BR0318062A - Método, sistema, e, meio legìvel por computador - Google Patents

Método, sistema, e, meio legìvel por computador

Info

Publication number
BR0318062A
BR0318062A BR0318062-0A BR0318062A BR0318062A BR 0318062 A BR0318062 A BR 0318062A BR 0318062 A BR0318062 A BR 0318062A BR 0318062 A BR0318062 A BR 0318062A
Authority
BR
Brazil
Prior art keywords
abrasive article
abrasive
roughing
manufacturing process
machine
Prior art date
Application number
BR0318062-0A
Other languages
English (en)
Inventor
Gary M Palmgren
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BR0318062A publication Critical patent/BR0318062A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Automatic Control Of Machine Tools (AREA)

Abstract

"MéTODO, SISTEMA, E, MEIO LEGìVEL POR COMPUTADOR". Em geral, são descritas técnicas que permitem um processo abrasivo de fabricação obter um parâmetro de desempenho controlado, por exemplo, uma quantidade de remoção de material, sem exigir o uso de controles de retroalimentação dentro do processo abrasivo de fabricação. Por exemplo, um sistema inclui uma máquina para desbastar uma peça de trabalho com um artigo abrasivo, e um controlador para controlar a aplicação do artigo abrasivo à pega de trabalho pela máquina para obter uma taxa de corte substancialmente constante para o artigo abrasivo. O controlador controla uma ou mais variáveis de processo de acordo com um modelo matemático de circuito aberto que relaciona a taxa de corte do artigo abrasivo a uma força de aplicação do artigo abrasivo para obter remoção controlada de material. Por exemplo, uma taxa de corte constante pode ser obtida ou uma quantidade fixa de material pode ser removida enquanto desbastando uma ou mais peças de trabalho de acordo com o modelo.
BR0318062-0A 2003-01-31 2003-12-23 Método, sistema, e, meio legìvel por computador BR0318062A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/355,659 US7089081B2 (en) 2003-01-31 2003-01-31 Modeling an abrasive process to achieve controlled material removal
PCT/US2003/041302 WO2004069477A1 (en) 2003-01-31 2003-12-23 Modeling an abrasive process to achieve controlled material removal

Publications (1)

Publication Number Publication Date
BR0318062A true BR0318062A (pt) 2005-12-20

Family

ID=32770584

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0318062-0A BR0318062A (pt) 2003-01-31 2003-12-23 Método, sistema, e, meio legìvel por computador

Country Status (9)

Country Link
US (1) US7089081B2 (pt)
EP (1) EP1590128A1 (pt)
JP (1) JP2006513869A (pt)
KR (1) KR101043466B1 (pt)
CN (1) CN100446927C (pt)
AU (1) AU2003299932A1 (pt)
BR (1) BR0318062A (pt)
TW (1) TWI318909B (pt)
WO (1) WO2004069477A1 (pt)

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JP4183672B2 (ja) * 2004-10-01 2008-11-19 株式会社ノリタケカンパニーリミテド ロータリ研削方法およびロータリ研削盤の制御装置
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US7473162B1 (en) * 2006-02-06 2009-01-06 Chien-Min Sung Pad conditioner dresser with varying pressure
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
KR101050796B1 (ko) * 2008-09-17 2011-07-20 주식회사 포스코 시험편 몰드 연마방법
CN102581744A (zh) * 2011-01-12 2012-07-18 上海运青制版有限公司 一种研磨机自动控制方法及装置
KR102089383B1 (ko) 2012-08-02 2020-03-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 정밀하게 형상화된 특징부를 갖는 연마 물품 및 그의 제조 방법
WO2014022453A1 (en) 2012-08-02 2014-02-06 3M Innovative Properties Company Abrasive element precursor with precisely shaped features and method of making thereof
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
EP3843945A1 (en) * 2018-08-27 2021-07-07 3M Innovative Properties Company A system for monitoring one or more of an abrading tool, a consumable abrasive product and a workpiece

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JPH08505488A (ja) * 1993-01-12 1996-06-11 ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー データカートリッジのテープ駆動機構におけるトラックのサーボ制御方法
CN1055652C (zh) * 1993-03-12 2000-08-23 胡强 时间控制磨削方法及装置
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Also Published As

Publication number Publication date
KR20050095882A (ko) 2005-10-04
JP2006513869A (ja) 2006-04-27
TWI318909B (en) 2010-01-01
EP1590128A1 (en) 2005-11-02
AU2003299932A1 (en) 2004-08-30
CN1744969A (zh) 2006-03-08
CN100446927C (zh) 2008-12-31
US20040153197A1 (en) 2004-08-05
KR101043466B1 (ko) 2011-06-23
US7089081B2 (en) 2006-08-08
WO2004069477A1 (en) 2004-08-19
TW200510121A (en) 2005-03-16

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A ANUIDADE

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2073 DE 28/09/2010.