DE112007003606T5 - Temperatursteuerung für elektronische Bauelemente - Google Patents

Temperatursteuerung für elektronische Bauelemente Download PDF

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Publication number
DE112007003606T5
DE112007003606T5 DE112007003606T DE112007003606T DE112007003606T5 DE 112007003606 T5 DE112007003606 T5 DE 112007003606T5 DE 112007003606 T DE112007003606 T DE 112007003606T DE 112007003606 T DE112007003606 T DE 112007003606T DE 112007003606 T5 DE112007003606 T5 DE 112007003606T5
Authority
DE
Germany
Prior art keywords
fluid
temperature
heat sink
cold
hot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112007003606T
Other languages
German (de)
English (en)
Inventor
Larry San Diego Stuckey
Anastasios Chicago Golnas
Robert Edward Saint Charles Aldaz
David Bloomingdale Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of DE112007003606T5 publication Critical patent/DE112007003606T5/de
Ceased legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B29/00Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H10W40/475Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00Arrangement or mounting of control or safety devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Temperature (AREA)
DE112007003606T 2007-07-30 2007-07-30 Temperatursteuerung für elektronische Bauelemente Ceased DE112007003606T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2007/074727 WO2009017495A1 (en) 2007-07-30 2007-07-30 Thermal controller for electronic devices

Publications (1)

Publication Number Publication Date
DE112007003606T5 true DE112007003606T5 (de) 2010-06-10

Family

ID=40304591

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112007003606T Ceased DE112007003606T5 (de) 2007-07-30 2007-07-30 Temperatursteuerung für elektronische Bauelemente

Country Status (7)

Country Link
US (1) US8896335B2 (https=)
JP (1) JP4790087B2 (https=)
KR (1) KR101047832B1 (https=)
CN (1) CN101495819B (https=)
DE (1) DE112007003606T5 (https=)
TW (1) TWI404178B (https=)
WO (1) WO2009017495A1 (https=)

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US20160085244A1 (en) * 2014-09-24 2016-03-24 Fisher Controls International Llc Vortex tube temperature control for process control devices
US10791651B2 (en) 2016-05-31 2020-09-29 Carbice Corporation Carbon nanotube-based thermal interface materials and methods of making and using thereof
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JP6948182B2 (ja) * 2017-08-04 2021-10-13 株式会社アドバンテスト 磁気センサ試験装置
CN107543366A (zh) * 2017-10-11 2018-01-05 浙江海洋大学 一种在低电压下真空容器的温度调控系统
US10753971B2 (en) * 2018-04-03 2020-08-25 Advantest Corporation Heat exchanger and electronic device handling apparatus including the same
CN110261150A (zh) * 2019-06-04 2019-09-20 中国科学院合肥物质科学研究院 一种300-4.5k温区多工况低温换热器的测试装置
CN110488796A (zh) * 2019-08-14 2019-11-22 武汉克莱美特环境设备有限公司 一种液冷散热电路板综合环境模拟箱
CN112239019A (zh) * 2019-11-15 2021-01-19 林超文 自监测防高温损坏的数码产品收纳盒
US11543327B2 (en) 2020-01-30 2023-01-03 Gm Cruise Holdings Llc Method and apparatus for delivering a thermal shock
JP7463977B2 (ja) * 2021-01-26 2024-04-09 株式会社デンソー 冷却装置
JP2023149981A (ja) 2022-03-31 2023-10-16 株式会社アドバンテスト 温度調整装置、電子部品ハンドリング装置、電子部品試験装置、及びdutの温度調整方法
JP2023177687A (ja) * 2022-06-02 2023-12-14 株式会社アドバンテスト ヒータ駆動制御装置、電子部品ハンドリング装置、電子部品試験装置、及び、ヒータ駆動制御方法
US11828795B1 (en) 2022-10-21 2023-11-28 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones
CN120677396A (zh) 2022-10-21 2025-09-19 新加坡商永科股份有限公司 用于对多个区域进行独立的控制的热头
US11693051B1 (en) 2022-10-21 2023-07-04 AEM Holdings Ltd. Thermal head for independent control of zones
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US11656272B1 (en) 2022-10-21 2023-05-23 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones
TWI878761B (zh) 2022-12-13 2025-04-01 致茂電子股份有限公司 使用多相熱介面構件之電子元件測試方法
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement
US20250172608A1 (en) * 2023-11-28 2025-05-29 Smart Modular Technologies, Inc. Systems and methods for testing thermal conditioning of an integrated circuit (ic)
WO2026055252A1 (en) * 2024-09-03 2026-03-12 Tyco Fire & Security Gmbh Multi-temperature hydronic system and method with controls and fluid management

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Also Published As

Publication number Publication date
JP2010535417A (ja) 2010-11-18
JP4790087B2 (ja) 2011-10-12
TW200921872A (en) 2009-05-16
TWI404178B (zh) 2013-08-01
US20100224352A1 (en) 2010-09-09
US8896335B2 (en) 2014-11-25
WO2009017495A1 (en) 2009-02-05
KR101047832B1 (ko) 2011-07-08
KR20090095456A (ko) 2009-09-09
CN101495819A (zh) 2009-07-29
CN101495819B (zh) 2011-08-17

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: H01L 23/34 AFI20070730BHDE

R016 Response to examination communication
R016 Response to examination communication
R016 Response to examination communication
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final

Effective date: 20130608