KR101047832B1 - 전자 디바이스의 온도제어장치 및 온도제어방법 - Google Patents

전자 디바이스의 온도제어장치 및 온도제어방법 Download PDF

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KR101047832B1
KR101047832B1 KR1020087020970A KR20087020970A KR101047832B1 KR 101047832 B1 KR101047832 B1 KR 101047832B1 KR 1020087020970 A KR1020087020970 A KR 1020087020970A KR 20087020970 A KR20087020970 A KR 20087020970A KR 101047832 B1 KR101047832 B1 KR 101047832B1
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fluid
temperature
heat sink
input
mixed
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KR20090095456A (ko
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래리 스턱키
아나스타시오스 골나스
로버트 에드워드 앨다즈
데이비드 유
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가부시키가이샤 아드반테스트
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B29/00Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H10W40/475Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00Arrangement or mounting of control or safety devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Temperature (AREA)
KR1020087020970A 2007-07-30 2007-07-30 전자 디바이스의 온도제어장치 및 온도제어방법 Active KR101047832B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2007/074727 WO2009017495A1 (en) 2007-07-30 2007-07-30 Thermal controller for electronic devices

Publications (2)

Publication Number Publication Date
KR20090095456A KR20090095456A (ko) 2009-09-09
KR101047832B1 true KR101047832B1 (ko) 2011-07-08

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KR1020087020970A Active KR101047832B1 (ko) 2007-07-30 2007-07-30 전자 디바이스의 온도제어장치 및 온도제어방법

Country Status (7)

Country Link
US (1) US8896335B2 (https=)
JP (1) JP4790087B2 (https=)
KR (1) KR101047832B1 (https=)
CN (1) CN101495819B (https=)
DE (1) DE112007003606T5 (https=)
TW (1) TWI404178B (https=)
WO (1) WO2009017495A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI880140B (zh) * 2022-03-31 2025-04-11 日商阿德潘鐵斯特股份有限公司 溫度調整裝置、電子元件處理裝置、電子元件試驗裝置及dut的溫度調整方法
WO2026055252A1 (en) * 2024-09-03 2026-03-12 Tyco Fire & Security Gmbh Multi-temperature hydronic system and method with controls and fluid management

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112007003648T5 (de) * 2007-09-14 2010-08-26 Advantest Corp. Verbesserte Grenzfläche zur Temperaturkontrolle
DE112008003714T5 (de) 2008-10-29 2010-11-25 Advantest Corp. Temperatursteuerung für elektronische Bauelemente
DE102010011084A1 (de) * 2010-03-12 2011-09-15 Converteam Gmbh Kühlvorrichtung und Verfahren zum Kühlen eines Betriebsmittels
US9096784B2 (en) 2010-07-23 2015-08-04 International Business Machines Corporation Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance
CN103095098B (zh) * 2011-10-27 2015-06-24 珠海格力电器股份有限公司 变频器散热冷却系统及其控制方法和装置
TWI398654B (zh) * 2011-11-22 2013-06-11 Chroma Ate Inc Semiconductor automation testing machine with temperature control system
JP2013137285A (ja) 2011-12-28 2013-07-11 Advantest Corp ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置
JP2013137284A (ja) 2011-12-28 2013-07-11 Advantest Corp 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
CN103369810B (zh) * 2012-03-31 2016-02-10 中微半导体设备(上海)有限公司 一种等离子反应器
US9360514B2 (en) * 2012-04-05 2016-06-07 Board Of Regents, The University Of Texas System Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
US9111899B2 (en) 2012-09-13 2015-08-18 Lenovo Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks
US9245813B2 (en) 2013-01-30 2016-01-26 International Business Machines Corporation Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance
US9090004B2 (en) 2013-02-06 2015-07-28 International Business Machines Corporation Composites comprised of aligned carbon fibers in chain-aligned polymer binder
CN103279149B (zh) * 2013-05-24 2015-03-25 深圳英诺激光科技有限公司 一种温度补偿式恒温激光器及恒温方法
US9082744B2 (en) 2013-07-08 2015-07-14 International Business Machines Corporation Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field
KR20150108578A (ko) * 2014-03-18 2015-09-30 가부시키가이샤 어드밴티스트 온도 제어 장치 및 시험 시스템
US20160085244A1 (en) * 2014-09-24 2016-03-24 Fisher Controls International Llc Vortex tube temperature control for process control devices
US10791651B2 (en) 2016-05-31 2020-09-29 Carbice Corporation Carbon nanotube-based thermal interface materials and methods of making and using thereof
KR101910347B1 (ko) * 2016-12-05 2018-10-23 주식회사 글로벌스탠다드테크놀로지 반도체 제조설비의 고도화 온도제어장치
US9878565B1 (en) * 2016-12-20 2018-01-30 Xerox Corporation Cooling control system
TWI755492B (zh) 2017-03-06 2022-02-21 美商卡爾拜斯有限公司 基於碳納米管的熱界面材料及其製造和使用方法
US10527355B2 (en) 2017-06-13 2020-01-07 Microsoft Technology Licensing, Llc Devices, methods, and systems for thermal management
JP6948182B2 (ja) * 2017-08-04 2021-10-13 株式会社アドバンテスト 磁気センサ試験装置
CN107543366A (zh) * 2017-10-11 2018-01-05 浙江海洋大学 一种在低电压下真空容器的温度调控系统
US10753971B2 (en) * 2018-04-03 2020-08-25 Advantest Corporation Heat exchanger and electronic device handling apparatus including the same
CN110261150A (zh) * 2019-06-04 2019-09-20 中国科学院合肥物质科学研究院 一种300-4.5k温区多工况低温换热器的测试装置
CN110488796A (zh) * 2019-08-14 2019-11-22 武汉克莱美特环境设备有限公司 一种液冷散热电路板综合环境模拟箱
CN112239019A (zh) * 2019-11-15 2021-01-19 林超文 自监测防高温损坏的数码产品收纳盒
US11543327B2 (en) 2020-01-30 2023-01-03 Gm Cruise Holdings Llc Method and apparatus for delivering a thermal shock
JP7463977B2 (ja) * 2021-01-26 2024-04-09 株式会社デンソー 冷却装置
JP2023177687A (ja) * 2022-06-02 2023-12-14 株式会社アドバンテスト ヒータ駆動制御装置、電子部品ハンドリング装置、電子部品試験装置、及び、ヒータ駆動制御方法
US11828795B1 (en) 2022-10-21 2023-11-28 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones
CN120677396A (zh) 2022-10-21 2025-09-19 新加坡商永科股份有限公司 用于对多个区域进行独立的控制的热头
US11693051B1 (en) 2022-10-21 2023-07-04 AEM Holdings Ltd. Thermal head for independent control of zones
US11796589B1 (en) 2022-10-21 2023-10-24 AEM Holdings Ltd. Thermal head for independent control of zones
US11656272B1 (en) 2022-10-21 2023-05-23 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones
TWI878761B (zh) 2022-12-13 2025-04-01 致茂電子股份有限公司 使用多相熱介面構件之電子元件測試方法
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement
US20250172608A1 (en) * 2023-11-28 2025-05-29 Smart Modular Technologies, Inc. Systems and methods for testing thermal conditioning of an integrated circuit (ic)

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3241602A (en) * 1963-06-25 1966-03-22 Andreassen Roar Heating and cooling system and control therefor
US3259175A (en) * 1964-06-15 1966-07-05 Robert A Kraus Heating and cooling system for molds
US3721386A (en) * 1970-10-23 1973-03-20 J Brick Temperature-volume controlled mixing valve
US4512161A (en) * 1983-03-03 1985-04-23 Control Data Corporation Dew point sensitive computer cooling system
CA1303238C (en) * 1988-05-09 1992-06-09 Kazuhiko Umezawa Flat cooling structure of integrated circuit
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
US5918469A (en) * 1996-01-11 1999-07-06 Silicon Thermal, Inc. Cooling system and method of cooling electronic devices
US5977785A (en) * 1996-05-28 1999-11-02 Burward-Hoy; Trevor Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment
US5802856A (en) * 1996-07-31 1998-09-08 Stanford University Multizone bake/chill thermal cycling module
US6593761B1 (en) * 1997-11-28 2003-07-15 Kabushiki Kaisha Toshiba Test handler for semiconductor device
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6091062A (en) * 1998-01-27 2000-07-18 Kinetrix, Inc. Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly
JP5000803B2 (ja) * 1998-07-14 2012-08-15 デルタ・デザイン・インコーポレイテッド 電子デバイスの速応温度反復制御を液体を利用して広範囲に行うための装置、方法
US6362944B1 (en) * 2000-05-19 2002-03-26 Unisys Corporation System for regulating the temperature of IC-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heater
US6412551B1 (en) * 2000-05-19 2002-07-02 Unisys Corporation System for regulating the temperature of IC-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the IC-chips
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
KR100436657B1 (ko) * 2001-12-17 2004-06-22 미래산업 주식회사 반도체 소자 테스트 핸들러의 소자 가열 및 냉각장치
US7100389B1 (en) * 2002-07-16 2006-09-05 Delta Design, Inc. Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
US6861861B2 (en) * 2002-07-24 2005-03-01 Lg Electronics Inc. Device for compensating for a test temperature deviation in a semiconductor device handler
US7114556B2 (en) * 2002-12-17 2006-10-03 Micro Control Company Burn-in oven heat exchanger having improved thermal conduction
JP2005079483A (ja) * 2003-09-03 2005-03-24 Hitachi Ltd 電子機器装置
CN2684380Y (zh) * 2004-03-13 2005-03-09 林智忠 封闭式整体液冷散热器
US7254957B2 (en) * 2005-02-15 2007-08-14 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
CN2864986Y (zh) * 2005-12-19 2007-01-31 元山科技工业股份有限公司 用于电子元件的散热装置
CN101005745A (zh) * 2006-01-20 2007-07-25 刘胜 用于电子器件的微喷射流冷却系统
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI880140B (zh) * 2022-03-31 2025-04-11 日商阿德潘鐵斯特股份有限公司 溫度調整裝置、電子元件處理裝置、電子元件試驗裝置及dut的溫度調整方法
US12422472B2 (en) 2022-03-31 2025-09-23 Advantest Corporation Temperature control device, electronic component handling apparatus, electronic component test apparatus, and DUT temperature control method
WO2026055252A1 (en) * 2024-09-03 2026-03-12 Tyco Fire & Security Gmbh Multi-temperature hydronic system and method with controls and fluid management

Also Published As

Publication number Publication date
JP2010535417A (ja) 2010-11-18
JP4790087B2 (ja) 2011-10-12
TW200921872A (en) 2009-05-16
TWI404178B (zh) 2013-08-01
US20100224352A1 (en) 2010-09-09
US8896335B2 (en) 2014-11-25
WO2009017495A1 (en) 2009-02-05
KR20090095456A (ko) 2009-09-09
DE112007003606T5 (de) 2010-06-10
CN101495819A (zh) 2009-07-29
CN101495819B (zh) 2011-08-17

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