DE112007003606T5 - Temperatursteuerung für elektronische Bauelemente - Google Patents
Temperatursteuerung für elektronische Bauelemente Download PDFInfo
- Publication number
- DE112007003606T5 DE112007003606T5 DE112007003606T DE112007003606T DE112007003606T5 DE 112007003606 T5 DE112007003606 T5 DE 112007003606T5 DE 112007003606 T DE112007003606 T DE 112007003606T DE 112007003606 T DE112007003606 T DE 112007003606T DE 112007003606 T5 DE112007003606 T5 DE 112007003606T5
- Authority
- DE
- Germany
- Prior art keywords
- fluid
- temperature
- heat sink
- cold
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
- H10W40/475—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Control Of Temperature (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2007/074727 WO2009017495A1 (en) | 2007-07-30 | 2007-07-30 | Thermal controller for electronic devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112007003606T5 true DE112007003606T5 (de) | 2010-06-10 |
Family
ID=40304591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112007003606T Ceased DE112007003606T5 (de) | 2007-07-30 | 2007-07-30 | Temperatursteuerung für elektronische Bauelemente |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8896335B2 (https=) |
| JP (1) | JP4790087B2 (https=) |
| KR (1) | KR101047832B1 (https=) |
| CN (1) | CN101495819B (https=) |
| DE (1) | DE112007003606T5 (https=) |
| TW (1) | TWI404178B (https=) |
| WO (1) | WO2009017495A1 (https=) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112007003648T5 (de) * | 2007-09-14 | 2010-08-26 | Advantest Corp. | Verbesserte Grenzfläche zur Temperaturkontrolle |
| DE112008003714T5 (de) | 2008-10-29 | 2010-11-25 | Advantest Corp. | Temperatursteuerung für elektronische Bauelemente |
| DE102010011084A1 (de) * | 2010-03-12 | 2011-09-15 | Converteam Gmbh | Kühlvorrichtung und Verfahren zum Kühlen eines Betriebsmittels |
| US9096784B2 (en) | 2010-07-23 | 2015-08-04 | International Business Machines Corporation | Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance |
| CN103095098B (zh) * | 2011-10-27 | 2015-06-24 | 珠海格力电器股份有限公司 | 变频器散热冷却系统及其控制方法和装置 |
| TWI398654B (zh) * | 2011-11-22 | 2013-06-11 | Chroma Ate Inc | Semiconductor automation testing machine with temperature control system |
| JP2013137285A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| JP2013137284A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| CN103369810B (zh) * | 2012-03-31 | 2016-02-10 | 中微半导体设备(上海)有限公司 | 一种等离子反应器 |
| US9360514B2 (en) * | 2012-04-05 | 2016-06-07 | Board Of Regents, The University Of Texas System | Thermal reliability testing systems with thermal cycling and multidimensional heat transfer |
| US9111899B2 (en) | 2012-09-13 | 2015-08-18 | Lenovo | Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks |
| US9245813B2 (en) | 2013-01-30 | 2016-01-26 | International Business Machines Corporation | Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance |
| US9090004B2 (en) | 2013-02-06 | 2015-07-28 | International Business Machines Corporation | Composites comprised of aligned carbon fibers in chain-aligned polymer binder |
| CN103279149B (zh) * | 2013-05-24 | 2015-03-25 | 深圳英诺激光科技有限公司 | 一种温度补偿式恒温激光器及恒温方法 |
| US9082744B2 (en) | 2013-07-08 | 2015-07-14 | International Business Machines Corporation | Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field |
| KR20150108578A (ko) * | 2014-03-18 | 2015-09-30 | 가부시키가이샤 어드밴티스트 | 온도 제어 장치 및 시험 시스템 |
| US20160085244A1 (en) * | 2014-09-24 | 2016-03-24 | Fisher Controls International Llc | Vortex tube temperature control for process control devices |
| US10791651B2 (en) | 2016-05-31 | 2020-09-29 | Carbice Corporation | Carbon nanotube-based thermal interface materials and methods of making and using thereof |
| KR101910347B1 (ko) * | 2016-12-05 | 2018-10-23 | 주식회사 글로벌스탠다드테크놀로지 | 반도체 제조설비의 고도화 온도제어장치 |
| US9878565B1 (en) * | 2016-12-20 | 2018-01-30 | Xerox Corporation | Cooling control system |
| TWI755492B (zh) | 2017-03-06 | 2022-02-21 | 美商卡爾拜斯有限公司 | 基於碳納米管的熱界面材料及其製造和使用方法 |
| US10527355B2 (en) | 2017-06-13 | 2020-01-07 | Microsoft Technology Licensing, Llc | Devices, methods, and systems for thermal management |
| JP6948182B2 (ja) * | 2017-08-04 | 2021-10-13 | 株式会社アドバンテスト | 磁気センサ試験装置 |
| CN107543366A (zh) * | 2017-10-11 | 2018-01-05 | 浙江海洋大学 | 一种在低电压下真空容器的温度调控系统 |
| US10753971B2 (en) * | 2018-04-03 | 2020-08-25 | Advantest Corporation | Heat exchanger and electronic device handling apparatus including the same |
| CN110261150A (zh) * | 2019-06-04 | 2019-09-20 | 中国科学院合肥物质科学研究院 | 一种300-4.5k温区多工况低温换热器的测试装置 |
| CN110488796A (zh) * | 2019-08-14 | 2019-11-22 | 武汉克莱美特环境设备有限公司 | 一种液冷散热电路板综合环境模拟箱 |
| CN112239019A (zh) * | 2019-11-15 | 2021-01-19 | 林超文 | 自监测防高温损坏的数码产品收纳盒 |
| US11543327B2 (en) | 2020-01-30 | 2023-01-03 | Gm Cruise Holdings Llc | Method and apparatus for delivering a thermal shock |
| JP7463977B2 (ja) * | 2021-01-26 | 2024-04-09 | 株式会社デンソー | 冷却装置 |
| JP2023149981A (ja) | 2022-03-31 | 2023-10-16 | 株式会社アドバンテスト | 温度調整装置、電子部品ハンドリング装置、電子部品試験装置、及びdutの温度調整方法 |
| JP2023177687A (ja) * | 2022-06-02 | 2023-12-14 | 株式会社アドバンテスト | ヒータ駆動制御装置、電子部品ハンドリング装置、電子部品試験装置、及び、ヒータ駆動制御方法 |
| US11828795B1 (en) | 2022-10-21 | 2023-11-28 | AEM Holdings Ltd. | Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones |
| CN120677396A (zh) | 2022-10-21 | 2025-09-19 | 新加坡商永科股份有限公司 | 用于对多个区域进行独立的控制的热头 |
| US11693051B1 (en) | 2022-10-21 | 2023-07-04 | AEM Holdings Ltd. | Thermal head for independent control of zones |
| US11796589B1 (en) | 2022-10-21 | 2023-10-24 | AEM Holdings Ltd. | Thermal head for independent control of zones |
| US11656272B1 (en) | 2022-10-21 | 2023-05-23 | AEM Holdings Ltd. | Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones |
| TWI878761B (zh) | 2022-12-13 | 2025-04-01 | 致茂電子股份有限公司 | 使用多相熱介面構件之電子元件測試方法 |
| US11828796B1 (en) | 2023-05-02 | 2023-11-28 | AEM Holdings Ltd. | Integrated heater and temperature measurement |
| US20250172608A1 (en) * | 2023-11-28 | 2025-05-29 | Smart Modular Technologies, Inc. | Systems and methods for testing thermal conditioning of an integrated circuit (ic) |
| WO2026055252A1 (en) * | 2024-09-03 | 2026-03-12 | Tyco Fire & Security Gmbh | Multi-temperature hydronic system and method with controls and fluid management |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3241602A (en) * | 1963-06-25 | 1966-03-22 | Andreassen Roar | Heating and cooling system and control therefor |
| US3259175A (en) * | 1964-06-15 | 1966-07-05 | Robert A Kraus | Heating and cooling system for molds |
| US3721386A (en) * | 1970-10-23 | 1973-03-20 | J Brick | Temperature-volume controlled mixing valve |
| US4512161A (en) * | 1983-03-03 | 1985-04-23 | Control Data Corporation | Dew point sensitive computer cooling system |
| CA1303238C (en) * | 1988-05-09 | 1992-06-09 | Kazuhiko Umezawa | Flat cooling structure of integrated circuit |
| CA2053055C (en) * | 1990-10-11 | 1997-02-25 | Tsukasa Mizuno | Liquid cooling system for lsi packages |
| US5918469A (en) * | 1996-01-11 | 1999-07-06 | Silicon Thermal, Inc. | Cooling system and method of cooling electronic devices |
| US5977785A (en) * | 1996-05-28 | 1999-11-02 | Burward-Hoy; Trevor | Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment |
| US5802856A (en) * | 1996-07-31 | 1998-09-08 | Stanford University | Multizone bake/chill thermal cycling module |
| US6593761B1 (en) * | 1997-11-28 | 2003-07-15 | Kabushiki Kaisha Toshiba | Test handler for semiconductor device |
| US6415858B1 (en) * | 1997-12-31 | 2002-07-09 | Temptronic Corporation | Temperature control system for a workpiece chuck |
| US6091062A (en) * | 1998-01-27 | 2000-07-18 | Kinetrix, Inc. | Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly |
| JP5000803B2 (ja) * | 1998-07-14 | 2012-08-15 | デルタ・デザイン・インコーポレイテッド | 電子デバイスの速応温度反復制御を液体を利用して広範囲に行うための装置、方法 |
| US6362944B1 (en) * | 2000-05-19 | 2002-03-26 | Unisys Corporation | System for regulating the temperature of IC-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heater |
| US6412551B1 (en) * | 2000-05-19 | 2002-07-02 | Unisys Corporation | System for regulating the temperature of IC-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the IC-chips |
| US6668570B2 (en) * | 2001-05-31 | 2003-12-30 | Kryotech, Inc. | Apparatus and method for controlling the temperature of an electronic device under test |
| US6828675B2 (en) * | 2001-09-26 | 2004-12-07 | Modine Manufacturing Company | Modular cooling system and thermal bus for high power electronics cabinets |
| KR100436657B1 (ko) * | 2001-12-17 | 2004-06-22 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 소자 가열 및 냉각장치 |
| US7100389B1 (en) * | 2002-07-16 | 2006-09-05 | Delta Design, Inc. | Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test |
| US6861861B2 (en) * | 2002-07-24 | 2005-03-01 | Lg Electronics Inc. | Device for compensating for a test temperature deviation in a semiconductor device handler |
| US7114556B2 (en) * | 2002-12-17 | 2006-10-03 | Micro Control Company | Burn-in oven heat exchanger having improved thermal conduction |
| JP2005079483A (ja) * | 2003-09-03 | 2005-03-24 | Hitachi Ltd | 電子機器装置 |
| CN2684380Y (zh) * | 2004-03-13 | 2005-03-09 | 林智忠 | 封闭式整体液冷散热器 |
| US7254957B2 (en) * | 2005-02-15 | 2007-08-14 | Raytheon Company | Method and apparatus for cooling with coolant at a subambient pressure |
| CN2864986Y (zh) * | 2005-12-19 | 2007-01-31 | 元山科技工业股份有限公司 | 用于电子元件的散热装置 |
| CN101005745A (zh) * | 2006-01-20 | 2007-07-25 | 刘胜 | 用于电子器件的微喷射流冷却系统 |
| US8151872B2 (en) * | 2007-03-16 | 2012-04-10 | Centipede Systems, Inc. | Method and apparatus for controlling temperature |
-
2007
- 2007-07-30 US US12/278,841 patent/US8896335B2/en active Active
- 2007-07-30 DE DE112007003606T patent/DE112007003606T5/de not_active Ceased
- 2007-07-30 JP JP2010519181A patent/JP4790087B2/ja not_active Expired - Fee Related
- 2007-07-30 WO PCT/US2007/074727 patent/WO2009017495A1/en not_active Ceased
- 2007-07-30 CN CN2007800285150A patent/CN101495819B/zh active Active
- 2007-07-30 KR KR1020087020970A patent/KR101047832B1/ko active Active
-
2008
- 2008-07-29 TW TW097128600A patent/TWI404178B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010535417A (ja) | 2010-11-18 |
| JP4790087B2 (ja) | 2011-10-12 |
| TW200921872A (en) | 2009-05-16 |
| TWI404178B (zh) | 2013-08-01 |
| US20100224352A1 (en) | 2010-09-09 |
| US8896335B2 (en) | 2014-11-25 |
| WO2009017495A1 (en) | 2009-02-05 |
| KR101047832B1 (ko) | 2011-07-08 |
| KR20090095456A (ko) | 2009-09-09 |
| CN101495819A (zh) | 2009-07-29 |
| CN101495819B (zh) | 2011-08-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8125 | Change of the main classification |
Ipc: H01L 23/34 AFI20070730BHDE |
|
| R016 | Response to examination communication | ||
| R016 | Response to examination communication | ||
| R016 | Response to examination communication | ||
| R002 | Refusal decision in examination/registration proceedings | ||
| R003 | Refusal decision now final |
Effective date: 20130608 |