JP4911371B2 - 多関節ロボットおよび配線方法 - Google Patents

多関節ロボットおよび配線方法 Download PDF

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Publication number
JP4911371B2
JP4911371B2 JP2008524741A JP2008524741A JP4911371B2 JP 4911371 B2 JP4911371 B2 JP 4911371B2 JP 2008524741 A JP2008524741 A JP 2008524741A JP 2008524741 A JP2008524741 A JP 2008524741A JP 4911371 B2 JP4911371 B2 JP 4911371B2
Authority
JP
Japan
Prior art keywords
core cable
joint
cable
connection hole
hollow connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008524741A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2008007517A1 (ja
Inventor
智 末吉
謙太郎 田中
智弘 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Priority to JP2008524741A priority Critical patent/JP4911371B2/ja
Publication of JPWO2008007517A1 publication Critical patent/JPWO2008007517A1/ja
Application granted granted Critical
Publication of JP4911371B2 publication Critical patent/JP4911371B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0025—Means for supplying energy to the end effector
    • B25J19/0029—Means for supplying energy to the end effector arranged within the different robot elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
JP2008524741A 2006-07-11 2007-06-15 多関節ロボットおよび配線方法 Expired - Fee Related JP4911371B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008524741A JP4911371B2 (ja) 2006-07-11 2007-06-15 多関節ロボットおよび配線方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006190823 2006-07-11
JP2006190823 2006-07-11
PCT/JP2007/062156 WO2008007517A1 (fr) 2006-07-11 2007-06-15 Robot à articulations multiples et procédé de câblage
JP2008524741A JP4911371B2 (ja) 2006-07-11 2007-06-15 多関節ロボットおよび配線方法

Publications (2)

Publication Number Publication Date
JPWO2008007517A1 JPWO2008007517A1 (ja) 2009-12-10
JP4911371B2 true JP4911371B2 (ja) 2012-04-04

Family

ID=38923082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008524741A Expired - Fee Related JP4911371B2 (ja) 2006-07-11 2007-06-15 多関節ロボットおよび配線方法

Country Status (5)

Country Link
JP (1) JP4911371B2 (enrdf_load_stackoverflow)
KR (1) KR101108767B1 (enrdf_load_stackoverflow)
CN (1) CN101484281B (enrdf_load_stackoverflow)
TW (1) TW200817150A (enrdf_load_stackoverflow)
WO (1) WO2008007517A1 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100914387B1 (ko) * 2006-07-11 2009-08-28 가부시키가이샤 야스카와덴키 다관절 로봇
JP2010064219A (ja) * 2008-09-12 2010-03-25 Yaskawa Electric Corp 多関節ロボット
JP5263945B2 (ja) * 2008-09-17 2013-08-14 株式会社レクザム ダブルアーム型ロボット
ES2621490T3 (es) * 2012-07-13 2017-07-04 Abb Schweiz Ag Estructura utilizada para un robot
CN103802131A (zh) * 2012-11-08 2014-05-21 沈阳新松机器人自动化股份有限公司 堆垛机手臂结构及其走线布置方法
JP6108859B2 (ja) * 2013-02-13 2017-04-05 日本電産サンキョー株式会社 産業用ロボット

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837117B2 (ja) * 1979-09-04 1983-08-13 株式会社明電舎 マニピユレ−タ等における関節
JPS6258188U (enrdf_load_stackoverflow) * 1985-09-27 1987-04-10
JP2559807B2 (ja) * 1988-06-01 1996-12-04 ファナック株式会社 産業用ロボットの関節部におけるケーブル処理装置
JPH04269193A (ja) 1991-02-19 1992-09-25 Canon Inc 産業用ロボツト
JP3973006B2 (ja) * 2000-03-23 2007-09-05 日本電産サンキョー株式会社 ダブルアーム型ロボット
JP2002079487A (ja) * 2000-09-05 2002-03-19 Nachi Fujikoshi Corp 産業用ロボットの手首装置
JP2007015053A (ja) * 2005-07-07 2007-01-25 Fanuc Ltd 産業用ロボット

Also Published As

Publication number Publication date
TW200817150A (en) 2008-04-16
TWI329558B (enrdf_load_stackoverflow) 2010-09-01
KR20080102223A (ko) 2008-11-24
JPWO2008007517A1 (ja) 2009-12-10
WO2008007517A1 (fr) 2008-01-17
KR101108767B1 (ko) 2012-03-13
CN101484281B (zh) 2011-10-26
CN101484281A (zh) 2009-07-15

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