Publications (2)

Publication Number Publication Date
KR20080102223A KR20080102223A (ko) 2008-11-24
KR101108767B1 true KR101108767B1 (ko) 2012-03-13

Family

ID=38923082

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087023056A Expired - Fee Related KR101108767B1 (ko) 2006-07-11 2007-06-15 다관절 로봇 및 배선 방법

Country Status (5)

Country Link
JP (1) JP4911371B2 (enrdf_load_stackoverflow)
KR (1) KR101108767B1 (enrdf_load_stackoverflow)
CN (1) CN101484281B (enrdf_load_stackoverflow)
TW (1) TW200817150A (enrdf_load_stackoverflow)
WO (1) WO2008007517A1 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101120824B1 (ko) * 2006-07-11 2012-03-23 가부시키가이샤 야스카와덴키 다관절 로봇
JP2010064219A (ja) * 2008-09-12 2010-03-25 Yaskawa Electric Corp 多関節ロボット
JP5263945B2 (ja) * 2008-09-17 2013-08-14 株式会社レクザム ダブルアーム型ロボット
CN104470688B (zh) * 2012-07-13 2016-09-14 Abb技术有限公司 用于机器人的结构
CN103802131A (zh) * 2012-11-08 2014-05-21 沈阳新松机器人自动化股份有限公司 堆垛机手臂结构及其走线布置方法
JP6108859B2 (ja) * 2013-02-13 2017-04-05 日本電産サンキョー株式会社 産業用ロボット

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5639890A (en) * 1979-09-04 1981-04-15 Meidensha Electric Mfg Co Ltd Joint in manipulator*etc*

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258188U (enrdf_load_stackoverflow) * 1985-09-27 1987-04-10
JP2559807B2 (ja) * 1988-06-01 1996-12-04 ファナック株式会社 産業用ロボットの関節部におけるケーブル処理装置
JPH04269193A (ja) * 1991-02-19 1992-09-25 Canon Inc 産業用ロボツト
JP3973006B2 (ja) * 2000-03-23 2007-09-05 日本電産サンキョー株式会社 ダブルアーム型ロボット
JP2002079487A (ja) * 2000-09-05 2002-03-19 Nachi Fujikoshi Corp 産業用ロボットの手首装置
JP2007015053A (ja) * 2005-07-07 2007-01-25 Fanuc Ltd 産業用ロボット

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5639890A (en) * 1979-09-04 1981-04-15 Meidensha Electric Mfg Co Ltd Joint in manipulator*etc*

Also Published As

Publication number Publication date
JP4911371B2 (ja) 2012-04-04
TW200817150A (en) 2008-04-16
CN101484281B (zh) 2011-10-26
JPWO2008007517A1 (ja) 2009-12-10
WO2008007517A1 (fr) 2008-01-17
KR20080102223A (ko) 2008-11-24
TWI329558B (enrdf_load_stackoverflow) 2010-09-01
CN101484281A (zh) 2009-07-15

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