JP4790087B2 - 電子部品の温度制御装置 - Google Patents

電子部品の温度制御装置 Download PDF

Info

Publication number
JP4790087B2
JP4790087B2 JP2010519181A JP2010519181A JP4790087B2 JP 4790087 B2 JP4790087 B2 JP 4790087B2 JP 2010519181 A JP2010519181 A JP 2010519181A JP 2010519181 A JP2010519181 A JP 2010519181A JP 4790087 B2 JP4790087 B2 JP 4790087B2
Authority
JP
Japan
Prior art keywords
temperature
fluid
heat sink
refrigerant
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010519181A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010535417A (ja
JP2010535417A5 (https=
Inventor
ラリー，スタッキー
アナスタシオス，ゴルナス
ロバートエドワード，アルザツ
デイビッド，ユー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of JP2010535417A publication Critical patent/JP2010535417A/ja
Publication of JP2010535417A5 publication Critical patent/JP2010535417A5/ja
Application granted granted Critical
Publication of JP4790087B2 publication Critical patent/JP4790087B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H10W40/475—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Temperature (AREA)
JP2010519181A 2007-07-30 2007-07-30 電子部品の温度制御装置 Expired - Fee Related JP4790087B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2007/074727 WO2009017495A1 (en) 2007-07-30 2007-07-30 Thermal controller for electronic devices

Publications (3)

Publication Number Publication Date
JP2010535417A JP2010535417A (ja) 2010-11-18
JP2010535417A5 JP2010535417A5 (https=) 2011-01-06
JP4790087B2 true JP4790087B2 (ja) 2011-10-12

Family

ID=40304591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010519181A Expired - Fee Related JP4790087B2 (ja) 2007-07-30 2007-07-30 電子部品の温度制御装置

Country Status (7)

Country Link
US (1) US8896335B2 (https=)
JP (1) JP4790087B2 (https=)
KR (1) KR101047832B1 (https=)
CN (1) CN101495819B (https=)
DE (1) DE112007003606T5 (https=)
TW (1) TWI404178B (https=)
WO (1) WO2009017495A1 (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112007003648T5 (de) * 2007-09-14 2010-08-26 Advantest Corp. Verbesserte Grenzfläche zur Temperaturkontrolle
DE112008003714T5 (de) 2008-10-29 2010-11-25 Advantest Corp. Temperatursteuerung für elektronische Bauelemente
DE102010011084A1 (de) * 2010-03-12 2011-09-15 Converteam Gmbh Kühlvorrichtung und Verfahren zum Kühlen eines Betriebsmittels
US9096784B2 (en) 2010-07-23 2015-08-04 International Business Machines Corporation Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance
CN103095098B (zh) * 2011-10-27 2015-06-24 珠海格力电器股份有限公司 变频器散热冷却系统及其控制方法和装置
TWI398654B (zh) * 2011-11-22 2013-06-11 Chroma Ate Inc Semiconductor automation testing machine with temperature control system
JP2013137285A (ja) 2011-12-28 2013-07-11 Advantest Corp ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置
JP2013137284A (ja) 2011-12-28 2013-07-11 Advantest Corp 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
CN103369810B (zh) * 2012-03-31 2016-02-10 中微半导体设备(上海)有限公司 一种等离子反应器
US9360514B2 (en) * 2012-04-05 2016-06-07 Board Of Regents, The University Of Texas System Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
US9111899B2 (en) 2012-09-13 2015-08-18 Lenovo Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks
US9245813B2 (en) 2013-01-30 2016-01-26 International Business Machines Corporation Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance
US9090004B2 (en) 2013-02-06 2015-07-28 International Business Machines Corporation Composites comprised of aligned carbon fibers in chain-aligned polymer binder
CN103279149B (zh) * 2013-05-24 2015-03-25 深圳英诺激光科技有限公司 一种温度补偿式恒温激光器及恒温方法
US9082744B2 (en) 2013-07-08 2015-07-14 International Business Machines Corporation Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field
KR20150108578A (ko) * 2014-03-18 2015-09-30 가부시키가이샤 어드밴티스트 온도 제어 장치 및 시험 시스템
US20160085244A1 (en) * 2014-09-24 2016-03-24 Fisher Controls International Llc Vortex tube temperature control for process control devices
US10791651B2 (en) 2016-05-31 2020-09-29 Carbice Corporation Carbon nanotube-based thermal interface materials and methods of making and using thereof
KR101910347B1 (ko) * 2016-12-05 2018-10-23 주식회사 글로벌스탠다드테크놀로지 반도체 제조설비의 고도화 온도제어장치
US9878565B1 (en) * 2016-12-20 2018-01-30 Xerox Corporation Cooling control system
TWI755492B (zh) 2017-03-06 2022-02-21 美商卡爾拜斯有限公司 基於碳納米管的熱界面材料及其製造和使用方法
US10527355B2 (en) 2017-06-13 2020-01-07 Microsoft Technology Licensing, Llc Devices, methods, and systems for thermal management
JP6948182B2 (ja) * 2017-08-04 2021-10-13 株式会社アドバンテスト 磁気センサ試験装置
CN107543366A (zh) * 2017-10-11 2018-01-05 浙江海洋大学 一种在低电压下真空容器的温度调控系统
US10753971B2 (en) * 2018-04-03 2020-08-25 Advantest Corporation Heat exchanger and electronic device handling apparatus including the same
CN110261150A (zh) * 2019-06-04 2019-09-20 中国科学院合肥物质科学研究院 一种300-4.5k温区多工况低温换热器的测试装置
CN110488796A (zh) * 2019-08-14 2019-11-22 武汉克莱美特环境设备有限公司 一种液冷散热电路板综合环境模拟箱
CN112239019A (zh) * 2019-11-15 2021-01-19 林超文 自监测防高温损坏的数码产品收纳盒
US11543327B2 (en) 2020-01-30 2023-01-03 Gm Cruise Holdings Llc Method and apparatus for delivering a thermal shock
JP7463977B2 (ja) * 2021-01-26 2024-04-09 株式会社デンソー 冷却装置
JP2023149981A (ja) 2022-03-31 2023-10-16 株式会社アドバンテスト 温度調整装置、電子部品ハンドリング装置、電子部品試験装置、及びｄｕｔの温度調整方法
JP2023177687A (ja) * 2022-06-02 2023-12-14 株式会社アドバンテスト ヒータ駆動制御装置、電子部品ハンドリング装置、電子部品試験装置、及び、ヒータ駆動制御方法
US11828795B1 (en) 2022-10-21 2023-11-28 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones
CN120677396A (zh) 2022-10-21 2025-09-19 新加坡商永科股份有限公司 用于对多个区域进行独立的控制的热头
US11693051B1 (en) 2022-10-21 2023-07-04 AEM Holdings Ltd. Thermal head for independent control of zones
US11796589B1 (en) 2022-10-21 2023-10-24 AEM Holdings Ltd. Thermal head for independent control of zones
US11656272B1 (en) 2022-10-21 2023-05-23 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones
TWI878761B (zh) 2022-12-13 2025-04-01 致茂電子股份有限公司 使用多相熱介面構件之電子元件測試方法
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement
US20250172608A1 (en) * 2023-11-28 2025-05-29 Smart Modular Technologies, Inc. Systems and methods for testing thermal conditioning of an integrated circuit (ic)
WO2026055252A1 (en) * 2024-09-03 2026-03-12 Tyco Fire & Security Gmbh Multi-temperature hydronic system and method with controls and fluid management

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3241602A (en) * 1963-06-25 1966-03-22 Andreassen Roar Heating and cooling system and control therefor
US3259175A (en) * 1964-06-15 1966-07-05 Robert A Kraus Heating and cooling system for molds
US3721386A (en) * 1970-10-23 1973-03-20 J Brick Temperature-volume controlled mixing valve
US4512161A (en) * 1983-03-03 1985-04-23 Control Data Corporation Dew point sensitive computer cooling system
CA1303238C (en) * 1988-05-09 1992-06-09 Kazuhiko Umezawa Flat cooling structure of integrated circuit
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
US5918469A (en) * 1996-01-11 1999-07-06 Silicon Thermal, Inc. Cooling system and method of cooling electronic devices
US5977785A (en) * 1996-05-28 1999-11-02 Burward-Hoy; Trevor Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment
US5802856A (en) * 1996-07-31 1998-09-08 Stanford University Multizone bake/chill thermal cycling module
US6593761B1 (en) * 1997-11-28 2003-07-15 Kabushiki Kaisha Toshiba Test handler for semiconductor device
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6091062A (en) * 1998-01-27 2000-07-18 Kinetrix, Inc. Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly
JP5000803B2 (ja) * 1998-07-14 2012-08-15 デルタ・デザイン・インコーポレイテッド 電子デバイスの速応温度反復制御を液体を利用して広範囲に行うための装置、方法
US6362944B1 (en) * 2000-05-19 2002-03-26 Unisys Corporation System for regulating the temperature of IC-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heater
US6412551B1 (en) * 2000-05-19 2002-07-02 Unisys Corporation System for regulating the temperature of IC-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the IC-chips
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
KR100436657B1 (ko) * 2001-12-17 2004-06-22 미래산업 주식회사 반도체 소자 테스트 핸들러의 소자 가열 및 냉각장치
US7100389B1 (en) * 2002-07-16 2006-09-05 Delta Design, Inc. Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
US6861861B2 (en) * 2002-07-24 2005-03-01 Lg Electronics Inc. Device for compensating for a test temperature deviation in a semiconductor device handler
US7114556B2 (en) * 2002-12-17 2006-10-03 Micro Control Company Burn-in oven heat exchanger having improved thermal conduction
JP2005079483A (ja) * 2003-09-03 2005-03-24 Hitachi Ltd 電子機器装置
CN2684380Y (zh) * 2004-03-13 2005-03-09 林智忠 封闭式整体液冷散热器
US7254957B2 (en) * 2005-02-15 2007-08-14 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
CN2864986Y (zh) * 2005-12-19 2007-01-31 元山科技工业股份有限公司 用于电子元件的散热装置
CN101005745A (zh) * 2006-01-20 2007-07-25 刘胜 用于电子器件的微喷射流冷却系统
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature

Also Published As

Publication number Publication date
JP2010535417A (ja) 2010-11-18
TW200921872A (en) 2009-05-16
TWI404178B (zh) 2013-08-01
US20100224352A1 (en) 2010-09-09
US8896335B2 (en) 2014-11-25
WO2009017495A1 (en) 2009-02-05
KR101047832B1 (ko) 2011-07-08
KR20090095456A (ko) 2009-09-09
DE112007003606T5 (de) 2010-06-10
CN101495819A (zh) 2009-07-29
CN101495819B (zh) 2011-08-17

Similar Documents

Publication Publication Date Title
JP4790087B2 (ja) 電子部品の温度制御装置
JP7649818B2 (ja) 比例式熱流体送達システムを使用した基板キャリア
US7355428B2 (en) Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing
KR101148832B1 (ko) 전자 디바이스용 열 제어기
JP3623696B2 (ja) ワークステーション温度制御システム及びワークステーション温度調節方法
US8025097B2 (en) Method and apparatus for setting and controlling temperature
US9983259B2 (en) Dual loop type temperature control module and electronic device testing apparatus provided with the same
JP7438985B2 (ja) 温度制御システム及び温度制御方法
TW201810495A (zh) 用於電漿處理腔室中晶圓載體的先進溫度控制
JP2004527764A (ja) 電子デバイスの温度制御装置及び温度制御方法
KR20150136597A (ko) 기판 검사 장치 및 기판 온도 조정 방법
KR100752408B1 (ko) 기판의 열 관리 시스템
JPH10116867A (ja) 半導体ウェーハの試験方法及び試験装置用温度調節器
JPH10256325A (ja) 半導体ウェーハの試験装置用温度調節プレート
JPH11224127A (ja) 温度制御装置
KR100367298B1 (ko) 열전 발전 모듈의 수명 시험 장치
JPH07271452A (ja) 基板の温度調節用プレート装置
JP2000089832A (ja) 温度制御装置
JP2007512715A (ja) 熱制御式チャックにおける電気的ノイズを低減する装置および方法
SG175588A1 (en) Thermal controller for electronic devices

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100730

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100730

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20100921

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100921

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101004

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20101027

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101116

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110113

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110412

R155 Notification before disposition of declining of application

Free format text: JAPANESE INTERMEDIATE CODE: R155

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110719

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140729

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140729

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees