KR100968184B1 - 금속화 엘라스토머 전기 접점 - Google Patents

금속화 엘라스토머 전기 접점 Download PDF

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Publication number
KR100968184B1
KR100968184B1 KR1020077013680A KR20077013680A KR100968184B1 KR 100968184 B1 KR100968184 B1 KR 100968184B1 KR 1020077013680 A KR1020077013680 A KR 1020077013680A KR 20077013680 A KR20077013680 A KR 20077013680A KR 100968184 B1 KR100968184 B1 KR 100968184B1
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KR
South Korea
Prior art keywords
carrier
elastomeric
electrically conductive
electrical
elastomeric material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077013680A
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English (en)
Korean (ko)
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KR20070112107A (ko
Inventor
게레쓰 제프리 호그햄
알리 에프잘리
스티븐 알렌 코르데스
폴 더블유 코테스
매튜 제이 파리넬리
쉐리프 에이 고마
알퐁소 피 랜제타
다니엘 피터 모리스
조안나 로스너
니사 요하난
Original Assignee
인터내셔널 비지네스 머신즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인터내셔널 비지네스 머신즈 코포레이션 filed Critical 인터내셔널 비지네스 머신즈 코포레이션
Publication of KR20070112107A publication Critical patent/KR20070112107A/ko
Application granted granted Critical
Publication of KR100968184B1 publication Critical patent/KR100968184B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Micromachines (AREA)
KR1020077013680A 2004-12-16 2005-09-30 금속화 엘라스토머 전기 접점 Expired - Fee Related KR100968184B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63666604P 2004-12-16 2004-12-16
US60/636,666 2004-12-16

Publications (2)

Publication Number Publication Date
KR20070112107A KR20070112107A (ko) 2007-11-22
KR100968184B1 true KR100968184B1 (ko) 2010-07-05

Family

ID=37570885

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020077013680A Expired - Fee Related KR100968184B1 (ko) 2004-12-16 2005-09-30 금속화 엘라스토머 전기 접점
KR1020077013681A Expired - Fee Related KR100968183B1 (ko) 2004-12-16 2005-09-30 금속화 엘라스토머 프로브 구조

Family Applications After (1)

Application Number Title Priority Date Filing Date
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Country Status (6)

Country Link
US (2) US7452212B2 (enExample)
EP (1) EP1834379B1 (enExample)
JP (2) JP5220417B2 (enExample)
KR (2) KR100968184B1 (enExample)
CN (2) CN101288205B (enExample)
WO (2) WO2007001391A2 (enExample)

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TWI275187B (en) * 2005-11-30 2007-03-01 Advanced Semiconductor Eng Flip chip package and manufacturing method of the same
US7585173B2 (en) * 2007-03-30 2009-09-08 Tyco Electronics Corporation Elastomeric electrical contact
US8832936B2 (en) * 2007-04-30 2014-09-16 International Business Machines Corporation Method of forming metallized elastomeric electrical contacts
US8673416B2 (en) * 2009-10-28 2014-03-18 Xerox Corporation Multilayer electrical component, coating composition, and method of making electrical component
US8263879B2 (en) * 2009-11-06 2012-09-11 International Business Machines Corporation Axiocentric scrubbing land grid array contacts and methods for fabrication
US8959764B2 (en) 2009-11-06 2015-02-24 International Business Machines Corporation Metallurgical clamshell methods for micro land grid array fabrication
WO2012075356A1 (en) * 2010-12-03 2012-06-07 Ardent Concepts, Inc. Compliant electrical contact and assembly
WO2013070201A1 (en) * 2011-11-09 2013-05-16 Advantest America, Inc. Fine pitch microelectronic contact array and method of making same
US8641428B2 (en) * 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
FR3009445B1 (fr) * 2013-07-31 2017-03-31 Hypertac Sa Organe de contact entre un support et un dispositif et connecteur electrique comprenant un tel organe de contact
US9835653B2 (en) 2014-05-13 2017-12-05 International Business Machines Corporation Solder bump array probe tip structure for laser cleaning
IT201700100522A1 (it) 2017-09-07 2019-03-07 Technoprobe Spa Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione
JP7308660B2 (ja) 2019-05-27 2023-07-14 東京エレクトロン株式会社 中間接続部材及び検査装置
SG10202006996QA (en) * 2019-07-23 2021-02-25 Casey Michael Silicone contact element
US11561243B2 (en) * 2019-09-12 2023-01-24 International Business Machines Corporation Compliant organic substrate assembly for rigid probes
JP7541289B2 (ja) * 2020-10-29 2024-08-28 積水ポリマテック株式会社 導電部材

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KR20010109164A (ko) * 2000-05-31 2001-12-08 가부시키가이샤 어드밴티스트 평면도 조정 기구를 구비하는 프로브 접촉 시스템

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Also Published As

Publication number Publication date
KR20070090927A (ko) 2007-09-06
EP1834379A2 (en) 2007-09-19
KR20070112107A (ko) 2007-11-22
WO2006137896A2 (en) 2006-12-28
EP1834379B1 (en) 2012-07-11
KR100968183B1 (ko) 2010-07-05
WO2007001391A2 (en) 2007-01-04
WO2007001391A3 (en) 2007-12-13
US7452212B2 (en) 2008-11-18
CN101218515B (zh) 2011-08-24
EP1834379A4 (en) 2010-02-24
CN101288205A (zh) 2008-10-15
JP4709850B2 (ja) 2011-06-29
JP5220417B2 (ja) 2013-06-26
US20080094085A1 (en) 2008-04-24
CN101218515A (zh) 2008-07-09
US8054095B2 (en) 2011-11-08
US20070298626A1 (en) 2007-12-27
JP2008524799A (ja) 2008-07-10
JP2008524583A (ja) 2008-07-10
WO2006137896A3 (en) 2008-01-24
CN101288205B (zh) 2011-09-21

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