CN100446927C - 对研磨工艺建模以实现受控材料去除 - Google Patents

对研磨工艺建模以实现受控材料去除 Download PDF

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Publication number
CN100446927C
CN100446927C CNB2003801094326A CN200380109432A CN100446927C CN 100446927 C CN100446927 C CN 100446927C CN B2003801094326 A CNB2003801094326 A CN B2003801094326A CN 200380109432 A CN200380109432 A CN 200380109432A CN 100446927 C CN100446927 C CN 100446927C
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CN
China
Prior art keywords
workpiece
abrasive
grinding
abrasive article
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2003801094326A
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English (en)
Chinese (zh)
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CN1744969A (zh
Inventor
格雷·M·帕尔姆格伦
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN1744969A publication Critical patent/CN1744969A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Numerical Control (AREA)
  • Automatic Control Of Machine Tools (AREA)
CNB2003801094326A 2003-01-31 2003-12-23 对研磨工艺建模以实现受控材料去除 Expired - Fee Related CN100446927C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/355,659 US7089081B2 (en) 2003-01-31 2003-01-31 Modeling an abrasive process to achieve controlled material removal
US10/355,659 2003-01-31

Publications (2)

Publication Number Publication Date
CN1744969A CN1744969A (zh) 2006-03-08
CN100446927C true CN100446927C (zh) 2008-12-31

Family

ID=32770584

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003801094326A Expired - Fee Related CN100446927C (zh) 2003-01-31 2003-12-23 对研磨工艺建模以实现受控材料去除

Country Status (9)

Country Link
US (1) US7089081B2 (enExample)
EP (1) EP1590128A1 (enExample)
JP (1) JP2006513869A (enExample)
KR (1) KR101043466B1 (enExample)
CN (1) CN100446927C (enExample)
AU (1) AU2003299932A1 (enExample)
BR (1) BR0318062A (enExample)
TW (1) TWI318909B (enExample)
WO (1) WO2004069477A1 (enExample)

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JP4183672B2 (ja) * 2004-10-01 2008-11-19 株式会社ノリタケカンパニーリミテド ロータリ研削方法およびロータリ研削盤の制御装置
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US7473162B1 (en) * 2006-02-06 2009-01-06 Chien-Min Sung Pad conditioner dresser with varying pressure
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
KR101050796B1 (ko) * 2008-09-17 2011-07-20 주식회사 포스코 시험편 몰드 연마방법
CN102581744A (zh) * 2011-01-12 2012-07-18 上海运青制版有限公司 一种研磨机自动控制方法及装置
CN108177094B (zh) 2012-08-02 2021-01-15 3M创新有限公司 具有精确成形特征部的研磨元件前体及其制造方法
SG11201500802TA (en) 2012-08-02 2015-04-29 3M Innovative Properties Co Abrasive articles with precisely shaped features and method of making thereof
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
US20210308825A1 (en) * 2018-08-27 2021-10-07 3M Innovative Properties Company A system for monitoring one or more of an abrading tool, a consumable abrasive product and a workpiece
FI131603B1 (en) * 2024-01-30 2025-08-04 Mirka Ltd Method and system for producing abrasive articles

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WO2002102548A1 (en) * 2001-06-19 2002-12-27 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life

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US5908283A (en) 1996-11-26 1999-06-01 United Parcel Service Of Americia, Inc. Method and apparatus for palletizing packages of random size and weight
DE19722121A1 (de) 1997-05-27 1998-12-03 Wendt Gmbh Vorrichtung zur Kennzeichnung und automatischen Identifikation und Klassifikation von Werkzeugen
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TW466153B (en) 1999-06-22 2001-12-01 Applied Materials Inc Method and apparatus for measuring a pad profile and closed loop control of a pad conditioning process
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4505074A (en) * 1981-05-21 1985-03-19 Seiko Seiki Kabushiki Kaisha Grinding machine control system for intermittently measuring workpiece size
CN1092008A (zh) * 1993-03-12 1994-09-14 胡强 时间控制磨削方法及装置
US5609718A (en) * 1995-09-29 1997-03-11 Micron Technology, Inc. Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
DE19915909A1 (de) * 1998-12-11 2000-06-21 Steinemann Ag St Gallen Verfahren zur Steuerung des Schleifprozesses sowie Rechnersteuerung für Breitschleifmaschine
WO2002102548A1 (en) * 2001-06-19 2002-12-27 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life

Also Published As

Publication number Publication date
AU2003299932A1 (en) 2004-08-30
TWI318909B (en) 2010-01-01
KR20050095882A (ko) 2005-10-04
EP1590128A1 (en) 2005-11-02
WO2004069477A1 (en) 2004-08-19
JP2006513869A (ja) 2006-04-27
BR0318062A (pt) 2005-12-20
KR101043466B1 (ko) 2011-06-23
TW200510121A (en) 2005-03-16
US20040153197A1 (en) 2004-08-05
CN1744969A (zh) 2006-03-08
US7089081B2 (en) 2006-08-08

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Granted publication date: 20081231

Termination date: 20121223