KR101088568B1 - 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼 - Google Patents
갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼 Download PDFInfo
- Publication number
- KR101088568B1 KR101088568B1 KR1020050039700A KR20050039700A KR101088568B1 KR 101088568 B1 KR101088568 B1 KR 101088568B1 KR 1020050039700 A KR1020050039700 A KR 1020050039700A KR 20050039700 A KR20050039700 A KR 20050039700A KR 101088568 B1 KR101088568 B1 KR 101088568B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- composition
- component
- organic solvent
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3723—Polyamines or polyalkyleneimines
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Laminated Bodies (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Golf Clubs (AREA)
- Pens And Brushes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US67292305P | 2005-04-19 | 2005-04-19 | |
| US60/672,923 | 2005-04-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060110712A KR20060110712A (ko) | 2006-10-25 |
| KR101088568B1 true KR101088568B1 (ko) | 2011-12-05 |
Family
ID=36754183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050039700A Expired - Lifetime KR101088568B1 (ko) | 2005-04-19 | 2005-05-12 | 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼 |
Country Status (20)
| Country | Link |
|---|---|
| US (1) | US20080280235A1 (enExample) |
| EP (1) | EP1877870B1 (enExample) |
| JP (1) | JP4677030B2 (enExample) |
| KR (1) | KR101088568B1 (enExample) |
| CN (1) | CN101164016B (enExample) |
| AT (1) | ATE498859T1 (enExample) |
| BR (1) | BRPI0610852A2 (enExample) |
| CA (1) | CA2605236A1 (enExample) |
| DE (1) | DE602006020125D1 (enExample) |
| DK (1) | DK1877870T3 (enExample) |
| ES (1) | ES2361271T3 (enExample) |
| IL (1) | IL186565A0 (enExample) |
| MY (1) | MY145299A (enExample) |
| NO (1) | NO20075935L (enExample) |
| PL (1) | PL1877870T3 (enExample) |
| PT (1) | PT1877870E (enExample) |
| SG (1) | SG161273A1 (enExample) |
| TW (1) | TW200700549A (enExample) |
| WO (1) | WO2006112994A1 (enExample) |
| ZA (1) | ZA200706296B (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5236217B2 (ja) * | 2006-06-22 | 2013-07-17 | 東進セミケム株式会社 | レジスト除去用組成物 |
| US7851655B2 (en) * | 2006-12-19 | 2010-12-14 | Nalco Company | Functionalized amine-based corrosion inhibitors for galvanized metal surfaces and method of using same |
| EP2268765A4 (en) * | 2008-03-07 | 2011-10-26 | Advanced Tech Materials | UNSELECTIVE OXIDIZE WET CLEANING AGENT AND USE |
| JP4903242B2 (ja) * | 2008-10-28 | 2012-03-28 | アバントール パフォーマンス マテリアルズ, インコーポレイテッド | 多金属デバイス処理のためのグルコン酸含有フォトレジスト洗浄組成物 |
| US8110535B2 (en) * | 2009-08-05 | 2012-02-07 | Air Products And Chemicals, Inc. | Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same |
| US8518865B2 (en) * | 2009-08-31 | 2013-08-27 | Air Products And Chemicals, Inc. | Water-rich stripping and cleaning formulation and method for using same |
| WO2013118013A1 (en) * | 2012-02-06 | 2013-08-15 | Basf Se | A post chemical-mechanical-polishing (post-cmp) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acid |
| CN103389627A (zh) * | 2012-05-11 | 2013-11-13 | 安集微电子科技(上海)有限公司 | 一种光刻胶清洗液 |
| US11168288B2 (en) * | 2018-02-14 | 2021-11-09 | Merck Patent Gmbh | Photoresist remover compositions |
| JP7176089B2 (ja) | 2018-07-20 | 2022-11-21 | インテグリス・インコーポレーテッド | 腐食防止剤を含む洗浄組成物 |
| CN109557774A (zh) * | 2019-01-22 | 2019-04-02 | 上海华虹宏力半导体制造有限公司 | 光刻胶去除方法及铝制程工艺方法 |
| CN110967946A (zh) * | 2019-12-04 | 2020-04-07 | 苏州博洋化学股份有限公司 | 一种高效碱性光刻胶剥离液 |
| TW202437031A (zh) | 2023-03-13 | 2024-09-16 | 台灣芯電應用科技股份有限公司 | 剝離劑組成物以及清洗方法 |
| EP4440252A1 (en) * | 2023-03-31 | 2024-10-02 | Atotech Deutschland GmbH & Co. KG | Method for removing an organic resin from a surface of a substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002012897A (ja) | 2000-02-25 | 2002-01-15 | Shipley Co Llc | ポリマー除去用組成物 |
| JP2006505629A (ja) | 2002-01-09 | 2006-02-16 | エア プロダクツ アンド ケミカルズ インコーポレイテッド | 水性ストリッピング及びクリーニング組成物 |
Family Cites Families (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4478827A (en) * | 1983-05-09 | 1984-10-23 | The General Hospital Corporation | Renin inhibitors |
| KR890004583B1 (ko) * | 1984-06-29 | 1989-11-16 | 히다찌가세이고오교 가부시끼가이샤 | 금속표면 처리공정 |
| US4671251A (en) * | 1984-09-24 | 1987-06-09 | Ohio State University | Fluidized bed combustor |
| DE3537441A1 (de) * | 1985-10-22 | 1987-04-23 | Hoechst Ag | Loesemittel zum entfernen von photoresists |
| US4824763A (en) * | 1987-07-30 | 1989-04-25 | Ekc Technology, Inc. | Triamine positive photoresist stripping composition and prebaking process |
| US5037724A (en) * | 1988-02-25 | 1991-08-06 | Hoya Corporation | Peeling solution for photo- or electron beam-sensitive resin |
| US5166039A (en) * | 1988-02-25 | 1992-11-24 | Hoya Corporation | Peeling solution for photo- or electron beam-sensitive resin and process for peeling off said resin |
| US4921571A (en) * | 1989-07-28 | 1990-05-01 | Macdermid, Incorporated | Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces |
| US6492311B2 (en) * | 1990-11-05 | 2002-12-10 | Ekc Technology, Inc. | Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process |
| US5556482A (en) * | 1991-01-25 | 1996-09-17 | Ashland, Inc. | Method of stripping photoresist with composition containing inhibitor |
| US5988186A (en) * | 1991-01-25 | 1999-11-23 | Ashland, Inc. | Aqueous stripping and cleaning compositions |
| US5753601A (en) * | 1991-01-25 | 1998-05-19 | Ashland Inc | Organic stripping composition |
| US5496491A (en) * | 1991-01-25 | 1996-03-05 | Ashland Oil Company | Organic stripping composition |
| JP3160344B2 (ja) * | 1991-01-25 | 2001-04-25 | アシュランド インコーポレーテッド | 有機ストリッピング組成物 |
| US5472823A (en) * | 1992-01-20 | 1995-12-05 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition |
| US6825156B2 (en) * | 2002-06-06 | 2004-11-30 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
| US5545353A (en) * | 1995-05-08 | 1996-08-13 | Ocg Microelectronic Materials, Inc. | Non-corrosive photoresist stripper composition |
| US5597678A (en) * | 1994-04-18 | 1997-01-28 | Ocg Microelectronic Materials, Inc. | Non-corrosive photoresist stripper composition |
| US5466389A (en) * | 1994-04-20 | 1995-11-14 | J. T. Baker Inc. | PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates |
| US5498293A (en) * | 1994-06-23 | 1996-03-12 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| US5554312A (en) * | 1995-01-13 | 1996-09-10 | Ashland | Photoresist stripping composition |
| US5507978A (en) * | 1995-05-08 | 1996-04-16 | Ocg Microelectronic Materials, Inc. | Novolak containing photoresist stripper composition |
| US5561105A (en) * | 1995-05-08 | 1996-10-01 | Ocg Microelectronic Materials, Inc. | Chelating reagent containing photoresist stripper composition |
| US5612304A (en) * | 1995-07-07 | 1997-03-18 | Olin Microelectronic Chemicals, Inc. | Redox reagent-containing post-etch residue cleaning composition |
| US5693691A (en) * | 1995-08-21 | 1997-12-02 | Brewer Science, Inc. | Thermosetting anti-reflective coatings compositions |
| US5759973A (en) * | 1996-09-06 | 1998-06-02 | Olin Microelectronic Chemicals, Inc. | Photoresist stripping and cleaning compositions |
| US6268323B1 (en) * | 1997-05-05 | 2001-07-31 | Arch Specialty Chemicals, Inc. | Non-corrosive stripping and cleaning composition |
| US5798323A (en) * | 1997-05-05 | 1998-08-25 | Olin Microelectronic Chemicals, Inc. | Non-corrosive stripping and cleaning composition |
| US5919599A (en) * | 1997-09-30 | 1999-07-06 | Brewer Science, Inc. | Thermosetting anti-reflective coatings at deep ultraviolet |
| DK1105778T3 (da) * | 1998-05-18 | 2009-10-19 | Mallinckrodt Baker Inc | Silikatholdige alkaliske sammensætninger til rensning af mikorelektroniske substrater |
| US7135445B2 (en) * | 2001-12-04 | 2006-11-14 | Ekc Technology, Inc. | Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials |
| SG77710A1 (en) * | 1998-09-09 | 2001-01-16 | Tokuyama Corp | Photoresist ashing residue cleaning agent |
| JP3054145B1 (ja) * | 1999-04-22 | 2000-06-19 | 東京応化工業株式会社 | ホトレジスト用剥離液組成物およびこれを用いたホトレジスト剥離方法 |
| TWI270749B (en) * | 1999-06-07 | 2007-01-11 | Tokyo Ohka Kogyo Co Ltd | Photoresist stripping liquid composition and a method of stripping photoresists using the same |
| US6268115B1 (en) * | 2000-01-06 | 2001-07-31 | Air Products And Chemicals, Inc. | Use of alkylated polyamines in photoresist developers |
| US6475966B1 (en) * | 2000-02-25 | 2002-11-05 | Shipley Company, L.L.C. | Plasma etching residue removal |
| US6319835B1 (en) * | 2000-02-25 | 2001-11-20 | Shipley Company, L.L.C. | Stripping method |
| KR100764888B1 (ko) * | 2000-07-10 | 2007-10-09 | 이케이씨 테크놀로지, 인코포레이티드 | 반도체 장치용의 유기 및 플라즈마 식각된 잔사의 세척을위한 조성물 |
| US6455479B1 (en) * | 2000-08-03 | 2002-09-24 | Shipley Company, L.L.C. | Stripping composition |
| US6558879B1 (en) * | 2000-09-25 | 2003-05-06 | Ashland Inc. | Photoresist stripper/cleaner compositions containing aromatic acid inhibitors |
| JP2002216977A (ja) * | 2001-01-22 | 2002-08-02 | Matsushita Electric Ind Co Ltd | 有機エレクトロルミネッセンス表示素子 |
| JP4810764B2 (ja) * | 2001-06-29 | 2011-11-09 | 三菱瓦斯化学株式会社 | レジスト剥離剤組成物 |
| WO2003038529A1 (fr) * | 2001-11-02 | 2003-05-08 | Mitsubishi Gas Chemical Company, Inc. | Procede de liberation de resist |
| JP2004101849A (ja) * | 2002-09-09 | 2004-04-02 | Mitsubishi Gas Chem Co Inc | 洗浄剤組成物 |
| JP4165208B2 (ja) * | 2002-12-24 | 2008-10-15 | 東ソー株式会社 | レジスト剥離方法 |
| US7119052B2 (en) * | 2003-06-24 | 2006-10-10 | Advanced Technology Materials, Inc. | Compositions and methods for high-efficiency cleaning/polishing of semiconductor wafers |
| DE602005021890D1 (de) * | 2004-07-15 | 2010-07-29 | Mallinckrodt Baker Inc | Nichtwässrige mikroelektronische reinigungszusammensetzungen mit fructose |
| ES2335786T3 (es) * | 2004-08-03 | 2010-04-05 | Mallinckrodt Baker, Inc. | Composiciones de limpieza para sustratos microelectronicos. |
| KR20060064441A (ko) * | 2004-12-08 | 2006-06-13 | 말린크로트 베이커, 인코포레이티드 | 비수성 비부식성 마이크로전자 세정 조성물 |
| PT1828848E (pt) * | 2004-12-10 | 2010-05-21 | Mallinckrodt Baker Inc | Composições de limpeza para microelectrónica, não aquosas e não corrosivas, contendo inibidores da corrosão poliméricos |
-
2005
- 2005-05-12 KR KR1020050039700A patent/KR101088568B1/ko not_active Expired - Lifetime
-
2006
- 2006-03-16 SG SG201002616-9A patent/SG161273A1/en unknown
- 2006-03-16 CA CA002605236A patent/CA2605236A1/en not_active Abandoned
- 2006-03-16 US US11/910,281 patent/US20080280235A1/en not_active Abandoned
- 2006-03-16 CN CN2006800132023A patent/CN101164016B/zh active Active
- 2006-03-16 PT PT06738451T patent/PT1877870E/pt unknown
- 2006-03-16 PL PL06738451T patent/PL1877870T3/pl unknown
- 2006-03-16 AT AT06738451T patent/ATE498859T1/de active
- 2006-03-16 ES ES06738451T patent/ES2361271T3/es active Active
- 2006-03-16 BR BRPI0610852-0A patent/BRPI0610852A2/pt not_active IP Right Cessation
- 2006-03-16 JP JP2008507660A patent/JP4677030B2/ja not_active Expired - Fee Related
- 2006-03-16 EP EP06738451A patent/EP1877870B1/en not_active Not-in-force
- 2006-03-16 WO PCT/US2006/009389 patent/WO2006112994A1/en not_active Ceased
- 2006-03-16 DK DK06738451.1T patent/DK1877870T3/da active
- 2006-03-16 DE DE602006020125T patent/DE602006020125D1/de active Active
- 2006-03-29 MY MYPI20061377A patent/MY145299A/en unknown
- 2006-03-31 TW TW095111632A patent/TW200700549A/zh unknown
-
2007
- 2007-07-30 ZA ZA200706296A patent/ZA200706296B/xx unknown
- 2007-10-10 IL IL186565A patent/IL186565A0/en not_active IP Right Cessation
- 2007-11-19 NO NO20075935A patent/NO20075935L/no not_active Application Discontinuation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002012897A (ja) | 2000-02-25 | 2002-01-15 | Shipley Co Llc | ポリマー除去用組成物 |
| JP2006505629A (ja) | 2002-01-09 | 2006-02-16 | エア プロダクツ アンド ケミカルズ インコーポレイテッド | 水性ストリッピング及びクリーニング組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1877870A1 (en) | 2008-01-16 |
| CA2605236A1 (en) | 2006-10-26 |
| KR20060110712A (ko) | 2006-10-25 |
| MY145299A (en) | 2012-01-13 |
| SG161273A1 (en) | 2010-05-27 |
| JP2008537182A (ja) | 2008-09-11 |
| PL1877870T3 (pl) | 2011-07-29 |
| WO2006112994A1 (en) | 2006-10-26 |
| EP1877870B1 (en) | 2011-02-16 |
| NO20075935L (no) | 2008-01-18 |
| ZA200706296B (en) | 2008-09-25 |
| DK1877870T3 (da) | 2011-05-02 |
| CN101164016B (zh) | 2010-12-01 |
| ES2361271T3 (es) | 2011-06-15 |
| IL186565A0 (en) | 2008-01-20 |
| US20080280235A1 (en) | 2008-11-13 |
| PT1877870E (pt) | 2011-05-24 |
| JP4677030B2 (ja) | 2011-04-27 |
| BRPI0610852A2 (pt) | 2010-08-03 |
| TW200700549A (en) | 2007-01-01 |
| CN101164016A (zh) | 2008-04-16 |
| ATE498859T1 (de) | 2011-03-15 |
| DE602006020125D1 (de) | 2011-03-31 |
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St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| PA0201 | Request for examination |
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St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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