JP5220417B2 - メタライズ・エラストマ・プローブ構造体 - Google Patents

メタライズ・エラストマ・プローブ構造体 Download PDF

Info

Publication number
JP5220417B2
JP5220417B2 JP2007546647A JP2007546647A JP5220417B2 JP 5220417 B2 JP5220417 B2 JP 5220417B2 JP 2007546647 A JP2007546647 A JP 2007546647A JP 2007546647 A JP2007546647 A JP 2007546647A JP 5220417 B2 JP5220417 B2 JP 5220417B2
Authority
JP
Japan
Prior art keywords
carrier
elastomeric material
conductive layer
elastomeric
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007546647A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008524583A5 (enExample
JP2008524583A (ja
Inventor
ホーハム、ガレス、ジェフリー
アフザリ、アリ
コーデス、スティーブン、アレン
コートイス、ポール、ダブリュー
ファリネリ、マシュー、ジェイ
ゴーマ、シェリフ、エー
ランゼッタ、アルフォンソ、ピー
モリス、ダニエル、ピーター
ロスナー、ジョアンナ
ヨハンナン、ニシャ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JP2008524583A publication Critical patent/JP2008524583A/ja
Publication of JP2008524583A5 publication Critical patent/JP2008524583A5/ja
Application granted granted Critical
Publication of JP5220417B2 publication Critical patent/JP5220417B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Micromachines (AREA)
JP2007546647A 2004-12-16 2005-09-30 メタライズ・エラストマ・プローブ構造体 Expired - Fee Related JP5220417B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US63666604P 2004-12-16 2004-12-16
US60/636,666 2004-12-16
PCT/US2005/035322 WO2006137896A2 (en) 2004-12-16 2005-09-30 Metalized elastomeric probe structure

Publications (3)

Publication Number Publication Date
JP2008524583A JP2008524583A (ja) 2008-07-10
JP2008524583A5 JP2008524583A5 (enExample) 2008-08-21
JP5220417B2 true JP5220417B2 (ja) 2013-06-26

Family

ID=37570885

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007546647A Expired - Fee Related JP5220417B2 (ja) 2004-12-16 2005-09-30 メタライズ・エラストマ・プローブ構造体
JP2007546648A Expired - Fee Related JP4709850B2 (ja) 2004-12-16 2005-09-30 電気的接続デバイス及びこれの製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2007546648A Expired - Fee Related JP4709850B2 (ja) 2004-12-16 2005-09-30 電気的接続デバイス及びこれの製造方法

Country Status (6)

Country Link
US (2) US7452212B2 (enExample)
EP (1) EP1834379B1 (enExample)
JP (2) JP5220417B2 (enExample)
KR (2) KR100968184B1 (enExample)
CN (2) CN101288205B (enExample)
WO (2) WO2007001391A2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7771208B2 (en) * 2004-12-16 2010-08-10 International Business Machines Corporation Metalized elastomeric electrical contacts
US7452212B2 (en) 2004-12-16 2008-11-18 International Business Machines Corporation Metalized elastomeric electrical contacts
TWI275187B (en) * 2005-11-30 2007-03-01 Advanced Semiconductor Eng Flip chip package and manufacturing method of the same
US7585173B2 (en) * 2007-03-30 2009-09-08 Tyco Electronics Corporation Elastomeric electrical contact
US8832936B2 (en) * 2007-04-30 2014-09-16 International Business Machines Corporation Method of forming metallized elastomeric electrical contacts
US8673416B2 (en) * 2009-10-28 2014-03-18 Xerox Corporation Multilayer electrical component, coating composition, and method of making electrical component
US8263879B2 (en) * 2009-11-06 2012-09-11 International Business Machines Corporation Axiocentric scrubbing land grid array contacts and methods for fabrication
US8959764B2 (en) 2009-11-06 2015-02-24 International Business Machines Corporation Metallurgical clamshell methods for micro land grid array fabrication
WO2012075356A1 (en) * 2010-12-03 2012-06-07 Ardent Concepts, Inc. Compliant electrical contact and assembly
WO2013070201A1 (en) * 2011-11-09 2013-05-16 Advantest America, Inc. Fine pitch microelectronic contact array and method of making same
US8641428B2 (en) * 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
FR3009445B1 (fr) * 2013-07-31 2017-03-31 Hypertac Sa Organe de contact entre un support et un dispositif et connecteur electrique comprenant un tel organe de contact
US9835653B2 (en) 2014-05-13 2017-12-05 International Business Machines Corporation Solder bump array probe tip structure for laser cleaning
IT201700100522A1 (it) 2017-09-07 2019-03-07 Technoprobe Spa Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione
JP7308660B2 (ja) 2019-05-27 2023-07-14 東京エレクトロン株式会社 中間接続部材及び検査装置
SG10202006996QA (en) * 2019-07-23 2021-02-25 Casey Michael Silicone contact element
US11561243B2 (en) * 2019-09-12 2023-01-24 International Business Machines Corporation Compliant organic substrate assembly for rigid probes
JP7541289B2 (ja) * 2020-10-29 2024-08-28 積水ポリマテック株式会社 導電部材

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPS63208237A (ja) * 1987-02-25 1988-08-29 Hitachi Ltd 半導体装置の測定装置
US5071359A (en) 1990-04-27 1991-12-10 Rogers Corporation Array connector
JPH0826231B2 (ja) 1991-08-16 1996-03-13 インターナショナル・ビジネス・マシーンズ・コーポレイション 導電性ポリマー材料及びその使用
US5244143A (en) 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
US5371654A (en) 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US6295729B1 (en) 1992-10-19 2001-10-02 International Business Machines Corporation Angled flying lead wire bonding process
US6329827B1 (en) 1997-10-07 2001-12-11 International Business Machines Corporation High density cantilevered probe for electronic devices
US6054651A (en) 1996-06-21 2000-04-25 International Business Machines Corporation Foamed elastomers for wafer probing applications and interposer connectors
US5810607A (en) 1995-09-13 1998-09-22 International Business Machines Corporation Interconnector with contact pads having enhanced durability
JPH0737633A (ja) * 1993-07-14 1995-02-07 Whitaker Corp:The エラストマコネクタ
US6336269B1 (en) 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5590460A (en) * 1994-07-19 1997-01-07 Tessera, Inc. Method of making multilayer circuit
US5599193A (en) * 1994-08-23 1997-02-04 Augat Inc. Resilient electrical interconnect
US5700398A (en) 1994-12-14 1997-12-23 International Business Machines Corporation Composition containing a polymer and conductive filler and use thereof
DE19605661A1 (de) 1995-02-24 1996-08-29 Whitaker Corp Elektrisches Verbinderbauteil zur Herstellung einer elektrischen Verbindung zwischen leitfähigen Flächen
JPH08287983A (ja) * 1995-04-14 1996-11-01 Whitaker Corp:The エラストマコネクタ
US5785538A (en) 1995-11-27 1998-07-28 International Business Machines Corporation High density test probe with rigid surface structure
US5632626A (en) * 1996-01-05 1997-05-27 The Whitaker Corporation Retention of elastomeric connector in a housing
JP2000502812A (ja) 1996-09-13 2000-03-07 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン ウエハ・レベルのテストおよびバーンインのための集積化コンプライアント・プローブ
EP0925509B1 (en) 1996-09-13 2005-09-07 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips
WO1998011449A1 (en) 1996-09-13 1998-03-19 International Business Machines Corporation Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
US6104201A (en) 1996-11-08 2000-08-15 International Business Machines Corporation Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage
US6329829B1 (en) * 1997-08-22 2001-12-11 Micron Technology, Inc. Interconnect and system for making temporary electrical connections to semiconductor components
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6146151A (en) * 1999-08-18 2000-11-14 Hon Hai Precision Ind. Co., Ltd. Method for forming an electrical connector and an electrical connector obtained by the method
US6442039B1 (en) * 1999-12-03 2002-08-27 Delphi Technologies, Inc. Metallic microstructure springs and method of making same
US6264476B1 (en) * 1999-12-09 2001-07-24 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
US6586955B2 (en) * 2000-03-13 2003-07-01 Tessera, Inc. Methods and structures for electronic probing arrays
US6441629B1 (en) * 2000-05-31 2002-08-27 Advantest Corp Probe contact system having planarity adjustment mechanism
JP3921163B2 (ja) * 2000-09-26 2007-05-30 株式会社アドバンストシステムズジャパン スパイラルコンタクタ及びその製造方法、並びにそれを用いた半導体検査装置、及び電子部品
US7083436B2 (en) 2001-03-06 2006-08-01 International Business Machines Corporation Particle distribution interposer and method of manufacture thereof
US6425518B1 (en) 2001-07-25 2002-07-30 International Business Machines Corporation Method and apparatus for applying solder to an element on a substrate
JP2003142537A (ja) * 2001-11-01 2003-05-16 Hitachi Ltd 半導体装置の検査装置
US6712621B2 (en) * 2002-01-23 2004-03-30 High Connection Density, Inc. Thermally enhanced interposer and method
US20030186572A1 (en) * 2002-04-01 2003-10-02 Hougham Gareth Geoffrey Self compensating design for elastomer interconnects
US6854981B2 (en) * 2002-06-03 2005-02-15 Johnstech International Corporation Small pin connecters
JP4215468B2 (ja) * 2002-08-26 2009-01-28 信越ポリマー株式会社 電気コネクタ
US6838894B2 (en) 2002-09-03 2005-01-04 Macintyre Donald M. Stress relieved contact array
US6881072B2 (en) * 2002-10-01 2005-04-19 International Business Machines Corporation Membrane probe with anchored elements
ATE447248T1 (de) * 2002-10-24 2009-11-15 Ibm Herstellung eines land grid array mittels elastomerkern und leitender metallhülle oder - gitter
JP3978174B2 (ja) 2003-03-07 2007-09-19 北川工業株式会社 コンタクト
US7491892B2 (en) * 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
US6948940B2 (en) 2003-04-10 2005-09-27 Formfactor, Inc. Helical microelectronic contact and method for fabricating same
US7137827B2 (en) 2003-11-17 2006-11-21 International Business Machines Corporation Interposer with electrical contact button and method
US7172431B2 (en) 2004-08-27 2007-02-06 International Business Machines Corporation Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof
US7021941B1 (en) 2004-10-19 2006-04-04 Speed Tech Corp. Flexible land grid array connector
US7452212B2 (en) * 2004-12-16 2008-11-18 International Business Machines Corporation Metalized elastomeric electrical contacts

Also Published As

Publication number Publication date
KR20070090927A (ko) 2007-09-06
EP1834379A2 (en) 2007-09-19
KR20070112107A (ko) 2007-11-22
WO2006137896A2 (en) 2006-12-28
EP1834379B1 (en) 2012-07-11
KR100968183B1 (ko) 2010-07-05
WO2007001391A2 (en) 2007-01-04
WO2007001391A3 (en) 2007-12-13
US7452212B2 (en) 2008-11-18
CN101218515B (zh) 2011-08-24
EP1834379A4 (en) 2010-02-24
CN101288205A (zh) 2008-10-15
JP4709850B2 (ja) 2011-06-29
US20080094085A1 (en) 2008-04-24
CN101218515A (zh) 2008-07-09
US8054095B2 (en) 2011-11-08
US20070298626A1 (en) 2007-12-27
JP2008524799A (ja) 2008-07-10
JP2008524583A (ja) 2008-07-10
KR100968184B1 (ko) 2010-07-05
WO2006137896A3 (en) 2008-01-24
CN101288205B (zh) 2011-09-21

Similar Documents

Publication Publication Date Title
JP5220417B2 (ja) メタライズ・エラストマ・プローブ構造体
US6576485B2 (en) Contact structure and production method thereof and probe contact assembly using same
US6504223B1 (en) Contact structure and production method thereof and probe contact assembly using same
CN101625375B (zh) 探针卡及其组装方法
US6471538B2 (en) Contact structure and production method thereof and probe contact assembly using same
US6750136B2 (en) Contact structure production method
KR20090108608A (ko) 회전형 접촉 요소 및 이 회전형 접촉 요소의 제조 방법
CN1745307A (zh) 一用于测试集成电路的插座的制作方法及所述插座
KR20060087616A (ko) 스페이스 트랜스포머 조립체
JP2002520864A (ja) プリント回路基板用相互接続アセンブリ及び製造方法
JP2002116224A (ja) 多重チッププローブおよび汎用テスター接点組み合わせ部材およびその製造方法
US20110043238A1 (en) Method of manufacturing needle for probe card using fine processing technology, needle manufactured by the method and probe card comprising the needle
WO2003048788A1 (en) Contact structure and production method thereof and probe contact assembly using same
US7771208B2 (en) Metalized elastomeric electrical contacts
US20020048973A1 (en) Contact structure and production method thereof and probe contact assembly using same
US8832936B2 (en) Method of forming metallized elastomeric electrical contacts

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080627

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080627

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110419

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110711

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120403

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120702

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130212

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130306

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160315

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees