CN101495819B - 电子设备热控制装置 - Google Patents

电子设备热控制装置 Download PDF

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Publication number
CN101495819B
CN101495819B CN2007800285150A CN200780028515A CN101495819B CN 101495819 B CN101495819 B CN 101495819B CN 2007800285150 A CN2007800285150 A CN 2007800285150A CN 200780028515 A CN200780028515 A CN 200780028515A CN 101495819 B CN101495819 B CN 101495819B
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China
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fluid
temperature
cold
mixed
heat sink
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Chinese (zh)
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CN101495819A (zh
Inventor
拉里·斯塔基
阿纳斯塔西奥·戈纳斯
罗伯特爱德华·阿尔代
大卫·余
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Advantest Corp
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Advantest Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H10W40/475—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Temperature (AREA)
CN2007800285150A 2007-07-30 2007-07-30 电子设备热控制装置 Active CN101495819B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2007/074727 WO2009017495A1 (en) 2007-07-30 2007-07-30 Thermal controller for electronic devices

Publications (2)

Publication Number Publication Date
CN101495819A CN101495819A (zh) 2009-07-29
CN101495819B true CN101495819B (zh) 2011-08-17

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CN2007800285150A Active CN101495819B (zh) 2007-07-30 2007-07-30 电子设备热控制装置

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US (1) US8896335B2 (https=)
JP (1) JP4790087B2 (https=)
KR (1) KR101047832B1 (https=)
CN (1) CN101495819B (https=)
DE (1) DE112007003606T5 (https=)
TW (1) TWI404178B (https=)
WO (1) WO2009017495A1 (https=)

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US9360514B2 (en) * 2012-04-05 2016-06-07 Board Of Regents, The University Of Texas System Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
US9111899B2 (en) 2012-09-13 2015-08-18 Lenovo Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks
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US10791651B2 (en) 2016-05-31 2020-09-29 Carbice Corporation Carbon nanotube-based thermal interface materials and methods of making and using thereof
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TWI755492B (zh) 2017-03-06 2022-02-21 美商卡爾拜斯有限公司 基於碳納米管的熱界面材料及其製造和使用方法
US10527355B2 (en) 2017-06-13 2020-01-07 Microsoft Technology Licensing, Llc Devices, methods, and systems for thermal management
JP6948182B2 (ja) * 2017-08-04 2021-10-13 株式会社アドバンテスト 磁気センサ試験装置
CN107543366A (zh) * 2017-10-11 2018-01-05 浙江海洋大学 一种在低电压下真空容器的温度调控系统
US10753971B2 (en) * 2018-04-03 2020-08-25 Advantest Corporation Heat exchanger and electronic device handling apparatus including the same
CN110261150A (zh) * 2019-06-04 2019-09-20 中国科学院合肥物质科学研究院 一种300-4.5k温区多工况低温换热器的测试装置
CN110488796A (zh) * 2019-08-14 2019-11-22 武汉克莱美特环境设备有限公司 一种液冷散热电路板综合环境模拟箱
CN112239019A (zh) * 2019-11-15 2021-01-19 林超文 自监测防高温损坏的数码产品收纳盒
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JP2023149981A (ja) 2022-03-31 2023-10-16 株式会社アドバンテスト 温度調整装置、電子部品ハンドリング装置、電子部品試験装置、及びｄｕｔの温度調整方法
JP2023177687A (ja) * 2022-06-02 2023-12-14 株式会社アドバンテスト ヒータ駆動制御装置、電子部品ハンドリング装置、電子部品試験装置、及び、ヒータ駆動制御方法
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TWI878761B (zh) 2022-12-13 2025-04-01 致茂電子股份有限公司 使用多相熱介面構件之電子元件測試方法
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附图1-5.
附图3-10.

Also Published As

Publication number Publication date
JP2010535417A (ja) 2010-11-18
JP4790087B2 (ja) 2011-10-12
TW200921872A (en) 2009-05-16
TWI404178B (zh) 2013-08-01
US20100224352A1 (en) 2010-09-09
US8896335B2 (en) 2014-11-25
WO2009017495A1 (en) 2009-02-05
KR101047832B1 (ko) 2011-07-08
KR20090095456A (ko) 2009-09-09
DE112007003606T5 (de) 2010-06-10
CN101495819A (zh) 2009-07-29

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