CN1644296B - 激光加工设备 - Google Patents
激光加工设备 Download PDFInfo
- Publication number
- CN1644296B CN1644296B CN2005100018646A CN200510001864A CN1644296B CN 1644296 B CN1644296 B CN 1644296B CN 2005100018646 A CN2005100018646 A CN 2005100018646A CN 200510001864 A CN200510001864 A CN 200510001864A CN 1644296 B CN1644296 B CN 1644296B
- Authority
- CN
- China
- Prior art keywords
- optical axis
- laser beam
- laser
- mirror
- mirrors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
-
- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
- A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
-
- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
- A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
- A45C11/002—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 for storing portable handheld communication devices, e.g. pagers or smart phones
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Laser Surgery Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP012425/2004 | 2004-01-20 | ||
| JP2004012425A JP4184288B2 (ja) | 2004-01-20 | 2004-01-20 | レーザ加工機 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1644296A CN1644296A (zh) | 2005-07-27 |
| CN1644296B true CN1644296B (zh) | 2011-06-15 |
Family
ID=34792379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005100018646A Expired - Lifetime CN1644296B (zh) | 2004-01-20 | 2005-01-18 | 激光加工设备 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7473867B2 (enExample) |
| JP (1) | JP4184288B2 (enExample) |
| KR (1) | KR101100514B1 (enExample) |
| CN (1) | CN1644296B (enExample) |
| TW (1) | TWI331061B (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101104223B (zh) * | 2006-07-10 | 2012-05-23 | 彩霸阳光株式会社 | 激光加工装置 |
| JP4917382B2 (ja) * | 2006-08-09 | 2012-04-18 | 株式会社ディスコ | レーザー光線照射装置およびレーザー加工機 |
| JP5137488B2 (ja) * | 2007-07-25 | 2013-02-06 | オリンパス株式会社 | レーザ照射装置およびそれを用いたレーザ加工システム |
| JP4401410B2 (ja) * | 2007-11-21 | 2010-01-20 | 三菱電機株式会社 | レーザ加工装置 |
| JP5011072B2 (ja) * | 2007-11-21 | 2012-08-29 | 株式会社ディスコ | レーザー加工装置 |
| CN103212788A (zh) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | 激光切割折转光路与聚焦镜自准直系统 |
| JP5964604B2 (ja) * | 2012-02-09 | 2016-08-03 | 株式会社ディスコ | レーザー加工装置 |
| JP5931537B2 (ja) * | 2012-03-28 | 2016-06-08 | 東レエンジニアリング株式会社 | レーザの光軸アライメント方法およびそれを用いたレーザ加工装置 |
| CN104180969B (zh) * | 2013-05-22 | 2017-05-31 | 上海微电子装备有限公司 | 灯室光锥的检测装置及其检测方法 |
| TWI621497B (zh) * | 2013-05-27 | 2018-04-21 | Nippon Sharyo Ltd | Laser processing machine |
| DE102014200633B3 (de) * | 2014-01-15 | 2015-05-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Bearbeitungsvorrichtung und -verfahren zur Laserbearbeitung einer Oberfläche |
| JP6521870B2 (ja) * | 2014-02-10 | 2019-05-29 | ギガフォトン株式会社 | レーザ装置 |
| JP2015182104A (ja) * | 2014-03-24 | 2015-10-22 | ファナック株式会社 | レーザ光の伝播監視機能を備えたレーザ加工機 |
| JP7270169B2 (ja) * | 2018-05-15 | 2023-05-10 | パナソニックIpマネジメント株式会社 | レーザ装置及びそれを用いたレーザ加工装置 |
| US11285670B2 (en) * | 2018-08-27 | 2022-03-29 | The Boeing Company | Laser fabrication additive system and method |
| CN109877446B (zh) * | 2018-12-21 | 2020-07-31 | 中国科学院西安光学精密机械研究所 | 一种激光光束的指向精度检测调节方法 |
| JP6697108B2 (ja) * | 2019-04-22 | 2020-05-20 | ギガフォトン株式会社 | レーザ装置及び極端紫外光生成システム |
| CN112705838B (zh) * | 2019-10-09 | 2025-09-16 | Nps株式会社 | 激光装置 |
| JP7535687B2 (ja) * | 2020-01-15 | 2024-08-19 | パナソニックIpマネジメント株式会社 | レーザ装置及びそれを用いたレーザ加工装置 |
| JP7599776B2 (ja) * | 2020-10-02 | 2024-12-16 | 株式会社ディスコ | 被加工物の加工方法 |
| JP7517241B2 (ja) | 2021-04-23 | 2024-07-17 | 株式会社デンソー | レーザ光軸調整方法 |
| CN115016096A (zh) * | 2022-07-06 | 2022-09-06 | 中国航空制造技术研究院 | 一种多级反射光路自动对准装置及方法 |
| CN116623144A (zh) * | 2023-04-06 | 2023-08-22 | 无锡翔域半导体有限公司 | 一种用于铝离子注入机的激光预热装置 |
| KR102810526B1 (ko) | 2023-04-24 | 2025-05-23 | 한국기계연구원 | 선택적으로 용접 및 절단 가공이 가능한 복합 레이저 가공 장치 및 이에 의한 가공 방법 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4710604A (en) * | 1985-12-20 | 1987-12-01 | Nippon Kogaku K. K. | Machining apparatus with laser beam |
| US5172356A (en) * | 1990-06-07 | 1992-12-15 | Ricoh Company, Ltd. | Separation type optical pickup device |
| US5536916A (en) * | 1994-09-30 | 1996-07-16 | Sanyo Machine Works, Ltd. | Method for performing automatic alignment-adjustment of laser robot and the device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2716121B2 (ja) * | 1987-02-06 | 1998-02-18 | 株式会社ニコン | レーザ光軸検出装置 |
| JPH05228673A (ja) | 1992-02-18 | 1993-09-07 | Toshiba Corp | レ−ザ−加工装置 |
| FR2832945A1 (fr) * | 2001-11-30 | 2003-06-06 | Technifor | Dispositif d'usinage de pieces a l'aide d'un faisceau laser |
-
2004
- 2004-01-20 JP JP2004012425A patent/JP4184288B2/ja not_active Expired - Lifetime
-
2005
- 2005-01-14 TW TW094101133A patent/TWI331061B/zh not_active IP Right Cessation
- 2005-01-17 KR KR1020050004025A patent/KR101100514B1/ko not_active Expired - Lifetime
- 2005-01-18 CN CN2005100018646A patent/CN1644296B/zh not_active Expired - Lifetime
- 2005-01-19 US US11/037,222 patent/US7473867B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4710604A (en) * | 1985-12-20 | 1987-12-01 | Nippon Kogaku K. K. | Machining apparatus with laser beam |
| US5172356A (en) * | 1990-06-07 | 1992-12-15 | Ricoh Company, Ltd. | Separation type optical pickup device |
| US5536916A (en) * | 1994-09-30 | 1996-07-16 | Sanyo Machine Works, Ltd. | Method for performing automatic alignment-adjustment of laser robot and the device |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1077250A1 (en) | 2006-02-10 |
| JP4184288B2 (ja) | 2008-11-19 |
| US20050161445A1 (en) | 2005-07-28 |
| KR20050076624A (ko) | 2005-07-26 |
| US7473867B2 (en) | 2009-01-06 |
| TWI331061B (en) | 2010-10-01 |
| TW200533453A (en) | 2005-10-16 |
| CN1644296A (zh) | 2005-07-27 |
| KR101100514B1 (ko) | 2011-12-29 |
| JP2005205429A (ja) | 2005-08-04 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1077250 Country of ref document: HK |
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Ref country code: HK Ref legal event code: GR Ref document number: 1077250 Country of ref document: HK |
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| C56 | Change in the name or address of the patentee |
Owner name: VIA MECHANICS LTD. Free format text: FORMER NAME: HITACHI BIA MACINE CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Patentee after: Via Mechanics, Ltd. Address before: Kanagawa Patentee before: HITACHI VIA MECHANICS, Ltd. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110615 |