CN101288205B - 金属化弹性体电学接触 - Google Patents

金属化弹性体电学接触 Download PDF

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Publication number
CN101288205B
CN101288205B CN200580043425XA CN200580043425A CN101288205B CN 101288205 B CN101288205 B CN 101288205B CN 200580043425X A CN200580043425X A CN 200580043425XA CN 200580043425 A CN200580043425 A CN 200580043425A CN 101288205 B CN101288205 B CN 101288205B
Authority
CN
China
Prior art keywords
elastomeric material
carrier
conductive layer
plane
elastomeric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200580043425XA
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English (en)
Chinese (zh)
Other versions
CN101288205A (zh
Inventor
加雷思·G·霍夫阿姆
艾利·阿弗扎利
史蒂文·A·科德斯
保罗·W·科托伊斯
马修·J·法理内利
谢里夫·A·戈玛
奥尔方索·P·兰泽塔
丹尼尔·P·莫里斯
乔安娜·罗斯纳
尼沙·约翰南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Core Usa Second LLC
GlobalFoundries Inc
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of CN101288205A publication Critical patent/CN101288205A/zh
Application granted granted Critical
Publication of CN101288205B publication Critical patent/CN101288205B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Micromachines (AREA)
CN200580043425XA 2004-12-16 2005-09-30 金属化弹性体电学接触 Expired - Fee Related CN101288205B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US63666604P 2004-12-16 2004-12-16
US60/636,666 2004-12-16
PCT/US2005/035324 WO2007001391A2 (en) 2004-12-16 2005-09-30 Metalized elastomeric electrical contacts

Publications (2)

Publication Number Publication Date
CN101288205A CN101288205A (zh) 2008-10-15
CN101288205B true CN101288205B (zh) 2011-09-21

Family

ID=37570885

Family Applications (2)

Application Number Title Priority Date Filing Date
CN200580043425XA Expired - Fee Related CN101288205B (zh) 2004-12-16 2005-09-30 金属化弹性体电学接触
CN2005800434245A Expired - Fee Related CN101218515B (zh) 2004-12-16 2005-09-30 金属化弹性探针结构

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2005800434245A Expired - Fee Related CN101218515B (zh) 2004-12-16 2005-09-30 金属化弹性探针结构

Country Status (6)

Country Link
US (2) US7452212B2 (enExample)
EP (1) EP1834379B1 (enExample)
JP (2) JP5220417B2 (enExample)
KR (2) KR100968184B1 (enExample)
CN (2) CN101288205B (enExample)
WO (2) WO2007001391A2 (enExample)

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US7452212B2 (en) 2004-12-16 2008-11-18 International Business Machines Corporation Metalized elastomeric electrical contacts
TWI275187B (en) * 2005-11-30 2007-03-01 Advanced Semiconductor Eng Flip chip package and manufacturing method of the same
US7585173B2 (en) * 2007-03-30 2009-09-08 Tyco Electronics Corporation Elastomeric electrical contact
US8832936B2 (en) * 2007-04-30 2014-09-16 International Business Machines Corporation Method of forming metallized elastomeric electrical contacts
US8673416B2 (en) * 2009-10-28 2014-03-18 Xerox Corporation Multilayer electrical component, coating composition, and method of making electrical component
US8263879B2 (en) * 2009-11-06 2012-09-11 International Business Machines Corporation Axiocentric scrubbing land grid array contacts and methods for fabrication
US8959764B2 (en) 2009-11-06 2015-02-24 International Business Machines Corporation Metallurgical clamshell methods for micro land grid array fabrication
WO2012075356A1 (en) * 2010-12-03 2012-06-07 Ardent Concepts, Inc. Compliant electrical contact and assembly
WO2013070201A1 (en) * 2011-11-09 2013-05-16 Advantest America, Inc. Fine pitch microelectronic contact array and method of making same
US8641428B2 (en) * 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
FR3009445B1 (fr) * 2013-07-31 2017-03-31 Hypertac Sa Organe de contact entre un support et un dispositif et connecteur electrique comprenant un tel organe de contact
US9835653B2 (en) 2014-05-13 2017-12-05 International Business Machines Corporation Solder bump array probe tip structure for laser cleaning
IT201700100522A1 (it) 2017-09-07 2019-03-07 Technoprobe Spa Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione
JP7308660B2 (ja) 2019-05-27 2023-07-14 東京エレクトロン株式会社 中間接続部材及び検査装置
SG10202006996QA (en) * 2019-07-23 2021-02-25 Casey Michael Silicone contact element
US11561243B2 (en) * 2019-09-12 2023-01-24 International Business Machines Corporation Compliant organic substrate assembly for rigid probes
JP7541289B2 (ja) * 2020-10-29 2024-08-28 積水ポリマテック株式会社 導電部材

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US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPS63208237A (ja) * 1987-02-25 1988-08-29 Hitachi Ltd 半導体装置の測定装置
US5071359A (en) 1990-04-27 1991-12-10 Rogers Corporation Array connector
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Also Published As

Publication number Publication date
KR20070090927A (ko) 2007-09-06
EP1834379A2 (en) 2007-09-19
KR20070112107A (ko) 2007-11-22
WO2006137896A2 (en) 2006-12-28
EP1834379B1 (en) 2012-07-11
KR100968183B1 (ko) 2010-07-05
WO2007001391A2 (en) 2007-01-04
WO2007001391A3 (en) 2007-12-13
US7452212B2 (en) 2008-11-18
CN101218515B (zh) 2011-08-24
EP1834379A4 (en) 2010-02-24
CN101288205A (zh) 2008-10-15
JP4709850B2 (ja) 2011-06-29
JP5220417B2 (ja) 2013-06-26
US20080094085A1 (en) 2008-04-24
CN101218515A (zh) 2008-07-09
US8054095B2 (en) 2011-11-08
US20070298626A1 (en) 2007-12-27
JP2008524799A (ja) 2008-07-10
JP2008524583A (ja) 2008-07-10
KR100968184B1 (ko) 2010-07-05
WO2006137896A3 (en) 2008-01-24

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20171211

Address after: Grand Cayman, Cayman Islands

Patentee after: GLOBALFOUNDRIES INC.

Address before: American New York

Patentee before: Core USA second LLC

Effective date of registration: 20171211

Address after: American New York

Patentee after: Core USA second LLC

Address before: New York grams of Armand

Patentee before: International Business Machines Corp.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110921

Termination date: 20190930

CF01 Termination of patent right due to non-payment of annual fee