KR101043466B1 - 재료 제거의 제어를 달성하는 연마 공정의 모델링 - Google Patents

재료 제거의 제어를 달성하는 연마 공정의 모델링 Download PDF

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Publication number
KR101043466B1
KR101043466B1 KR1020057014065A KR20057014065A KR101043466B1 KR 101043466 B1 KR101043466 B1 KR 101043466B1 KR 1020057014065 A KR1020057014065 A KR 1020057014065A KR 20057014065 A KR20057014065 A KR 20057014065A KR 101043466 B1 KR101043466 B1 KR 101043466B1
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South Korea
Prior art keywords
abrasive
delete delete
workpiece
polishing
cutting rate
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Expired - Fee Related
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KR1020057014065A
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English (en)
Korean (ko)
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KR20050095882A (ko
Inventor
게리 엠. 팜그렌
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20050095882A publication Critical patent/KR20050095882A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Numerical Control (AREA)
  • Automatic Control Of Machine Tools (AREA)
KR1020057014065A 2003-01-31 2003-12-23 재료 제거의 제어를 달성하는 연마 공정의 모델링 Expired - Fee Related KR101043466B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/355,659 US7089081B2 (en) 2003-01-31 2003-01-31 Modeling an abrasive process to achieve controlled material removal
US10/355,659 2003-01-31

Publications (2)

Publication Number Publication Date
KR20050095882A KR20050095882A (ko) 2005-10-04
KR101043466B1 true KR101043466B1 (ko) 2011-06-23

Family

ID=32770584

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057014065A Expired - Fee Related KR101043466B1 (ko) 2003-01-31 2003-12-23 재료 제거의 제어를 달성하는 연마 공정의 모델링

Country Status (9)

Country Link
US (1) US7089081B2 (enExample)
EP (1) EP1590128A1 (enExample)
JP (1) JP2006513869A (enExample)
KR (1) KR101043466B1 (enExample)
CN (1) CN100446927C (enExample)
AU (1) AU2003299932A1 (enExample)
BR (1) BR0318062A (enExample)
TW (1) TWI318909B (enExample)
WO (1) WO2004069477A1 (enExample)

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JP4183672B2 (ja) * 2004-10-01 2008-11-19 株式会社ノリタケカンパニーリミテド ロータリ研削方法およびロータリ研削盤の制御装置
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US7473162B1 (en) * 2006-02-06 2009-01-06 Chien-Min Sung Pad conditioner dresser with varying pressure
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
KR101050796B1 (ko) * 2008-09-17 2011-07-20 주식회사 포스코 시험편 몰드 연마방법
CN102581744A (zh) * 2011-01-12 2012-07-18 上海运青制版有限公司 一种研磨机自动控制方法及装置
CN108177094B (zh) 2012-08-02 2021-01-15 3M创新有限公司 具有精确成形特征部的研磨元件前体及其制造方法
SG11201500802TA (en) 2012-08-02 2015-04-29 3M Innovative Properties Co Abrasive articles with precisely shaped features and method of making thereof
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
US20210308825A1 (en) * 2018-08-27 2021-10-07 3M Innovative Properties Company A system for monitoring one or more of an abrading tool, a consumable abrasive product and a workpiece
FI131603B1 (en) * 2024-01-30 2025-08-04 Mirka Ltd Method and system for producing abrasive articles

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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000073020A1 (en) * 1999-05-28 2000-12-07 3M Innovative Properties Company Abrasive processing apparatus and method employing encoded abrasive product

Also Published As

Publication number Publication date
AU2003299932A1 (en) 2004-08-30
TWI318909B (en) 2010-01-01
KR20050095882A (ko) 2005-10-04
EP1590128A1 (en) 2005-11-02
WO2004069477A1 (en) 2004-08-19
JP2006513869A (ja) 2006-04-27
CN100446927C (zh) 2008-12-31
BR0318062A (pt) 2005-12-20
TW200510121A (en) 2005-03-16
US20040153197A1 (en) 2004-08-05
CN1744969A (zh) 2006-03-08
US7089081B2 (en) 2006-08-08

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