JP2006513869A5 - - Google Patents

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Publication number
JP2006513869A5
JP2006513869A5 JP2004568049A JP2004568049A JP2006513869A5 JP 2006513869 A5 JP2006513869 A5 JP 2006513869A5 JP 2004568049 A JP2004568049 A JP 2004568049A JP 2004568049 A JP2004568049 A JP 2004568049A JP 2006513869 A5 JP2006513869 A5 JP 2006513869A5
Authority
JP
Japan
Prior art keywords
polishing
workpiece
model
process control
cutting speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2004568049A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006513869A (ja
Filing date
Publication date
Priority claimed from US10/355,659 external-priority patent/US7089081B2/en
Application filed filed Critical
Publication of JP2006513869A publication Critical patent/JP2006513869A/ja
Publication of JP2006513869A5 publication Critical patent/JP2006513869A5/ja
Ceased legal-status Critical Current

Links

JP2004568049A 2003-01-31 2003-12-23 制御された材料の除去を実現するための研磨工程のモデル化 Ceased JP2006513869A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/355,659 US7089081B2 (en) 2003-01-31 2003-01-31 Modeling an abrasive process to achieve controlled material removal
PCT/US2003/041302 WO2004069477A1 (en) 2003-01-31 2003-12-23 Modeling an abrasive process to achieve controlled material removal

Publications (2)

Publication Number Publication Date
JP2006513869A JP2006513869A (ja) 2006-04-27
JP2006513869A5 true JP2006513869A5 (enExample) 2007-02-08

Family

ID=32770584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004568049A Ceased JP2006513869A (ja) 2003-01-31 2003-12-23 制御された材料の除去を実現するための研磨工程のモデル化

Country Status (9)

Country Link
US (1) US7089081B2 (enExample)
EP (1) EP1590128A1 (enExample)
JP (1) JP2006513869A (enExample)
KR (1) KR101043466B1 (enExample)
CN (1) CN100446927C (enExample)
AU (1) AU2003299932A1 (enExample)
BR (1) BR0318062A (enExample)
TW (1) TWI318909B (enExample)
WO (1) WO2004069477A1 (enExample)

Families Citing this family (15)

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Publication number Priority date Publication date Assignee Title
DE10337489B4 (de) * 2003-08-14 2007-04-19 P & L Gmbh & Co. Kg Verfahren zur automatischen Werkzeugverschleißkorrektur
JP4183672B2 (ja) * 2004-10-01 2008-11-19 株式会社ノリタケカンパニーリミテド ロータリ研削方法およびロータリ研削盤の制御装置
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US7473162B1 (en) * 2006-02-06 2009-01-06 Chien-Min Sung Pad conditioner dresser with varying pressure
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
KR101050796B1 (ko) * 2008-09-17 2011-07-20 주식회사 포스코 시험편 몰드 연마방법
CN102581744A (zh) * 2011-01-12 2012-07-18 上海运青制版有限公司 一种研磨机自动控制方法及装置
CN108177094B (zh) 2012-08-02 2021-01-15 3M创新有限公司 具有精确成形特征部的研磨元件前体及其制造方法
SG11201500802TA (en) 2012-08-02 2015-04-29 3M Innovative Properties Co Abrasive articles with precisely shaped features and method of making thereof
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
US20210308825A1 (en) * 2018-08-27 2021-10-07 3M Innovative Properties Company A system for monitoring one or more of an abrading tool, a consumable abrasive product and a workpiece
FI131603B1 (en) * 2024-01-30 2025-08-04 Mirka Ltd Method and system for producing abrasive articles

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US5441549A (en) 1993-04-19 1995-08-15 Minnesota Mining And Manufacturing Company Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder
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US6146248A (en) 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
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US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
EP1247616B1 (en) * 2001-04-02 2006-07-05 Infineon Technologies AG Method for conditioning a polishing pad surface
US6564116B2 (en) 2001-04-06 2003-05-13 Gou-Jen Wang Method for determining efficiently parameters in chemical-mechanical polishing (CMP)
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