KR101100514B1 - 레이저가공기 - Google Patents

레이저가공기 Download PDF

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Publication number
KR101100514B1
KR101100514B1 KR1020050004025A KR20050004025A KR101100514B1 KR 101100514 B1 KR101100514 B1 KR 101100514B1 KR 1020050004025 A KR1020050004025 A KR 1020050004025A KR 20050004025 A KR20050004025 A KR 20050004025A KR 101100514 B1 KR101100514 B1 KR 101100514B1
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KR
South Korea
Prior art keywords
optical axis
laser
mirror
positioning device
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020050004025A
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English (en)
Korean (ko)
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KR20050076624A (ko
Inventor
이시이가즈히사
와타나베후미오
Original Assignee
히다치 비아 메카닉스 가부시키가이샤
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Publication of KR20050076624A publication Critical patent/KR20050076624A/ko
Application granted granted Critical
Publication of KR101100514B1 publication Critical patent/KR101100514B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
    • A45C11/002—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 for storing portable handheld communication devices, e.g. pagers or smart phones

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Laser Surgery Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020050004025A 2004-01-20 2005-01-17 레이저가공기 Expired - Lifetime KR101100514B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00012425 2004-01-20
JP2004012425A JP4184288B2 (ja) 2004-01-20 2004-01-20 レーザ加工機

Publications (2)

Publication Number Publication Date
KR20050076624A KR20050076624A (ko) 2005-07-26
KR101100514B1 true KR101100514B1 (ko) 2011-12-29

Family

ID=34792379

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050004025A Expired - Lifetime KR101100514B1 (ko) 2004-01-20 2005-01-17 레이저가공기

Country Status (5)

Country Link
US (1) US7473867B2 (enExample)
JP (1) JP4184288B2 (enExample)
KR (1) KR101100514B1 (enExample)
CN (1) CN1644296B (enExample)
TW (1) TWI331061B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240156804A (ko) 2023-04-24 2024-10-31 한국기계연구원 선택적으로 용접 및 절단 가공이 가능한 복합 레이저 가공 장치 및 이에 의한 가공 방법

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101104223B (zh) * 2006-07-10 2012-05-23 彩霸阳光株式会社 激光加工装置
JP4917382B2 (ja) * 2006-08-09 2012-04-18 株式会社ディスコ レーザー光線照射装置およびレーザー加工機
JP5137488B2 (ja) * 2007-07-25 2013-02-06 オリンパス株式会社 レーザ照射装置およびそれを用いたレーザ加工システム
JP4401410B2 (ja) * 2007-11-21 2010-01-20 三菱電機株式会社 レーザ加工装置
JP5011072B2 (ja) * 2007-11-21 2012-08-29 株式会社ディスコ レーザー加工装置
CN103212788A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 激光切割折转光路与聚焦镜自准直系统
JP5964604B2 (ja) * 2012-02-09 2016-08-03 株式会社ディスコ レーザー加工装置
JP5931537B2 (ja) * 2012-03-28 2016-06-08 東レエンジニアリング株式会社 レーザの光軸アライメント方法およびそれを用いたレーザ加工装置
CN104180969B (zh) * 2013-05-22 2017-05-31 上海微电子装备有限公司 灯室光锥的检测装置及其检测方法
TWI621497B (zh) * 2013-05-27 2018-04-21 Nippon Sharyo Ltd Laser processing machine
DE102014200633B3 (de) * 2014-01-15 2015-05-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bearbeitungsvorrichtung und -verfahren zur Laserbearbeitung einer Oberfläche
JP6521870B2 (ja) * 2014-02-10 2019-05-29 ギガフォトン株式会社 レーザ装置
JP2015182104A (ja) * 2014-03-24 2015-10-22 ファナック株式会社 レーザ光の伝播監視機能を備えたレーザ加工機
JP7270169B2 (ja) * 2018-05-15 2023-05-10 パナソニックＩｐマネジメント株式会社 レーザ装置及びそれを用いたレーザ加工装置
US11285670B2 (en) * 2018-08-27 2022-03-29 The Boeing Company Laser fabrication additive system and method
CN109877446B (zh) * 2018-12-21 2020-07-31 中国科学院西安光学精密机械研究所 一种激光光束的指向精度检测调节方法
JP6697108B2 (ja) * 2019-04-22 2020-05-20 ギガフォトン株式会社 レーザ装置及び極端紫外光生成システム
CN112705838B (zh) * 2019-10-09 2025-09-16 Nps株式会社 激光装置
JP7535687B2 (ja) * 2020-01-15 2024-08-19 パナソニックＩｐマネジメント株式会社 レーザ装置及びそれを用いたレーザ加工装置
JP7599776B2 (ja) * 2020-10-02 2024-12-16 株式会社ディスコ 被加工物の加工方法
JP7517241B2 (ja) 2021-04-23 2024-07-17 株式会社デンソー レーザ光軸調整方法
CN115016096A (zh) * 2022-07-06 2022-09-06 中国航空制造技术研究院 一种多级反射光路自动对准装置及方法
CN116623144A (zh) * 2023-04-06 2023-08-22 无锡翔域半导体有限公司 一种用于铝离子注入机的激光预热装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63194886A (ja) * 1987-02-06 1988-08-12 Nikon Corp レ−ザ光軸検出装置
JP2003236693A (ja) * 2001-11-30 2003-08-26 Technifor Sa レーザビームを用いて部品を機械加工するための装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4710604A (en) * 1985-12-20 1987-12-01 Nippon Kogaku K. K. Machining apparatus with laser beam
US5172356A (en) * 1990-06-07 1992-12-15 Ricoh Company, Ltd. Separation type optical pickup device
JPH05228673A (ja) 1992-02-18 1993-09-07 Toshiba Corp レ−ザ−加工装置
US5536916A (en) * 1994-09-30 1996-07-16 Sanyo Machine Works, Ltd. Method for performing automatic alignment-adjustment of laser robot and the device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63194886A (ja) * 1987-02-06 1988-08-12 Nikon Corp レ−ザ光軸検出装置
JP2003236693A (ja) * 2001-11-30 2003-08-26 Technifor Sa レーザビームを用いて部品を機械加工するための装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240156804A (ko) 2023-04-24 2024-10-31 한국기계연구원 선택적으로 용접 및 절단 가공이 가능한 복합 레이저 가공 장치 및 이에 의한 가공 방법

Also Published As

Publication number Publication date
HK1077250A1 (en) 2006-02-10
JP4184288B2 (ja) 2008-11-19
US20050161445A1 (en) 2005-07-28
KR20050076624A (ko) 2005-07-26
US7473867B2 (en) 2009-01-06
TWI331061B (en) 2010-10-01
CN1644296B (zh) 2011-06-15
TW200533453A (en) 2005-10-16
CN1644296A (zh) 2005-07-27
JP2005205429A (ja) 2005-08-04

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