JP2006513869A - 制御された材料の除去を実現するための研磨工程のモデル化 - Google Patents

制御された材料の除去を実現するための研磨工程のモデル化 Download PDF

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Publication number
JP2006513869A
JP2006513869A JP2004568049A JP2004568049A JP2006513869A JP 2006513869 A JP2006513869 A JP 2006513869A JP 2004568049 A JP2004568049 A JP 2004568049A JP 2004568049 A JP2004568049 A JP 2004568049A JP 2006513869 A JP2006513869 A JP 2006513869A
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Japan
Prior art keywords
abrasive
workpiece
polishing
cutting speed
model
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Ceased
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JP2004568049A
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English (en)
Japanese (ja)
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JP2006513869A5 (enExample
Inventor
エム． パームグレン，ゲイリー
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2006513869A publication Critical patent/JP2006513869A/ja
Publication of JP2006513869A5 publication Critical patent/JP2006513869A5/ja
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Numerical Control (AREA)
  • Automatic Control Of Machine Tools (AREA)
JP2004568049A 2003-01-31 2003-12-23 制御された材料の除去を実現するための研磨工程のモデル化 Ceased JP2006513869A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/355,659 US7089081B2 (en) 2003-01-31 2003-01-31 Modeling an abrasive process to achieve controlled material removal
PCT/US2003/041302 WO2004069477A1 (en) 2003-01-31 2003-12-23 Modeling an abrasive process to achieve controlled material removal

Publications (2)

Publication Number Publication Date
JP2006513869A true JP2006513869A (ja) 2006-04-27
JP2006513869A5 JP2006513869A5 (enExample) 2007-02-08

Family

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Family Applications (1)

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JP2004568049A Ceased JP2006513869A (ja) 2003-01-31 2003-12-23 制御された材料の除去を実現するための研磨工程のモデル化

Country Status (9)

Country Link
US (1) US7089081B2 (enExample)
EP (1) EP1590128A1 (enExample)
JP (1) JP2006513869A (enExample)
KR (1) KR101043466B1 (enExample)
CN (1) CN100446927C (enExample)
AU (1) AU2003299932A1 (enExample)
BR (1) BR0318062A (enExample)
TW (1) TWI318909B (enExample)
WO (1) WO2004069477A1 (enExample)

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US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US7473162B1 (en) * 2006-02-06 2009-01-06 Chien-Min Sung Pad conditioner dresser with varying pressure
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
KR101050796B1 (ko) * 2008-09-17 2011-07-20 주식회사 포스코 시험편 몰드 연마방법
CN102581744A (zh) * 2011-01-12 2012-07-18 上海运青制版有限公司 一种研磨机自动控制方法及装置
CN108177094B (zh) 2012-08-02 2021-01-15 3M创新有限公司 具有精确成形特征部的研磨元件前体及其制造方法
SG11201500802TA (en) 2012-08-02 2015-04-29 3M Innovative Properties Co Abrasive articles with precisely shaped features and method of making thereof
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
US20210308825A1 (en) * 2018-08-27 2021-10-07 3M Innovative Properties Company A system for monitoring one or more of an abrading tool, a consumable abrasive product and a workpiece
FI131603B1 (en) * 2024-01-30 2025-08-04 Mirka Ltd Method and system for producing abrasive articles

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Also Published As

Publication number Publication date
AU2003299932A1 (en) 2004-08-30
TWI318909B (en) 2010-01-01
KR20050095882A (ko) 2005-10-04
EP1590128A1 (en) 2005-11-02
WO2004069477A1 (en) 2004-08-19
CN100446927C (zh) 2008-12-31
BR0318062A (pt) 2005-12-20
KR101043466B1 (ko) 2011-06-23
TW200510121A (en) 2005-03-16
US20040153197A1 (en) 2004-08-05
CN1744969A (zh) 2006-03-08
US7089081B2 (en) 2006-08-08

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