KR100940958B1 - 웨이퍼 트랜스포트 장치 - Google Patents

웨이퍼 트랜스포트 장치 Download PDF

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Publication number
KR100940958B1
KR100940958B1 KR1020047000473A KR20047000473A KR100940958B1 KR 100940958 B1 KR100940958 B1 KR 100940958B1 KR 1020047000473 A KR1020047000473 A KR 1020047000473A KR 20047000473 A KR20047000473 A KR 20047000473A KR 100940958 B1 KR100940958 B1 KR 100940958B1
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KR
South Korea
Prior art keywords
arm
chamber
link
cam
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020047000473A
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English (en)
Korean (ko)
Other versions
KR20040015805A (ko
Inventor
키나드데이비드
리차드슨다니엘
Original Assignee
액셀리스 테크놀로지스, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 액셀리스 테크놀로지스, 인크. filed Critical 액셀리스 테크놀로지스, 인크.
Publication of KR20040015805A publication Critical patent/KR20040015805A/ko
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Publication of KR100940958B1 publication Critical patent/KR100940958B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/0093—Program-controlled manipulators co-operating with conveyor means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020047000473A 2001-07-13 2002-07-12 웨이퍼 트랜스포트 장치 Expired - Fee Related KR100940958B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/905,031 US6663333B2 (en) 2001-07-13 2001-07-13 Wafer transport apparatus
US09/905,031 2001-07-13
PCT/US2002/023233 WO2003007340A2 (en) 2001-07-13 2002-07-12 Wafer transport apparatus

Publications (2)

Publication Number Publication Date
KR20040015805A KR20040015805A (ko) 2004-02-19
KR100940958B1 true KR100940958B1 (ko) 2010-02-05

Family

ID=25420193

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047000473A Expired - Fee Related KR100940958B1 (ko) 2001-07-13 2002-07-12 웨이퍼 트랜스포트 장치

Country Status (8)

Country Link
US (3) US6663333B2 (https=)
EP (1) EP1407479A2 (https=)
JP (1) JP4352233B2 (https=)
KR (1) KR100940958B1 (https=)
CN (1) CN1320595C (https=)
AU (1) AU2002354691A1 (https=)
TW (1) TW559863B (https=)
WO (1) WO2003007340A2 (https=)

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US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
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US7246985B2 (en) * 2004-04-16 2007-07-24 Axcelis Technologies, Inc. Work-piece processing system
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CN1778986B (zh) * 2004-06-02 2015-08-19 应用材料公司 用于密封腔室的方法和装置
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CN103199039B (zh) * 2004-06-02 2016-01-13 应用材料公司 电子装置制造室及其形成方法
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CN110556263B (zh) * 2019-08-31 2024-08-27 武汉倍诺德开关有限公司 一种40.5kV充气柜传动机构
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Also Published As

Publication number Publication date
TW559863B (en) 2003-11-01
CN1320595C (zh) 2007-06-06
CN1554112A (zh) 2004-12-08
US20040076505A1 (en) 2004-04-22
EP1407479A2 (en) 2004-04-14
JP4352233B2 (ja) 2009-10-28
US6877946B2 (en) 2005-04-12
US20040052632A1 (en) 2004-03-18
JP2004535674A (ja) 2004-11-25
WO2003007340A3 (en) 2003-11-27
US6663333B2 (en) 2003-12-16
KR20040015805A (ko) 2004-02-19
US6969227B2 (en) 2005-11-29
WO2003007340A2 (en) 2003-01-23
US20030012624A1 (en) 2003-01-16
AU2002354691A1 (en) 2003-01-29

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