TW200817150A - Multi-joint robot and wiring method - Google Patents
Multi-joint robot and wiring method Download PDFInfo
- Publication number
- TW200817150A TW200817150A TW96124500A TW96124500A TW200817150A TW 200817150 A TW200817150 A TW 200817150A TW 96124500 A TW96124500 A TW 96124500A TW 96124500 A TW96124500 A TW 96124500A TW 200817150 A TW200817150 A TW 200817150A
- Authority
- TW
- Taiwan
- Prior art keywords
- joint
- core cable
- hand
- cable
- wiring
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 14
- 210000000707 wrist Anatomy 0.000 claims description 33
- 239000000758 substrate Substances 0.000 abstract description 11
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 239000011521 glass Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 abstract description 3
- 210000000323 shoulder joint Anatomy 0.000 description 8
- 210000002310 elbow joint Anatomy 0.000 description 5
- 210000002478 hand joint Anatomy 0.000 description 5
- 210000001503 joint Anatomy 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0025—Means for supplying energy to the end effector
- B25J19/0029—Means for supplying energy to the end effector arranged within the different robot elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006190823 | 2006-07-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200817150A true TW200817150A (en) | 2008-04-16 |
| TWI329558B TWI329558B (enrdf_load_stackoverflow) | 2010-09-01 |
Family
ID=38923082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96124500A TW200817150A (en) | 2006-07-11 | 2007-07-05 | Multi-joint robot and wiring method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4911371B2 (enrdf_load_stackoverflow) |
| KR (1) | KR101108767B1 (enrdf_load_stackoverflow) |
| CN (1) | CN101484281B (enrdf_load_stackoverflow) |
| TW (1) | TW200817150A (enrdf_load_stackoverflow) |
| WO (1) | WO2008007517A1 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100914387B1 (ko) * | 2006-07-11 | 2009-08-28 | 가부시키가이샤 야스카와덴키 | 다관절 로봇 |
| JP2010064219A (ja) * | 2008-09-12 | 2010-03-25 | Yaskawa Electric Corp | 多関節ロボット |
| JP5263945B2 (ja) * | 2008-09-17 | 2013-08-14 | 株式会社レクザム | ダブルアーム型ロボット |
| ES2621490T3 (es) * | 2012-07-13 | 2017-07-04 | Abb Schweiz Ag | Estructura utilizada para un robot |
| CN103802131A (zh) * | 2012-11-08 | 2014-05-21 | 沈阳新松机器人自动化股份有限公司 | 堆垛机手臂结构及其走线布置方法 |
| JP6108859B2 (ja) * | 2013-02-13 | 2017-04-05 | 日本電産サンキョー株式会社 | 産業用ロボット |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5837117B2 (ja) * | 1979-09-04 | 1983-08-13 | 株式会社明電舎 | マニピユレ−タ等における関節 |
| JPS6258188U (enrdf_load_stackoverflow) * | 1985-09-27 | 1987-04-10 | ||
| JP2559807B2 (ja) * | 1988-06-01 | 1996-12-04 | ファナック株式会社 | 産業用ロボットの関節部におけるケーブル処理装置 |
| JPH04269193A (ja) | 1991-02-19 | 1992-09-25 | Canon Inc | 産業用ロボツト |
| JP3973006B2 (ja) * | 2000-03-23 | 2007-09-05 | 日本電産サンキョー株式会社 | ダブルアーム型ロボット |
| JP2002079487A (ja) * | 2000-09-05 | 2002-03-19 | Nachi Fujikoshi Corp | 産業用ロボットの手首装置 |
| JP2007015053A (ja) * | 2005-07-07 | 2007-01-25 | Fanuc Ltd | 産業用ロボット |
-
2007
- 2007-06-15 KR KR1020087023056A patent/KR101108767B1/ko not_active Expired - Fee Related
- 2007-06-15 JP JP2008524741A patent/JP4911371B2/ja not_active Expired - Fee Related
- 2007-06-15 WO PCT/JP2007/062156 patent/WO2008007517A1/ja active Application Filing
- 2007-06-15 CN CN2007800255988A patent/CN101484281B/zh not_active Expired - Fee Related
- 2007-07-05 TW TW96124500A patent/TW200817150A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP4911371B2 (ja) | 2012-04-04 |
| TWI329558B (enrdf_load_stackoverflow) | 2010-09-01 |
| KR20080102223A (ko) | 2008-11-24 |
| JPWO2008007517A1 (ja) | 2009-12-10 |
| WO2008007517A1 (fr) | 2008-01-17 |
| KR101108767B1 (ko) | 2012-03-13 |
| CN101484281B (zh) | 2011-10-26 |
| CN101484281A (zh) | 2009-07-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |