KR100937298B1 - 전자부품의 외부전극 형성 방법 및 전자부품 - Google Patents

전자부품의 외부전극 형성 방법 및 전자부품 Download PDF

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Publication number
KR100937298B1
KR100937298B1 KR1020040016918A KR20040016918A KR100937298B1 KR 100937298 B1 KR100937298 B1 KR 100937298B1 KR 1020040016918 A KR1020040016918 A KR 1020040016918A KR 20040016918 A KR20040016918 A KR 20040016918A KR 100937298 B1 KR100937298 B1 KR 100937298B1
Authority
KR
South Korea
Prior art keywords
copper
plating
film
bath
electrolytic
Prior art date
Application number
KR1020040016918A
Other languages
English (en)
Korean (ko)
Other versions
KR20040081063A (ko
Inventor
이시하라쇼지
츠즈키기요시
이시이야스유키
Original Assignee
다이요 가가쿠 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 가가쿠 고교 가부시키가이샤 filed Critical 다이요 가가쿠 고교 가부시키가이샤
Publication of KR20040081063A publication Critical patent/KR20040081063A/ko
Application granted granted Critical
Publication of KR100937298B1 publication Critical patent/KR100937298B1/ko

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
    • E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
    • E02B15/08—Devices for reducing the polluted area with or without additional devices for removing the material
    • E02B15/0814—Devices for reducing the polluted area with or without additional devices for removing the material with underwater curtains
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
    • E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
    • E02B15/06—Barriers therefor construed for applying processing agents or for collecting pollutants, e.g. absorbent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
    • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
    • B63B22/00—Buoys
    • B63B22/18—Buoys having means to control attitude or position, e.g. reaction surfaces or tether
    • B63B22/20—Ballast means
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
    • E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
    • E02B15/08—Devices for reducing the polluted area with or without additional devices for removing the material
    • E02B15/085—Details of connectors
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/20—Miscellaneous comprising details of connection between elements
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/30—Miscellaneous comprising anchoring details
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D5/00—Bulkheads, piles, or other structural elements specially adapted to foundation engineering
    • E02D5/74—Means for anchoring structural elements or bulkheads
    • E02D5/80—Ground anchors

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020040016918A 2003-03-11 2004-03-12 전자부품의 외부전극 형성 방법 및 전자부품 KR100937298B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003065062A JP4544825B2 (ja) 2003-03-11 2003-03-11 電子部品の外部電極形成方法
JPJP-P-2003-00065062 2003-03-14

Publications (2)

Publication Number Publication Date
KR20040081063A KR20040081063A (ko) 2004-09-20
KR100937298B1 true KR100937298B1 (ko) 2010-01-18

Family

ID=33126184

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040016918A KR100937298B1 (ko) 2003-03-11 2004-03-12 전자부품의 외부전극 형성 방법 및 전자부품

Country Status (5)

Country Link
JP (1) JP4544825B2 (zh)
KR (1) KR100937298B1 (zh)
CN (1) CN100477031C (zh)
HK (1) HK1071804A1 (zh)
MY (1) MY139649A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006269829A (ja) * 2005-03-24 2006-10-05 Kyocera Corp セラミック電子部品
JP5899609B2 (ja) * 2010-08-06 2016-04-06 株式会社村田製作所 積層セラミックコンデンサおよびその製造方法
KR20130037485A (ko) * 2011-10-06 2013-04-16 삼성전기주식회사 적층 세라믹 커패시터 및 이의 제조방법
US10933679B2 (en) * 2017-03-27 2021-03-02 Taiyo Yuden Co., Ltd. Screen printing plate and manufacturing method of electronic component
CN112342584A (zh) * 2020-09-29 2021-02-09 扬州市景杨表面工程有限公司 一种心脏起搏器电容器件无磁化铜锡电镀工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09186161A (ja) * 1995-12-27 1997-07-15 Fujitsu Ltd 半導体装置のはんだバンプ形成方法
KR20000003052A (ko) 1998-06-25 2000-01-15 이형도 칩부품의 외부전극 형성방법
KR100277382B1 (ko) * 1995-08-18 2001-01-15 사토 히로시 다층전자부품

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100277382B1 (ko) * 1995-08-18 2001-01-15 사토 히로시 다층전자부품
JPH09186161A (ja) * 1995-12-27 1997-07-15 Fujitsu Ltd 半導体装置のはんだバンプ形成方法
KR20000003052A (ko) 1998-06-25 2000-01-15 이형도 칩부품의 외부전극 형성방법

Also Published As

Publication number Publication date
CN100477031C (zh) 2009-04-08
MY139649A (en) 2009-10-30
KR20040081063A (ko) 2004-09-20
JP2004273919A (ja) 2004-09-30
HK1071804A1 (en) 2005-07-29
JP4544825B2 (ja) 2010-09-15
CN1551259A (zh) 2004-12-01

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