TWI318909B - Modeling an abrasive process to achieve controlled material removal - Google Patents

Modeling an abrasive process to achieve controlled material removal

Info

Publication number
TWI318909B
TWI318909B TW093100248A TW93100248A TWI318909B TW I318909 B TWI318909 B TW I318909B TW 093100248 A TW093100248 A TW 093100248A TW 93100248 A TW93100248 A TW 93100248A TW I318909 B TWI318909 B TW I318909B
Authority
TW
Taiwan
Prior art keywords
modeling
material removal
achieve controlled
controlled material
abrasive process
Prior art date
Application number
TW093100248A
Other languages
English (en)
Chinese (zh)
Other versions
TW200510121A (en
Inventor
Gary Marven Palmgren
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200510121A publication Critical patent/TW200510121A/zh
Application granted granted Critical
Publication of TWI318909B publication Critical patent/TWI318909B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Numerical Control (AREA)
  • Automatic Control Of Machine Tools (AREA)
TW093100248A 2003-01-31 2004-01-06 Modeling an abrasive process to achieve controlled material removal TWI318909B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/355,659 US7089081B2 (en) 2003-01-31 2003-01-31 Modeling an abrasive process to achieve controlled material removal

Publications (2)

Publication Number Publication Date
TW200510121A TW200510121A (en) 2005-03-16
TWI318909B true TWI318909B (en) 2010-01-01

Family

ID=32770584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093100248A TWI318909B (en) 2003-01-31 2004-01-06 Modeling an abrasive process to achieve controlled material removal

Country Status (9)

Country Link
US (1) US7089081B2 (enExample)
EP (1) EP1590128A1 (enExample)
JP (1) JP2006513869A (enExample)
KR (1) KR101043466B1 (enExample)
CN (1) CN100446927C (enExample)
AU (1) AU2003299932A1 (enExample)
BR (1) BR0318062A (enExample)
TW (1) TWI318909B (enExample)
WO (1) WO2004069477A1 (enExample)

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DE10337489B4 (de) * 2003-08-14 2007-04-19 P & L Gmbh & Co. Kg Verfahren zur automatischen Werkzeugverschleißkorrektur
JP4183672B2 (ja) * 2004-10-01 2008-11-19 株式会社ノリタケカンパニーリミテド ロータリ研削方法およびロータリ研削盤の制御装置
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US7473162B1 (en) * 2006-02-06 2009-01-06 Chien-Min Sung Pad conditioner dresser with varying pressure
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
KR101050796B1 (ko) * 2008-09-17 2011-07-20 주식회사 포스코 시험편 몰드 연마방법
CN102581744A (zh) * 2011-01-12 2012-07-18 上海运青制版有限公司 一种研磨机自动控制方法及装置
CN108177094B (zh) 2012-08-02 2021-01-15 3M创新有限公司 具有精确成形特征部的研磨元件前体及其制造方法
SG11201500802TA (en) 2012-08-02 2015-04-29 3M Innovative Properties Co Abrasive articles with precisely shaped features and method of making thereof
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
US20210308825A1 (en) * 2018-08-27 2021-10-07 3M Innovative Properties Company A system for monitoring one or more of an abrading tool, a consumable abrasive product and a workpiece
FI131603B1 (en) * 2024-01-30 2025-08-04 Mirka Ltd Method and system for producing abrasive articles

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US5344688A (en) 1992-08-19 1994-09-06 Minnesota Mining And Manufacturing Company Coated abrasive article and a method of making same
KR960700502A (ko) 1993-01-12 1996-01-20 캐롤린 앨리스 베이츠 데이타 카트리지 테이프 드라이브의 트랙서보 제어방법(track servo control method for data cartridge tape drives)
CN1055652C (zh) * 1993-03-12 2000-08-23 胡强 时间控制磨削方法及装置
US5441549A (en) 1993-04-19 1995-08-15 Minnesota Mining And Manufacturing Company Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder
CZ144294A3 (en) 1993-06-14 1994-12-15 Stiefenhofer Gmbh C Method of controlling movement of material during its treatment by sterilization and apparatus for making the same
US5508596A (en) 1993-10-07 1996-04-16 Omax Corporation Motion control with precomputation
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US6171174B1 (en) * 1998-06-26 2001-01-09 Advanced Micro Devices System and method for controlling a multi-arm polishing tool
US6000997A (en) * 1998-07-10 1999-12-14 Aplex, Inc. Temperature regulation in a CMP process
US6206759B1 (en) 1998-11-30 2001-03-27 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines
DE19915909C2 (de) * 1998-12-11 2003-05-28 Steinemann Technology Ag St Ga Verfahren zur Steuerung des Schleifprozesses sowie Rechnersteuerung für Breitschleifmaschine
US6322427B1 (en) * 1999-04-30 2001-11-27 Applied Materials, Inc. Conditioning fixed abrasive articles
US6264533B1 (en) * 1999-05-28 2001-07-24 3M Innovative Properties Company Abrasive processing apparatus and method employing encoded abrasive product
TW466153B (en) 1999-06-22 2001-12-01 Applied Materials Inc Method and apparatus for measuring a pad profile and closed loop control of a pad conditioning process
US6293139B1 (en) 1999-11-03 2001-09-25 Memc Electronic Materials, Inc. Method of determining performance characteristics of polishing pads
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US6896583B2 (en) 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
EP1247616B1 (en) * 2001-04-02 2006-07-05 Infineon Technologies AG Method for conditioning a polishing pad surface
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Also Published As

Publication number Publication date
AU2003299932A1 (en) 2004-08-30
KR20050095882A (ko) 2005-10-04
EP1590128A1 (en) 2005-11-02
WO2004069477A1 (en) 2004-08-19
JP2006513869A (ja) 2006-04-27
CN100446927C (zh) 2008-12-31
BR0318062A (pt) 2005-12-20
KR101043466B1 (ko) 2011-06-23
TW200510121A (en) 2005-03-16
US20040153197A1 (en) 2004-08-05
CN1744969A (zh) 2006-03-08
US7089081B2 (en) 2006-08-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees